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Silicon Labs' Breakthrough Ultra-Low Power Wi-Fi 6 and Bluetooth LE 5.4 Modules Supercharge Device Deployment

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Silicon Labs (NASDAQ: SLAB) has launched the SiWx917Y ultra-low power Wi-Fi 6 and Bluetooth LE 5.4 modules, extending their Series 2 platform. These pre-certified modules feature intelligent power management, enabling connected sleep mode with as low as 20μA current. The modules integrate Wi-Fi 6, Bluetooth LE 5.4, an ARM Cortex-M4 processor, and various peripherals in a 16 x 21 x 2.3 mm package. They come in two variants: SiWG917Y for SoC mode and SiWN917Y for NCP mode, targeting applications in smart homes, healthcare, industrial sensors, and asset tracking.

Silicon Labs (NASDAQ: SLAB) ha lanciato i moduli SiWx917Y ultra-low power Wi-Fi 6 e Bluetooth LE 5.4, ampliando la loro piattaforma Series 2. Questi moduli pre-certificati presentano un'intelligente gestione dell'alimentazione, abilitando la modalità sonno con un consumo di corrente di appena 20μA. I moduli integrano Wi-Fi 6, Bluetooth LE 5.4, un processore ARM Cortex-M4 e vari periferici in un pacchetto di 16 x 21 x 2.3 mm. Sono disponibili in due varianti: SiWG917Y per la modalità SoC e SiWN917Y per la modalità NCP, mirando ad applicazioni in case intelligenti, sanità, sensori industriali e tracciamento di beni.

Silicon Labs (NASDAQ: SLAB) ha lanzado los módulos SiWx917Y ultra bajo consumo Wi-Fi 6 y Bluetooth LE 5.4, ampliando su plataforma Series 2. Estos módulos pre-certificados cuentan con una gestión de energía inteligente, permitiendo un modo de sueño conectado con un consumo tan bajo como 20μA. Los módulos integran Wi-Fi 6, Bluetooth LE 5.4, un procesador ARM Cortex-M4 y varios periféricos en un paquete de 16 x 21 x 2.3 mm. Vienen en dos variantes: SiWG917Y para modo SoC y SiWN917Y para modo NCP, enfocados en aplicaciones en hogares inteligentes, atención médica, sensores industriales y rastreo de activos.

실리콘랩스 (NASDAQ: SLAB)SiWx917Y 초저전력 Wi-Fi 6 및 Bluetooth LE 5.4 모듈을 출시하여 Series 2 플랫폼을 확장했습니다. 이 사전 인증된 모듈들은 지능형 전력 관리 기능을 갖추고 있어, 연결된 슬립 모드에서 20μA의 전류 소비로 작동할 수 있습니다. 모듈은 Wi-Fi 6, Bluetooth LE 5.4, ARM Cortex-M4 프로세서 및 다양한 주변 장치를 16 x 21 x 2.3 mm 패키지에 통합하고 있습니다. 두 가지 변형이 제공되며: SiWG917Y는 SoC 모드용, SiWN917Y는 NCP 모드용으로, 스마트 홈, 헬스케어, 산업 센서 및 자산 추적 응용 프로그램을 목표로 하고 있습니다.

Silicon Labs (NASDAQ: SLAB) a lancé les modules SiWx917Y ultra-low power Wi-Fi 6 et Bluetooth LE 5.4, élargissant leur plateforme Series 2. Ces modules pré-certifiés présentent une gestion intelligente de l'énergie, permettant un mode veille connecté avec un courant aussi bas que 20μA. Les modules intègrent le Wi-Fi 6, le Bluetooth LE 5.4, un processeur ARM Cortex-M4 et divers périphériques dans un boîtier de 16 x 21 x 2,3 mm. Ils sont disponibles en deux variantes : SiWG917Y pour le mode SoC et SiWN917Y pour le mode NCP, visant des applications dans les maisons intelligentes, la santé, les capteurs industriels et le suivi d'actifs.

Silicon Labs (NASDAQ: SLAB) hat die SiWx917Y ultra-low power Wi-Fi 6 und Bluetooth LE 5.4 Module vorgestellt, die ihre Series 2 Plattform erweitern. Diese vorab zertifizierten Module verfügen über ein intelligentes Energiemanagement, das den verbundenen Schlafmodus mit einem Stromverbrauch von nur 20μA ermöglicht. Die Module integrieren Wi-Fi 6, Bluetooth LE 5.4, einen ARM Cortex-M4 Prozessor und verschiedene Peripheriegeräte in einem Gehäuse von 16 x 21 x 2,3 mm. Sie sind in zwei Varianten erhältlich: SiWG917Y für den SoC-Modus und SiWN917Y für den NCP-Modus und zielen auf Anwendungen in Smart Homes, Gesundheitswesen, Industriesensoren und Asset Tracking ab.

Positive
  • Pre-certified modules reduce development time and certification costs
  • Ultra-low power consumption enables multi-year battery life
  • Dual operational modes provide design flexibility
  • Integrated solution reduces product size and components
Negative
  • None.

Insights

The SiWx917Y modules represent a significant technological advancement in IoT connectivity solutions. The combination of Wi-Fi 6 and Bluetooth LE 5.4 with ultra-low power consumption (20μA in connected sleep mode) positions SLAB competitively in the rapidly growing IoT market. The pre-certification and dual-mode functionality (SoC and NCP) substantially reduce development barriers and time-to-market for manufacturers.

The integrated ARM Cortex-M4 processor and support for Matter protocol demonstrate strategic alignment with industry trends toward edge computing and standardized IoT connectivity. This product launch strengthens SLAB's market position in smart home, industrial and healthcare segments, where demand for efficient wireless solutions continues to grow.

With IoT device deployment growing by up to 1 billion units annually, SLAB's timing is optimal. The SiWx917Y modules address key market pain points: power efficiency, certification complexity and development costs. The pre-certified status and plug-and-play approach could accelerate SLAB's market penetration across multiple high-growth sectors.

The product's versatility in supporting both smart home and industrial applications expands SLAB's addressable market. The emphasis on multi-year battery life and compact form factor (16 x 21 x 2.3 mm) aligns with market demands for sustainable, space-efficient IoT solutions, potentially driving increased adoption and revenue growth.

New SiWx917Y Modules Offer Plug-and-Play Simplicity with Global RF Certifications

AUSTIN, Texas, Dec. 3, 2024 /PRNewswire/ -- Today Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, announced the SiWx917Y ultra-low power Wi-Fi® 6 and Bluetooth® Low Energy (LE) 5.4 modules.

As an extension of the successful Series 2 platform, these modules are designed to help device makers streamline the complex development and certification process for Wi-Fi 6 devices. The new SiWx917Y modules deliver breakthrough power efficiency while providing robust wireless connectivity, advanced security, and a full-featured application processor, reducing design challenges, product size, costs, and time-to-revenue for device makers. Pre-certified for global regulatory standards and equipped with an optimized antenna, the SiWx917Y modules eliminate the need for lengthy RF optimization and certifications.

"Wi-Fi for IoT has evolved significantly, creating exciting opportunities for innovation. To help end device makers accelerate their full potential, we developed the SiWx917Y Wi-Fi 6 modules," announced Irvind Ghai, Vice President of Wi-Fi Solutions at Silicon Labs. "These pre-certified modules offer a streamlined solution, enabling manufacturers to easily integrate cutting-edge connectivity into their devices and focus on actual solution differentiation while reducing development costs."

The modules are ideal for low-power Wi-Fi applications across industries, including smart homes, building automation, healthcare devices, industrial sensors, and asset tracking.

Versatile and Efficient SiWx917Y Modules Deliver Cutting-Edge Wireless Capabilities

The SiWx917Y modules integrate Wi-Fi 6, Bluetooth LE 5.4, an ARM Cortex-M4 application processor, a wireless network processor, large memory, and a rich set of peripherals in a compact 16 x 21 x 2.3 mm package. Key features include:

  • Ultra-low power Wi-Fi 6 connectivity with intelligent power management
  • Dual-core architecture with dedicated application and wireless processors
  • Support for Matter protocol over Wi-Fi
  • Integrated antenna, RF pin and worldwide RF certifications
  • Multiple configurations and operational for design flexibility

The modules' intelligent power management enables connected sleep mode with as low as 20μA current with Target Wake Time (TWT) and 60-second keep-alive interval. This allows IoT devices like smart locks, thermostats, smart cameras, video doorbells, and industrial sensors to achieve multi-year battery life. The integrated ARM Cortex-M4 processor, large memory, and peripherals also enable sophisticated edge processing capabilities.

The module supports two operational modes: SiWG917Y for SoC (Wireless MCU) mode so customers can execute all application code in the Module's ARM Cortex-M4 core, and SiWN917Y for NCP mode (Network Co-processor) so customers can execute their application on a separate MCU while the Wi-Fi module manages communication functions.

Meeting the Growing Demands for IoT Connectivity

The explosive growth of IoT devices is driving the need for more efficient and secure Wi-Fi solutions. With Wi-Fi-enabled low-power IoT applications increasing by up to one billion units annually, device makers face the challenge of integrating robust connectivity while addressing concerns about energy efficiency, security, and ease of development.

Availability

The SiWx917Y modules are now generally available for purchase. For more information on Silicon Labs' SiWG917Y and SiWN917Y Wi-Fi 6 and Bluetooth LE modules, click here.

About Silicon Labs
Silicon Labs is a trailblazer in wireless connectivity for the Internet of Things. Its integrated hardware and software platform, intuitive development tools, and unmatched ecosystem support make Silicon Labs the ideal long-term partner in building advanced industrial, commercial, and home and life applications. Silicon Labs leads the industry in high performance, low power, and security with support for the broadest set of multi-protocol solutions.

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SOURCE Silicon Labs

FAQ

What are the key features of Silicon Labs' new SiWx917Y modules (SLAB)?

The SiWx917Y modules feature Wi-Fi 6, Bluetooth LE 5.4, ARM Cortex-M4 processor, wireless network processor, large memory, and peripherals in a 16 x 21 x 2.3 mm package, with ultra-low power consumption and global RF certifications.

What is the power consumption of Silicon Labs' SiWx917Y modules in sleep mode (SLAB)?

The modules achieve as low as 20μA current in connected sleep mode with Target Wake Time (TWT) and 60-second keep-alive interval.

What are the two operational modes of Silicon Labs' SiWx917Y modules (SLAB)?

The modules support SiWG917Y for SoC (Wireless MCU) mode and SiWN917Y for NCP (Network Co-processor) mode.

Which industries are targeted by Silicon Labs' new SiWx917Y modules (SLAB)?

The modules target smart homes, building automation, healthcare devices, industrial sensors, and asset tracking applications.

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