Transphorm Introduces Six SuperGaN FETs Pin-to-Pin Compatible With e-mode Devices
Transphorm, Inc. (TGAN) has launched six new surface mount devices (SMDs) in Industry Standard PQFN packages. These devices leverage Transphorm’s SuperGaN® d-mode technology, providing higher performance and reliability compared to competitive e-mode GaN solutions. The new SMDs serve as easy drop-in replacements and offer significant thermal management benefits, resulting in longer device lifetimes. They are ideal for applications in datacom, industrial systems, and power adapters. According to Philip Zuk, the Senior VP of Business Development, the introduction cements Transphorm’s low-power strategy, expanding its GaN product portfolio. The devices are currently available for sampling.
- Launch of six new SMDs in Industry Standard PQFN packages enhances product portfolio.
- SuperGaN d-mode technology offers higher performance and lower conduction losses.
- New devices provide significant thermal management, leading to longer device lifetimes.
- Easily replace existing e-mode solutions, improving design flexibility for customers.
- None.
New Industry Standard PQFN Packages Serve as
For power systems that require additional thermal performance from the SuperGaN platform,
“Transphorm continues to produce a strong GaN device portfolio, one that covers the widest power spectrum today. We’ve solidified our low power strategy with the release of these Industry Standard packages, which follow the recently announced SiP developed with Weltrend Semiconductors,” said
SuperGaN Drop-In Replacement Advantages
Replacing e-mode devices with SuperGaN d-mode FETs has proven to deliver higher performance and lower operating temperature through lower conduction losses, resulting in longer lifetime reliability. This is due to the fundamental intrinsic superiority of the d-mode GaN normally-off device vs. the e-mode GaN normally-off device. One example of such validation can be found in a recent head-to-head comparison wherein 50 mΩ e-mode was replaced by 72 mΩ SuperGaN technology in a 280 W gaming laptop charger: https://bit.ly/diraztbISP.
In the charger analysis, the SuperGaN FETs operated at the controller’s output voltage range (whereas e-mode had to level shift) with cooler temperatures. The SuperGaN temperature coefficient of resistance (TCR) is approximately 25 percent lower than that of e-mode, contributing to the lower conduction losses. Additionally, the peripheral component count was reduced by
Industry Standard SMD Portfolio
Transphorm’s Industry Standard PQFN device list follows:
Part |
RDS(on) mΩ |
Package |
TP65H070G4LSGB |
72 |
PQFN88 |
TP65H150BG4JSG |
150 |
PQFN56 |
TP65H150G4LSGB |
150 |
PQFN88 |
TP65H300G4JSGB |
240 |
PQFN56 |
TP65H300G4LSGB |
240 |
PQFN88 |
TP65H480G4JSGB |
480 |
PQFN56 |
Key features shared across devices include:
- JEDEC qualified
- Dynamic RDS(on)eff production tested
- Market-leading robustness with wide gate safety margins and transient over-voltage capabilities
- Very low QRR
- Reduced crossover loss
Target Applications
The 72 mΩ FET is optimally designed for use in datacom, broad industrial, PV inverter, servo motor, computing systems, and general consumer applications.
The 150, 240, and 480 mΩ FETs are optimally designed for use in power adapter, low power SMPS, lighting, and low power consumer applications.
Availability
All Industry Standard devices are currently sampling and can be requested here: https://www.transphormusa.com/en/products/#sampling.
About
The SuperGaN mark is a registered trademark of
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+1.973.567.6040
heather.ailara@transphormusa.com
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