STMicroelectronics details company-wide program to reshape manufacturing footprint and resize global cost base
STMicroelectronics (NYSE: STM) has announced a comprehensive program to reshape its global manufacturing footprint and optimize its cost base. The plan, spanning FY2025-2027, focuses on advancing manufacturing infrastructure in 300mm silicon and 200mm silicon carbide technologies.
Key initiatives include:
- Scaling up Agrate (Italy) 300mm fab capacity to 4,000 wafers per week by 2027, with potential expansion to 14,000 wpw
- Increasing Crolles (France) 300mm fab capacity to 14,000 wpw by 2027, expandable to 20,000 wpw
- Launching 200mm silicon carbide production in Catania by Q4 2025
- Implementing workforce changes affecting up to 2,800 positions globally through voluntary measures
The company aims to achieve annual cost savings in the high triple-digit million-dollar range by the end of 2027, while strengthening its position in advanced manufacturing and R&D in Europe.
STMicroelectronics (NYSE: STM) ha annunciato un programma completo per rimodellare la sua presenza produttiva globale e ottimizzare la propria base di costi. Il piano, che si estende dal FY2025 al 2027, si concentra sul miglioramento delle infrastrutture di produzione nelle tecnologie del silicio da 300 mm e del carburo di silicio da 200 mm.
Le iniziative chiave includono:
- Aumentare la capacità dello stabilimento da 300 mm di Agrate (Italia) a 4.000 wafer a settimana entro il 2027, con potenziale espansione a 14.000 wpw
- Aumentare la capacità dello stabilimento da 300 mm di Crolles (Francia) a 14.000 wpw entro il 2027, espandibile a 20.000 wpw
- Avviare la produzione di carburo di silicio da 200 mm a Catania entro il quarto trimestre del 2025
- Implementare cambiamenti nel personale che interessano fino a 2.800 posizioni a livello globale attraverso misure volontarie
L'azienda punta a conseguire risparmi annuali sui costi nell'ordine di centinaia di milioni di dollari entro la fine del 2027, rafforzando al contempo la propria posizione nella produzione avanzata e nella ricerca e sviluppo in Europa.
STMicroelectronics (NYSE: STM) ha anunciado un programa integral para remodelar su huella de fabricación global y optimizar su base de costos. El plan, que abarca desde el ejercicio fiscal 2025 hasta 2027, se centra en avanzar en la infraestructura de fabricación en tecnologías de silicio de 300 mm y carburo de silicio de 200 mm.
Las iniciativas clave incluyen:
- Aumentar la capacidad de la fábrica de 300 mm en Agrate (Italia) a 4,000 obleas por semana para 2027, con una posible expansión a 14,000 obleas por semana
- Aumentar la capacidad de la fábrica de 300 mm en Crolles (Francia) a 14,000 obleas por semana para 2027, ampliable a 20,000 obleas por semana
- Lanzar la producción de carburo de silicio de 200 mm en Catania para el cuarto trimestre de 2025
- Implementar cambios en la fuerza laboral que afecten hasta 2,800 puestos a nivel global a través de medidas voluntarias
La empresa tiene como objetivo lograr ahorros anuales en costos en el rango de cientos de millones de dólares para finales de 2027, mientras fortalece su posición en la fabricación avanzada y la I+D en Europa.
STMicroelectronics (NYSE: STM)는 글로벌 제조 발자국을 재편하고 비용 기반을 최적화하기 위한 포괄적인 프로그램을 발표했습니다. 이 계획은 FY2025-2027에 걸쳐 있으며, 300mm 실리콘 및 200mm 실리콘 카바이드 기술의 제조 인프라를 발전시키는 데 중점을 둡니다.
주요 이니셔티브는 다음과 같습니다:
- Agrate (이탈리아)의 300mm 팹 용량을 2027년까지 주당 4,000 웨이퍼로 확대하고, 최대 14,000 웨이퍼로 확장 가능성
- Crolles (프랑스)의 300mm 팹 용량을 2027년까지 주당 14,000 웨이퍼로 늘리고, 20,000 웨이퍼로 확장 가능
- 2025년 4분기까지 카타니아에서 200mm 실리콘 카바이드 생산 시작
- 자발적 조치를 통해 전 세계적으로 최대 2,800개의 직무에 영향을 미치는 인력 변화 구현
회사는 2027년 말까지 수백만 달러 단위의 연간 비용 절감을 달성하고, 유럽에서의 고급 제조 및 연구개발 분야의 입지를 강화하는 것을 목표로 하고 있습니다.
STMicroelectronics (NYSE: STM) a annoncé un programme complet pour remodeler son empreinte de fabrication mondiale et optimiser sa base de coûts. Le plan, qui s'étend de l'exercice 2025 à 2027, se concentre sur l'avancement des infrastructures de fabrication dans les technologies de silicium de 300 mm et de carbure de silicium de 200 mm.
Les initiatives clés comprennent:
- Augmenter la capacité de l'usine de 300 mm à Agrate (Italie) à 4 000 wafers par semaine d'ici 2027, avec une expansion potentielle à 14 000 wafers par semaine
- Augmenter la capacité de l'usine de 300 mm à Crolles (France) à 14 000 wafers par semaine d'ici 2027, extensible à 20 000 wafers par semaine
- Lancer la production de carbure de silicium de 200 mm à Catane d'ici le quatrième trimestre 2025
- Mettre en œuvre des changements de personnel affectant jusqu'à 2 800 postes dans le monde grâce à des mesures volontaires
L'entreprise vise à réaliser des économies annuelles de coûts dans la fourchette des centaines de millions de dollars d'ici la fin de 2027, tout en renforçant sa position dans la fabrication avancée et la R&D en Europe.
STMicroelectronics (NYSE: STM) hat ein umfassendes Programm angekündigt, um seine globale Fertigungsstruktur neu zu gestalten und seine Kostenbasis zu optimieren. Der Plan, der sich über die Geschäftsjahre 2025 bis 2027 erstreckt, konzentriert sich auf den Ausbau der Fertigungsinfrastruktur in 300-mm-Silizium- und 200-mm-Siliziumkarbid-Technologien.
Wichtige Initiativen umfassen:
- Die Kapazität des 300-mm-Werks in Agrate (Italien) bis 2027 auf 4.000 Wafer pro Woche zu erhöhen, mit der Möglichkeit einer Erweiterung auf 14.000 Wafer pro Woche
- Die Kapazität des 300-mm-Werks in Crolles (Frankreich) bis 2027 auf 14.000 Wafer pro Woche zu erhöhen, erweiterbar auf 20.000 Wafer pro Woche
- Die Produktion von 200-mm-Siliziumkarbid in Catania bis zum vierten Quartal 2025 zu starten
- Änderungen des Personals, die bis zu 2.800 Stellen weltweit durch freiwillige Maßnahmen betreffen
Das Unternehmen strebt an, bis Ende 2027 jährliche Kosteneinsparungen im hohen dreistelligen Millionen-Dollar-Bereich zu erzielen und gleichzeitig seine Position in der fortschrittlichen Fertigung und F&E in Europa zu stärken.
- Major capacity expansion in advanced 300mm manufacturing
- High triple-digit million-dollar annual cost savings expected by 2027
- Strategic investment in next-gen 200mm silicon carbide production
- Modernization through AI and automation implementation
- Voluntary workforce reduction avoiding forced layoffs
- Workforce reduction of up to 2,800 positions globally
- Significant restructuring costs expected over three years
- Potential disruption during manufacturing footprint transformation
- Phase-out of legacy 150mm manufacturing capabilities
Insights
STMicroelectronics has unveiled a significant restructuring program aimed at reshaping its manufacturing footprint while targeting
The strategic repositioning focuses on two critical areas: (1) prioritizing investments in advanced 300mm silicon and 200mm silicon carbide wafer fabrication, and (2) maximizing efficiency of legacy 150mm and mature 200mm capabilities. This represents a necessary modernization of manufacturing assets to maintain competitive positioning in the global semiconductor market.
The company is creating specialized manufacturing ecosystems - digital technologies in France, analog/power technologies in Italy, and mature technologies in Singapore. Key initiatives include doubling capacity at Italy's Agrate 300mm fab to 4,000 wafers per week by 2027 (expandable to 14,000), increasing France's Crolles 300mm capacity to 14,000 wafers weekly (expandable to 20,000), and building a new Silicon Carbide Campus in Catania starting production in Q4 2025.
While the workforce reduction signals short-term challenges, the voluntary implementation approach and three-year timeline suggest a measured transition rather than urgent cost-cutting. The substantial cost savings target represents approximately
PR No: C3330C
STMicroelectronics details company-wide program to reshape manufacturing footprint and resize global cost base
- Increasing efficiency, automation, and AI will strengthen ST’s key technology R&D, design and high-volume assets for advanced manufacturing in Europe.
- Planned investments over FY2025, 2026 and 2027 to focus on advanced manufacturing infrastructure in 300mm silicon, 200mm silicon carbide, and technology R&D, for the benefit of customers globally.
- Company-wide program, including both the previously disclosed resizing of cost base and the reshaping of manufacturing footprint, expected to see up to 2,800 people leaving the company globally on a voluntary basis over 3 years, on top of normal attrition.
- Confirmation of annual cost savings target in the high triple-digit million-dollar range exiting 2027.
Geneva, April 10, 2025 – STMicroelectronics N.V. (“ST”) (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today disclosed further elements of its program to reshape its global manufacturing footprint. This comes as part of the program announced in October 2024 to further strengthen ST’s competitiveness, solidify its position as a global semiconductor leader, and ensure the long-term sustainability of its model as an Integrated Device Manufacturer by leveraging strategic assets globally across technology R&D, design and high-volume manufacturing.
Jean-Marc Chery, President and CEO of STMicroelectronics said: “The reshaping of our manufacturing footprint announced today will future proof our Integrated Device Manufacturer model with strategic assets in Europe and improve our ability to innovate even faster, benefitting all our stakeholders. As we focus on advanced manufacturing infrastructure and mainstream technologies, we will continue to leverage all of our existing sites and bring redefined missions for some of them to support their long-term success. We are committed to managing this program responsibly, according to our long-established values, and exclusively through voluntary measures. The technology R&D, design, and high-volume manufacturing activities in Italy and France will continue to be central to our global operations and will be reinforced via planned investments in mainstream technologies”.
Innovating and scaling up to increase efficiency across manufacturing operations
As innovation cycles shorten, ST’s manufacturing strategy is evolving to accelerate the delivery of innovative, proprietary technologies and products at scale to customers globally, across automotive, industrial, personal electronics and communication infrastructure applications.
The reshaping and modernization of ST’s manufacturing operations aim to achieve two main objectives: prioritizing planned investments towards future-ready infrastructure such as 300mm silicon and 200mm silicon carbide wafer fabs to enable them to reach a critical scale and maximizing the productivity and efficiency of legacy 150mm capabilities and mature 200mm capabilities. In parallel, ST plans to continue to invest in upgrading the technology used across its operations, deploying additional AI and automation for additional efficiency in technology R&D, manufacturing, reliability and qualification processes, with a continued focus on sustainability.
Strengthening ST’s manufacturing ecosystem
Over the next three years, the reshaping of ST’s manufacturing footprint will design and strengthen ST’s complementary ecosystems: in France around digital technologies, in Italy around analog and power technologies and in Singapore on mature technologies. The optimization of these operations aim to achieve full capacity utilization and drive technological differentiation to compete globally. As announced previously, each of ST’s current sites will continue to play a long-term role within the company’s global operations.
Building 300mm silicon megafabs in Agrate and Crolles
The Agrate (Italy) 300mm fab will continue to be scaled up, with the aim to become ST’s flagship high-volume manufacturing facility for smart power and mixed signal technologies. The plan is to double its current capacity to 4,000 wafers per week (wpw) by 2027, with planned modular expansions increasing capacity up to 14,000 wpw, depending on market conditions. As we increase our focus on 300mm manufacturing, the Agrate 200mm fab will refocus on MEMS.
The Crolles (France) 300mm fab will be further cemented as the core of ST’s digital products ecosystem. The plan is to increase capacity to 14,000 wpw by 2027 with planned modular expansions increasing capacity up to 20,000 wpw, depending on market conditions. In addition, we will convert the Crolles 200mm fab to support Electrical Wafer Sorting high volume manufacturing and advanced packaging technologies, hosting activities that do not exist today in Europe. The focus will be on next-generation leading technologies including optical sensing and silicon photonics.
Specialized Manufacturing and Competence Center for Power Electronics in Catania
Catania will continue to serve as a center of excellence for power and wide-bandgap semiconductor devices. The development of the new Silicon Carbide Campus is progressing as planned, with production of 200mm wafers set to begin in Q4 2025, reinforcing ST’s leadership in next-generation power technologies. Our resources supporting Catania’s current 150mm and EWS capabilities will be refocused on 200mm silicon carbide and silicon power semiconductor production, including GaN-on-silicon, reinforcing ST’s leadership in next-generation power technologies.
Optimizing Other Manufacturing Sites
Rousset (France) will remain focused on 200mm manufacturing, with additional volumes reallocated from other sites enabling full saturation of existing manufacturing capacity for optimized efficiency.
Tours (France) will remain focused on its 200mm silicon production line for select technologies, while other activities - including legacy 150mm manufacturing activities - will be transferred to different ST sites, and it will also remain a center of competence for GaN, mainly on epitaxy. The Tours site will also host a new activity: panel-level-packaging, one of the major enablers of chiplets, a technology for complex semiconductor applications that will be key for ST in the future.
Ang Mo Kio (Singapore), ST’s high-volume fab for mature technologies, will remain focused on 200mm silicon manufacturing and will also host our consolidated global legacy 150mm silicon capabilities.
Kirkop (Malta), ST’s high-volume test and packaging fab in Europe will be upgraded, with the addition of advanced automated technologies which will be key to support next-generation products.
Workforce and skills evolution
As ST reshapes its manufacturing footprint over the next three years, the workforce size and required skill sets will evolve. Advanced manufacturing will shift roles from legacy processes involving repetitive manual tasks to a stronger focus on process control, automation, and design. ST will manage this transition through voluntary measures, with a continued commitment to ongoing constructive dialogue and negotiations with employee representatives in accordance with applicable national regulations. Based on current projections, the program is expected to see up to 2,800 people leaving the company globally on a voluntary basis, on top of normal attrition. These changes are expected to occur mainly in 2026 and 2027. Regular updates will be provided to stakeholders as the program progresses.
About STMicroelectronics
At ST, we are 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our
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EVP Corporate Development & Integrated External Communication
Tel: +41 22 929 59 20
jerome.ramel@st.com
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Corporate External Communications
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