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Texas Instruments Incorporated (TXN) is a global leader in analog and embedded processing semiconductor solutions powering industrial, automotive, and consumer electronics. This dedicated news hub provides investors and professionals with centralized access to official TXN announcements and strategic developments.
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Texas Instruments (TI) has introduced six new power modules featuring proprietary MagPack integrated magnetic packaging technology. These modules offer improved power density, enhanced efficiency, and reduced EMI, with sizes up to 23% smaller than competing modules. Three of the new devices - TPSM82866A, TPSM82866C, and TPSM82816 - are the industry's smallest 6A power modules, providing a power density of nearly 1A per 1mm² of area.
The MagPack technology combines a power chip with a transformer or inductor in one package, utilizing a 3D package molding process to maximize power output in a smaller space. This innovation is particularly significant for applications like data centers, where power consumption is a critical factor. The new power modules are now available for purchase on TI.com, with evaluation modules starting at $49.
Texas Instruments (TI) announced that it will webcast its Q2 2024 earnings conference call on July 23 at 3:30 p.m. Central time. Key executives including CEO Haviv Ilan, CFO Rafael Lizardi, and VP of Investor Relations Dave Pahl will discuss the company's financial results and take questions from investors. The webcast can be accessed on the Investor Relations section of TI's website, with an archived copy available post-event.
Texas Instruments (Nasdaq: TXN) and Delta Electronics have announced a collaboration aimed at advancing electric vehicle (EV) onboard charging and power solutions. The partnership will leverage both companies' R&D capabilities in a joint innovation lab in Pingzhen, Taiwan, to optimize power density, performance, and size, aiming to make EVs safer, faster-charging, and more affordable. This initiative is part of a three-phase development program, starting with a lightweight, cost-effective 11kW onboard charger that achieves up to 95% power conversion efficiency using TI’s C2000 real-time microcontrollers and active EMI filter products. Subsequent phases will focus on achieving higher automotive safety standards and developing next-gen automotive power solutions using GaN technology.
Texas Instruments (TI) (Nasdaq: TXN) has introduced the industry's first 650V three-phase GaN integrated power module (IPM), the DRV7308, for 250W motor drive applications. The DRV7308 offers over 99% inverter efficiency, optimized acoustic performance, reduced solution size, and lower system costs. It supports high energy-efficiency standards and reduces power losses by 50% compared to existing solutions. The DRV7308 is displayed at the PCIM Conference in Nuremberg, Germany, from June 11-13, 2024. Available for purchase on TI.com, the module costs $5.50 in 1,000-unit quantities and is packaged in a 12mm-by-12mm QFN package.
Texas Instruments (Nasdaq: TXN) Senior Vice President and CFO Rafael Lizardi will speak at the Bank of America 2024 Global Technology Conference in San Francisco on June 5, at 3:20 p.m. Pacific time.
He will address analysts and investors on TI's business outlook, strategies for key markets in analog and embedded processing technologies, and growth positioning.
The conference will be webcast live on TI’s Investor Relations website, with an archived replay available after the event.
TI CEO Haviv Ilan will be speaking at the Bernstein 40th Annual Strategic Decisions Conference in New York City, discussing TI's business outlook and strategy for growth in key markets. The event will take place on May 30 at 10 a.m. Eastern time, with an audio webcast accessible through TI's Investor Relations section.
