Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona
Amkor Technology (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) have signed a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona. Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor's planned facility in Peoria, Arizona, supporting TSMC's customers using its advanced wafer fabrication facilities in Phoenix.
The collaboration aims to accelerate product cycle times and address customer needs for geographic flexibility in manufacturing. The companies will jointly define specific packaging technologies, including TSMC's Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®). This partnership supports the development of a comprehensive semiconductor manufacturing ecosystem in the United States and enables seamless technology alignment for customers across a global manufacturing network.
Amkor Technology (Nasdaq: AMKR) e TSMC (TWSE: 2330, NYSE: TSM) hanno firmato un memorandum d'intesa per collaborare su capacità avanzate di packaging e test in Arizona. Secondo l'accordo, TSMC contratterà servizi chiavi in mano di packaging avanzato e test presso la struttura pianificata di Amkor a Peoria, Arizona, supportando i clienti di TSMC che utilizzano le sue strutture avanzate di fabbricazione di wafer a Phoenix.
La collaborazione mira a accelerare i tempi del ciclo di prodotto e a soddisfare le esigenze dei clienti in termini di flessibilità geografica nella produzione. Le aziende definiranno congiuntamente tecnologie di packaging specifiche, inclusi l'Integrated Fan-Out (InFO) di TSMC e Chip on Wafer on Substrate (CoWoS®). Questa partnership supporta lo sviluppo di un ecosistema completo di produzione di semiconduttori negli Stati Uniti e consente un allineamento tecnologico senza soluzione di continuità per i clienti all'interno di una rete di produzione globale.
Amkor Technology (Nasdaq: AMKR) y TSMC (TWSE: 2330, NYSE: TSM) han firmado un memorando de entendimiento para colaborar en capacidades avanzadas de empaque y pruebas en Arizona. Según el acuerdo, TSMC contratará servicios de empaque y prueba avanzados llave en mano de la instalación prevista de Amkor en Peoria, Arizona, apoyando a los clientes de TSMC que utilizan sus instalaciones avanzadas de fabricación de obleas en Phoenix.
La colaboración tiene como objetivo acelerar los tiempos de ciclo de producto y abordar las necesidades de los clientes en cuanto a flexibilidad geográfica en la fabricación. Las empresas definirán conjuntamente tecnologías de empaque específicas, incluyendo el Integrated Fan-Out (InFO) de TSMC y Chip on Wafer on Substrate (CoWoS®). Esta asociación apoya el desarrollo de un ecosistema completo de fabricación de semiconductores en los Estados Unidos y permite una alineación tecnológica fluida para los clientes a lo largo de una red de fabricación global.
암코어 테크놀로지(Nasdaq: AMKR)와 TSMC(TWSE: 2330, NYSE: TSM)는 애리조나 주의 첨단 패키징 및 테스트 기능 협력에 관한 양해각서를 체결했습니다. 이 협정에 따라 TSMC는 암코어가 계획 중인 애리조나 주 피오리아의 시설에서 턴키 첨단 패키징 및 테스트 서비스를 계약할 것입니다. 이는 피닉스에 있는 TSMC의 첨단 웨이퍼 제조 시설을 사용하는 고객을 지원합니다.
이 협력의 목표는 제품 사이클 시간을 가속화하는 것과 제조에서 지리적 유연성에 대한 고객의 요구를 충족하는 것입니다. 양사는 TSMC의 집적 팬 아웃(InFO) 및 칩 온 웨이퍼 온 서브스트레이트(CoWoS®)를 포함한 특정 패키징 기술을 공동으로 정의할 것입니다. 이 파트너십은 미국에서의 종합 반도체 제조 생태계 개발을 지원하며, 글로벌 제조 네트워크 전반에 걸쳐 고객을 위한 원활한 기술 정렬을 가능하게 합니다.
Amkor Technology (Nasdaq: AMKR) et TSMC (TWSE: 2330, NYSE: TSM) ont signé un protocole d'accord pour collaborer sur les capacités de packaging et de test avancés en Arizona. Selon l'accord, TSMC commandera des services de packaging et de test avancés clés en main auprès de l'installation prévue d'Amkor à Peoria, Arizona, soutenant les clients de TSMC utilisant ses installations avancées de fabrication de wafers à Phoenix.
La collaboration vise à accélérer les temps de cycle des produits et à répondre aux besoins des clients en matière de flexibilité géographique dans la fabrication. Les entreprises définiront conjointement des technologies de packaging spécifiques, y compris l'Integrated Fan-Out (InFO) de TSMC et Chip on Wafer on Substrate (CoWoS®). Ce partenariat soutient le développement d'un écosystème complet de fabrication de semi-conducteurs aux États-Unis et permet un alignement technologique fluide pour les clients au sein d'un réseau de fabrication mondial.
Amkor Technology (Nasdaq: AMKR) und TSMC (TWSE: 2330, NYSE: TSM) haben ein Memorandum of Understanding unterzeichnet, um in Arizona an fortschrittlichen Verpackungs- und Testfähigkeiten zusammenzuarbeiten. Im Rahmen des Abkommens wird TSMC schlüsselfertige fortschrittliche Verpackungs- und Testdienstleistungen von Amkors geplanter Einrichtung in Peoria, Arizona, in Anspruch nehmen, um TSMCs Kunden, die die fortschrittlichen Wafer-Fabrikationsanlagen in Phoenix nutzen, zu unterstützen.
Das Ziel der Zusammenarbeit ist es, Produktzykluszeiten zu beschleunigen und die Anforderungen der Kunden an geografische Flexibilität in der Produktion zu erfüllen. Die Unternehmen werden gemeinsam spezifische Verpackungstechnologien definieren, einschließlich TSMCs Integrated Fan-Out (InFO) und Chip on Wafer on Substrate (CoWoS®). Diese Partnerschaft unterstützt die Entwicklung eines umfassenden Halbleiterfertigungsecosystems in den Vereinigten Staaten und ermöglicht eine nahtlose technologische Abstimmung für Kunden in einem globalen Fertigungsnetzwerk.
- Expansion of advanced packaging and test capabilities in Arizona
- Collaboration with industry leader TSMC
- Potential for accelerated product cycle times
- Addressing customer needs for geographic flexibility in manufacturing
- Strengthening Amkor's position in the US semiconductor ecosystem
- None.
Insights
This collaboration between Amkor and TSMC is a significant development for the U.S. semiconductor industry. By bringing advanced packaging and test capabilities to Arizona, they're creating a more comprehensive semiconductor ecosystem in the region. This move aligns with the growing trend of "nearshoring" in the chip industry, driven by geopolitical tensions and supply chain concerns.
The partnership will likely enhance the competitiveness of both companies in the U.S. market. For Amkor, this represents a major opportunity to expand its high-end packaging services and potentially capture more business from TSMC's customers. For TSMC, it streamlines their supply chain and could lead to faster time-to-market for their products.
Investors should note the potential for increased revenue and market share for Amkor, as well as the strengthening of its strategic position in advanced packaging. However, the capital expenditure required for the new facility in Peoria could impact short-term financials. Long-term, this collaboration could position Amkor as a key player in the U.S. semiconductor manufacturing renaissance.
This partnership between Amkor and TSMC is a strategic move to create a more resilient and localized semiconductor supply chain in the United States. By co-locating advanced packaging and testing facilities near TSMC's wafer fabrication plants in Phoenix, the companies are significantly reducing logistical complexities and potential disruptions.
The collaboration addresses several key supply chain challenges:
- Reduced lead times and transportation costs
- Improved inventory management
- Enhanced responsiveness to market demands
- Mitigation of geopolitical risks associated with global supply chains
This localized ecosystem could provide a competitive advantage in serving U.S.-based customers, particularly in critical sectors like high-performance computing and communications. For investors, this signals a potential for more stable and predictable operations, which could translate to more consistent financial performance for Amkor in the long run.
Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance computing and communications. Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor in their planned facility in
The companies will jointly define the specific packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS®) that will be employed to address common customers’ needs.
The agreement underscores the shared commitment to supporting customer requirements for geographic flexibility in front-end and back-end manufacturing, as well as fostering the development of a vibrant and comprehensive semiconductor manufacturing ecosystem in
"Amkor is proud to collaborate with TSMC to provide seamless integration of silicon manufacturing and packaging processes through an efficient turnkey advanced packaging and test business model in the United States,” said Giel Rutten, Amkor’s president and chief executive officer. “This expanded partnership underscores our commitment to driving innovation and advancing semiconductor technology while ensuring resilient supply chains."
“Our customers are increasingly depending on advanced packaging technologies for their breakthroughs in advanced mobile applications, artificial intelligence and high-performance computing, and TSMC is pleased to work side by side with a trusted longtime strategic partner in Amkor to support them with a more diverse manufacturing footprint,” said Dr. Kevin Zhang, TSMC’s Senior Vice President of Business Development and Global Sales, and Deputy Co-COO. “We look forward to close collaboration with Amkor at their
About Amkor
Amkor Technology, Inc. is the world's largest US headquartered OSAT (outsourced semiconductor assembly and test) service provider. Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey manufacturing services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor's operational base includes production facilities, research and development centers, and sales and support offices located in key electronics manufacturing regions in
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning
TSMC deployed 288 distinct process technologies, and manufactured 11,895 products for 528 customers in 2023 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu,
Forward-Looking Statement Disclaimer
This press release contains forward-looking statements within the meaning of the federal securities laws, including statements about technology transfers, growth and the completion of Amkor’s planned facility in
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FAQ
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