STMicroelectronics introduces first STM32-ready wireless IoT modules leveraging collaboration with Qualcomm
STMicroelectronics (NYSE: STM) has launched its first wireless IoT module, the ST67W611M1, through a strategic collaboration with Qualcomm Technologies. The module integrates Qualcomm's QCC743 multiprotocol connectivity SoC with pre-loaded Wi-Fi6, Bluetooth 5.3, and Thread combo, designed for seamless integration with STM32 microcontrollers.
The module features 4Mbyte Flash storage, a 40MHz crystal, and supports Matter protocol over Wi-Fi. It includes advanced hardware security with PSA Certified Level 1 protection and comes pre-certified with built-in RF capabilities. Samples are currently available, with OEM availability in Q1 2025 and broader availability in Q2 2025.
STMicroelectronics (NYSE: STM) ha lanciato il suo primo modulo IoT wireless, il ST67W611M1, grazie a una collaborazione strategica con Qualcomm Technologies. Il modulo integra il SoC di connettività multiprotocollo QCC743 di Qualcomm con Wi-Fi6, Bluetooth 5.3 e Thread combo pre-caricati, progettato per un'integrazione senza soluzione di continuità con i microcontrollori STM32.
Il modulo presenta una memoria Flash da 4 Mbyte, un cristallo da 40MHz e supporta il protocollo Matter su Wi-Fi. Include avanzate misure di sicurezza hardware con protezione certificata PSA di livello 1 e viene pre-certificato con capacità RF integrate. I campioni sono attualmente disponibili, con disponibilità OEM nel primo trimestre del 2025 e disponibilità più ampia nel secondo trimestre del 2025.
STMicroelectronics (NYSE: STM) ha lanzado su primer módulo IoT inalámbrico, el ST67W611M1, a través de una colaboración estratégica con Qualcomm Technologies. El módulo integra el SoC de conectividad multiprotocolo QCC743 de Qualcomm con Wi-Fi6, Bluetooth 5.3 y Thread combo preinstalados, diseñado para una integración sin inconvenientes con los microcontroladores STM32.
El módulo cuenta con 4Mbyte de almacenamiento Flash, un cristal de 40MHz y soporta el protocolo Matter sobre Wi-Fi. Incluye seguridad avanzada de hardware con protección certificada de nivel 1 por PSA y llega pre-certificado con capacidades RF incorporadas. Las muestras están actualmente disponibles, con disponibilidad OEM en el primer trimestre de 2025 y disponibilidad más amplia en el segundo trimestre de 2025.
STMicroelectronics (NYSE: STM)는 Qualcomm Technologies와의 전략적 협업을 통해 첫 번째 무선 IoT 모듈 ST67W611M1을 출시했습니다. 이 모듈은 Qualcomm의 QCC743 다중 프로토콜 연결 SoC와 Wi-Fi6, Bluetooth 5.3, Thread 콤보를 사전 탑재하여 STM32 마이크로컨트롤러와 원활하게 통합될 수 있도록 설계되었습니다.
모듈은 4Mbyte 플래시 저장소, 40MHz 크리스탈을 특징으로 하며 Wi-Fi를 통한 Matter 프로토콜을 지원합니다. 이 모듈은 PSA 인증 레벨 1 보호에 대한 고급 하드웨어 보안을 포함하고 있으며 내장된 RF 기능으로 사전 인증됩니다. 샘플은 현재 제공되고 있으며, OEM은 2025년 1분기에, 그리고 보다 넓은 범위의 사용은 2025년 2분기에 제공될 예정입니다.
STMicroelectronics (NYSE: STM) a lancé son premier module IoT sans fil, le ST67W611M1, grâce à une collaboration stratégique avec Qualcomm Technologies. Le module intègre le SoC de connectivité multiprotocole QCC743 de Qualcomm avec Wi-Fi6, Bluetooth 5.3 et Thread combo préinstallés, conçu pour une intégration fluide avec les microcontrôleurs STM32.
Le module dispose d'une mémoire Flash de 4 Mbyte, d'un cristal de 40MHz et prend en charge le protocole Matter sur Wi-Fi. Il inclut une sécurité matérielle avancée avec une protection certifiée de niveau 1 par PSA et est livré précertifié avec des capacités RF intégrées. Des échantillons sont actuellement disponibles, avec une disponibilité OEM au T1 2025 et une disponibilité plus large au T2 2025.
STMicroelectronics (NYSE: STM) hat sein erstes drahtloses IoT-Modul, das ST67W611M1, in einer strategischen Zusammenarbeit mit Qualcomm Technologies auf den Markt gebracht. Das Modul integriert Qualcomms QCC743 Multiprotokoll-Konnektivitäts-SoC mit vorinstalliertem Wi-Fi6, Bluetooth 5.3 und Thread-Kombination, das für eine nahtlose Integration mit STM32-Mikrocontrollern ausgelegt ist.
Das Modul verfügt über 4 MByte Flash-Speicher, einen 40-MHz-Kristall und unterstützt das Matter-Protokoll über Wi-Fi. Es enthält fortschrittliche Hardwaresicherheit mit PSA-zertifiziertem Schutz der Stufe 1 und ist mit integrierten RF-Funktionen vorgeprüft. Muster sind derzeit verfügbar, mit OEM-Verfügbarkeit im ersten Quartal 2025 und breiterer Verfügbarkeit im zweiten Quartal 2025.
- Strategic collaboration with Qualcomm enhances STM's wireless IoT capabilities
- Pre-certified module reduces development complexity and time-to-market
- Integration with extensive STM32 ecosystem (4,000+ commercial parts)
- Built-in hardware security features with PSA Certified Level 1 protection
- Support for Matter protocol ensures future-proof connectivity
- Full market availability delayed until Q2 2025
Insights
STMicroelectronics introduces first STM32-ready wireless IoT modules leveraging collaboration with Qualcomm
WiFi6/Bluetooth 5.3/Thread ST67W611M1 modules accelerate development and boosts flexibility to deliver advanced consumer and industrial IoT solutions
Geneva, Switzerland, December 11, 2024 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the first product of its strategic collaboration with Qualcomm Technologies to simplify development of next-generation wireless solutions for industrial and consumer IoT applications. The collaboration aims to deliver initially IoT modules leveraging ST’s powerful STM32 ecosystem and Qualcomm Technologies’ leading wireless connectivity solutions.
The first of these modules, the ST67W611M1, contains a Qualcomm® QCC743 multiprotocol connectivity system-on-a-chip (SoC), pre-loaded with Wi-Fi6, Bluetooth 5.3 qualified, and Thread combo, made easy to integrate with any STM32 microcontroller (MCU) or microprocessor (MPU). The module will support Matter protocol over Wi-Fi for future-proof connectivity, making the STM32 portfolio seamlessly accessible to the Matter ecosystem. Aiding the system integration, the module also contains 4Mbyte Flash for code and data storage, and a 40MHz crystal. There is also an integrated PCB antenna or micro RF (uFL) connector for an external antenna.
“Our collaboration delivers multiple advantages for the large community that leverage the STM32 family in their embedded systems,” said Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF Products Group (MDRF) at STMicroelectronics. “Qualcomm’s expertise in highly influential and widely used wireless connectivity technologies is now at product developers’ fingertips and combines with the powerful software, tools, features and project acceleration offered by the STM32 development ecosystem.”
“This is just the beginning of our mission, which we expect to deliver many further successes enabling new and advanced edge processing applications,” said Rahul Patel, Group General Manager, Connectivity, Broadband and Networking Business Unit, Qualcomm Technologies, Inc. “We look forward to continuing our collaboration with STMicroelectronics to bring more unparalleled connected experiences with Wi-Fi, Bluetooth, AI, 5G and more.”
Advanced hardware security is built in, with hardware cryptographic accelerators, as well as services including secure boot and secure debug, reaching PSA Certified Level 1 protection. The module is self-contained and pre-certified according to mandatory specifications, requiring no RF design expertise from the user to create a working solution. Highly integrated in a 32-lead LGA package, it is ready to place on the board and permits simple, low-cost PCB designs with as few as two layers.
The ST67W611M1 leverages the STM32 ecosystem, which contains over 4,000 commercial part numbers, powerful STM32Cube tools and software, and enhancements that boost edge AI development. AI enhancements include the recently introduced STM32N6 MCUs, which contain ST’s Neural-ART Accelerator, and the ST Edge AI Suite that provides an AI Model Zoo and STM32Cube.AI and NanoEdge AI optimization tools.
The modules are designed to be quickly and seamlessly integrated with any STM32 microcontroller or STM32 microprocessor, which offer flexible options for performance, price, and power across a broad spectrum. The MCUs available range from cost- and power-sensitive devices containing the Arm® Cortex®-M0+ core to devices containing high performing cores such as Cortex-M4 and Cortex-A7 in the STM32MP1/2 MPUs.
Samples of the ST67W611M1 are available, with OEM availability in Q1 2025, with broader availability in Q2 2025. To request samples and pricing options please contact your local ST sales office.
For more information, please go to www.st.com/st67w
You can also refer to the press release of October 2024: STMicroelectronics and Qualcomm enter strategic collaboration in wireless IoT
STM32 is a registered and/or unregistered trademark of STMicroelectronics International NV or its affiliates in the EU and/or elsewhere. In particular, STM32 is registered in the US Patent and Trademark Office.
Qualcomm and Snapdragon products mentioned within this press release are offered by Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm and Snapdragon are trademarks or registered trademarks of Qualcomm Incorporated.
About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at www.st.com.
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Attachments
- P4666S -- Dec 11 2024 -- ST67W611 Qualcomm module_FINAL FOR PUBLICATION
- P4666S -- Dec 11 2024 -- ST67W611 Qualcomm module_IMAGE
FAQ
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