Renesas Samples Its First 22-nm Microcontroller
Renesas Electronics Corporation (TSE:6723) has launched its first microcontroller (MCU) utilizing advanced 22-nm process technology, providing enhanced performance and lower power consumption. This wireless MCU features Bluetooth® 5.3 Low Energy and integrates a software-defined radio (SDR), ensuring future-proofing for customers. The new chip is an extension of Renesas' RA family of 32-bit Arm® Cortex®-M microcontrollers, allowing for compatibility with previous Bluetooth LE specifications. Renesas, a leader in the MCU market with over 3.5 billion units shipped annually, is set to sample this product to select customers, with a full market launch anticipated in Q4 2023. The company aims to accelerate time-to-market for its clients by offering over 300 'Winning Combinations', which are optimized system architectures.
- Introduction of first microcontroller based on advanced 22-nm process technology.
- Enhanced performance and lower power consumption due to reduced core voltages.
- Integration of Bluetooth® 5.3 Low Energy, ensuring compliance with latest specifications.
- Expected full market launch in Q4 2023, indicating strong future prospects.
- Established leadership in the MCU market with over 3.5 billion units shipped annually.
- None.
Wireless Microcontroller Integrating Bluetooth® 5.3 Low Energy Employs Most Advanced Process Node Available for MCUs
(Graphic: Business Wire)
The first chip produced on the new 22-nm process is an extension to Renesas’ popular RA family of 32-bit Arm® Cortex®-M microcontrollers. This new wireless MCU delivers Bluetooth® 5.3 Low Energy (LE) with the integration of a software-defined radio (SDR). It offers a future-proof solution for customers building products targeting a long lifetime. Whether during development or after deployment, the devices can be upgraded either with new application software or new Bluetooth capabilities to assure compliance to the latest specification versions.
End product manufacturers can leverage the full feature set of previous Bluetooth LE specification releases. Whether designing devices for direction-finding applications utilizing the Bluetooth 5.1 Angle of Arrival (AoA) / Angle of Departure (AoD) features, or adding low power stereo audio transmission to products by employing Bluetooth 5.2 isochronous channels, developers now only need one device to support all of these features.
“Renesas’ MCU leadership is based on a wide array of products and manufacturing process technologies,” said
Winning Combinations
Renesas will combine the new 22-nm MCUs with numerous compatible devices from its portfolio to offer a wide array of Winning Combinations. These Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized, low-risk design for faster time to market. Renesas offers more than 300 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.
Availability
Renesas is sampling the new device to select customers now, with full market launch expected in 4Q 2023. Customers who wish to sample the new device can contact their local Renesas sales office. More information about the Bluetooth 5.3 LE Specification is available in a Renesas blog post found here https://www.renesas.com//blogs/what-s-new-bluetooth-53-low-energy.
Renesas MCU Leadership
Renesas is the industry’s #1 supplier of MCUs, shipping more than 3.5 billion units per year, with approximately
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