Nxp Semiconduct - NXPI STOCK NEWS

VisionPower Semiconductor Manufacturing Company (VSMC), a joint venture between Vanguard International Semiconductor and NXP Semiconductors, celebrated breaking ground on their new 300mm wafer manufacturing facility in Tampines, Singapore. The facility is expected to begin initial production in 2027, reaching an output of 55,000 300mm wafers per month by 2029.

The $7.8 billion project will create approximately 1,500 jobs and feature advanced automation including an Automated Material Handling System and AI-driven quality management. The fab will be built following Singapore Green Mark standards, incorporating energy-efficient systems, water recycling, and eco-friendly materials.

The joint venture, officially established in September 2024, aims to strengthen Singapore's position in the global semiconductor supply chain while providing specialty IC foundry services. The facility's design emphasizes both technological innovation and environmental sustainability, with potential for a second phase pending future business development.

NXP Semiconductors (NASDAQ: NXPI) has announced the approval of a $1.014 per ordinary share interim dividend for the fourth quarter of 2024. The dividend will be paid in cash on January 8, 2025, to shareholders of record as of December 5, 2024. The decision reflects the company's strong capital structure and confidence in long-term growth. A 15% Dutch dividend withholding tax will apply, though non-Dutch residents may qualify for full or partial refunds. NXP, which posted revenue of $13.28 billion in 2023, operates in over 30 countries, serving automotive, industrial & IoT, mobile, and communications infrastructure markets.

NXP Semiconductors has introduced the industry's first Ultra-Wideband (UWB) wireless battery management system (BMS) solution for electric vehicles. This innovative technology eliminates the need for complex wiring in battery packs, simplifying EV assembly and enabling increased battery energy density. The UWB BMS provides higher resistance to reflections and frequency selective fading compared to narrow-band technologies, ensuring more reliable data transfer within battery packs.

The solution, part of NXP's FlexCom chipset, supports both wired and wireless BMS configurations using common software architecture. Available for OEM evaluation in Q2 2025, it helps decouple mechanical and electrical development, offering manufacturers increased flexibility and faster time to market while reducing development costs.

NXP Semiconductors announced the i.MX 94 family of applications processors, designed for industrial control, PLCs, telematics, and automotive gateways. The processors feature an integrated 2.5 Gbps Ethernet TSN switch, post-quantum cryptography, and eIQ Neutron Neural Processing Unit. The multi-core design includes up to four Arm Cortex-A55 cores, two Cortex-M33 cores, and two Cortex-M7 cores, supporting various industrial protocols and delivering 0.5 TOPS of machine learning performance. The family supports IEC61508 SIL2 and ISO26262 ASIL-B compliance, with sampling expected to begin in Q1 2025.

NXP Semiconductors (NXPI) reported Q3 2024 revenue of $3.25 billion, down 5% year-over-year but in line with guidance. The company achieved a GAAP gross margin of 57.4% and diluted EPS of $2.79. While experiencing strength in Communication Infrastructure, Mobile, and Automotive markets, the company faced weakness in Industrial & IoT. Q4 guidance reflects broader macro weakness, particularly in Europe and Americas. The company generated $779 million in operating cash flow and returned $564 million to shareholders through dividends and share repurchases.

NXP Semiconductors announced that Audi is implementing its Trimension NCJ29Dx Ultra-Wideband (UWB) technology in their new Premium Platform Electric (PPE) vehicles. The technology enables precise, hands-free secure car access functionality through smart mobile devices. Audi Q6 e-tron, featuring NXP's UWB devices, will launch in 2024.

The system uses fine-ranging capabilities to accurately identify driver location relative to the vehicle, enabling secure door unlocking only when the driver is nearby. Drivers can unlock and start their cars hands-free using a digital key on UWB-enabled mobile phones or wearables. The technology complies with IEEE 802.15.4, CCC, and FiRa standards, offering enhanced protection against relay attacks and supporting various cryptographic operations.

NXP Semiconductors has unveiled the S32J family of high-performance Ethernet switches and network controllers, designed to address the complex networking challenges of software-defined vehicles (SDVs). These devices, part of the NXP CoreRide platform, share a common switch core (NETC) with NXP's S32 microcontrollers and processors, enabling seamless integration and software reuse.

Key features of the S32J family include:

• 80Gbps bandwidth with ports ranging from 10Mb to 10Gb
• Dual Arm® Cortex®-R52 cores
• Time-sensitive networking (TSN) compliance
• ASIL-D safety and hardware security engine (HSE)
• MACsec ports for mixed-critical data traffic

The S32J family, combined with the CoreRide platform, offers production-grade networking solutions with pre-integrated software and tooling. A virtual development kit will be available by the end of 2024, with the solution becoming available to OEMs and Tier-1 suppliers in 2025.

NXP Semiconductors (NASDAQ: NXPI) has announced its schedule for releasing third quarter 2024 financial results. The company will disclose these results after the NASDAQ Global Select Market closes on Monday, November 4, 2024. Following this, NXP will host a conference call with the financial community on Tuesday, November 5, 2024, at 8:00 a.m. EST. Interested parties can pre-register for the webcast or obtain an access code to join the live conference call. Additionally, a replay of the call will be made available via webcast for on-demand listening shortly after the call concludes.

NXP Semiconductors has unveiled the Trimension SR250, the industry's first single-chip solution integrating on-chip processing with short-range UWB radar and secure ranging. This innovative product enables new user experiences in autonomous homes and Industrial IoT applications, focusing on location, presence, and motion detection. The SR250 combines low-power short-range UWB radar (6-8.5 GHz), secure ranging, and angle-of-arrival calculations to support various use cases in smart homes and industrial environments.

Key features include 3D AoA, TDOA, and ToF readings accurate to within ±5 cm. The chip can be paired with the EdgeLock SE051W secure element for enhanced security. Developed based on FiRa Consortium 3.0 specifications, it ensures interoperability and simplifies certification. The SR250 is supported by firmware, middleware, and sample applications to streamline development and deployment.