Nxp Semiconduct - NXPI STOCK NEWS

NXP Semiconductors (NASDAQ: NXPI) has expanded its EdgeVerse portfolio, introducing the ultra-low power i.MX 8ULP and i.MX 8ULP-CS applications processors, along with the next-generation i.MX 9 series. These processors incorporate the EdgeLock secure enclave for enhanced security and Energy Flex architecture for improved energy efficiency, claiming up to 75% better efficiency than previous models. The i.MX 8ULP-CS also features Microsoft Azure Sphere for integrated chip-to-cloud security. These innovations aim to support the growing demand for intelligent, secure edge computing solutions.

NXP Semiconductors (NASDAQ: NXPI) announced disruptions at its Austin, Texas facilities due to severe winter weather. Utility providers have prioritized service for residential and critical areas, forcing NXP to idle its manufacturing operations. The company is directly notifying affected customers about potential supply interruptions. NXP is monitoring the situation closely and plans to resume operations as soon as utility services are restored. Notably, all other manufacturing sites outside Texas remain fully operational.

NXP Semiconductors has launched the new EdgeLock™ 2GO IoT service platform, aimed at simplifying secure deployment and management of IoT devices. Integrated with the EdgeLock SE050 secure element, it offers comprehensive device security from edge to cloud. The platform enhances customer control over device access while optimizing costs, supporting various IoT devices from sensors to edge-computing platforms. With its flexible management options, EdgeLock 2GO simplifies device onboarding to cloud services like AWS and Microsoft Azure, ensuring ongoing security throughout the device lifecycle.

NXP Semiconductors N.V. reported fourth-quarter revenue of $2.5 billion, up 9% year-on-year, contributing to a full-year revenue of $8.6 billion. The company noted a strong rebound in demand during the second half of 2020, particularly in the Automotive and Mobile sectors. Gross margins showed health with GAAP gross margin at 51.4% and non-GAAP at 52.9%. Cash flow from operations reached $2.48 billion. The board approved an interim dividend of $0.375 per share, and $1.04 billion was returned to shareholders throughout 2020. NXP anticipates continued growth in 2021.

NXP Semiconductors has launched its first Wi-Fi 6E Tri-Band SoC, the CW641, designed to utilize the newly available 6GHz band. This innovation expands Wi-Fi capacity, offering up to 4.8Gbps PHY rates and over 4Gbps of real-world throughput. The CW641 is tailored for access points and service provider gateways, enabling improved data rates and multi-user performance. It features support for 4x4 Wi-Fi with multiple bandwidth channels and aims to enhance user experiences in applications like cloud gaming and online streaming. Availability for sampling starts now.

NXP Semiconductors N.V. (NASDAQ: NXPI) will announce its fourth quarter and full-year 2020 financial results on February 1, 2021, after market close. A conference call for investors will take place on February 2, 2021, at 8:00 a.m. EST. Interested participants can join by dialing specified numbers in the U.S. and abroad or via a webcast available on the NXP Investor Relations website. In 2019, NXP generated revenues of $8.88 billion and employs approximately 29,000 staff worldwide, focusing on secure connectivity solutions across multiple markets.

NXP Semiconductors has unveiled BlueBox 3.0, a next-gen safe Automotive High-Performance Compute (AHPC) platform designed to meet evolving vehicle architecture requirements. It features a 2x increase in processing performance over its predecessor, enhanced safety capabilities with ASIL D compliance, and 8x more I/O and PCIe ports. BlueBox 3.0 supports L2+ automated driving and offers a modular solution for advanced safety architectures and user-defined vehicles, accelerating development and deployment timelines.

NXP Semiconductors has launched new radar sensor chipset solutions aimed at enhancing vehicle safety and advancing driver assistance technology. The solutions provide 360-degree safety coverage and support the development of imaging radar, allowing for precise classification of objects. Built on advanced 16nm FinFET and 40nm RFCMOS technologies, these products offer scalability and flexibility for car manufacturers. The suite includes the S32R45 radar processor for imaging and the S32R294 for corner and front radar applications, with mass production expected in 2021.

NXP Semiconductors has launched its 2nd generation Airfast RF Multi-Chip Modules (MCMs) to enhance 5G mMIMO active antenna systems for cellular base stations. The new modules extend frequency coverage to 4.0 GHz and provide a 20% increase in output power compared to the previous generation, helping to cover larger urban areas. They achieve power-added efficiency of 45% at 2.6 GHz, reducing electricity consumption for 5G networks. The modules are now available and will support NXP’s new RF Circuit Collection for reference circuits.