Nordson Electronics Solutions to Feature High-Throughput Fluid Dispensing Technologies for Wafer-Level and Panel-Level Packaging at SEMICON Taiwan 2024
Nordson Electronics Solutions will showcase advanced fluid dispensing technologies for semiconductor packaging at SEMICON Taiwan 2024, booth L0516. The company will feature the ASYMTEK Forte® fluid dispensing system, designed for high-productivity and accuracy in various semiconductor packaging applications. Nordson will also present developments for high-throughput panel-level packaging (PLP) and wafer-level packaging (WLP), addressing challenges like warpage during fluid dispensing.
The exhibition will highlight different configurations of the ASYMTEK Vantage® fluid dispensing system for WLP and PLP, demonstrating precise dispense results with high throughput. Experts will be available to discuss how Nordson can support the manufacturing of reliable semiconductor products. SEMICON Taiwan is scheduled for September 4-6, 2024, at TaiNEX, Taipei Taiwan.
Nordson Electronics Solutions presenterà tecnologie avanzate di erogazione di fluidi per il confezionamento di semiconduttori al SEMICON Taiwan 2024, stand L0516. L'azienda metterà in evidenza il sistema di erogazione di fluidi ASYMTEK Forte®, progettato per l'alta produttività e precisione in varie applicazioni di confezionamento di semiconduttori. Nordson presenterà anche sviluppi per il confezionamento a livello di pannello ad alta capacità (PLP) e a livello di wafer (WLP), affrontando sfide come la deformazione durante l'erogazione dei fluidi.
La fiera metterà in evidenza diverse configurazioni del sistema di erogazione di fluidi ASYMTEK Vantage® per WLP e PLP, dimostrando risultati di erogazione precisi con alta capacità produttiva. Esperti saranno a disposizione per discutere su come Nordson possa supportare la produzione di prodotti semiconduttori affidabili. Il SEMICON Taiwan è previsto per il 4-6 settembre 2024, presso il TaiNEX, Taipei Taiwan.
Nordson Electronics Solutions presentará tecnologías avanzadas de dispensación de fluidos para el empaquetado de semiconductores en SEMICON Taiwán 2024, stand L0516. La empresa destacará el sistema de dispensación de fluidos ASYMTEK Forte®, diseñado para alta productividad y precisión en diversas aplicaciones de empaquetado de semiconductores. Nordson también presentará desarrollos para empaquetado a nivel de panel de alta capacidad (PLP) y empaquetado a nivel de oblea (WLP), abordando desafíos como la deformación durante la dispensación de fluidos.
La exposición resaltará diferentes configuraciones del sistema de dispensación de fluidos ASYMTEK Vantage® para WLP y PLP, demostrando resultados de dispensación precisos con alta productividad. Expertos estarán disponibles para discutir cómo Nordson puede apoyar la fabricación de productos de semiconductores fiables. SEMICON Taiwán está programado para los días 4 al 6 de septiembre de 2024, en TaiNEX, Taipéi Taiwán.
노드슨 일렉트로닉스 솔루션은 SEMICON 타이완 2024 부스 L0516에서 반도체 패키징을 위한 고급 유체 분배 기술을 선보일 예정입니다. 이 회사는 다양한 반도체 패키징 응용을 위한 고생산성 및 정확성을 위해 설계된 ASYMTEK Forte® 유체 분배 시스템을 특징으로 합니다. 노드슨은 또한 유체 분배 중 변형 문제를 다루며 고속 패널 레벨 패키징(PLP) 및 웨이퍼 레벨 패키징(WLP)에 대한 발전을 발표할 것입니다.
전시회에서는 WLP 및 PLP용 ASYMTEK Vantage® 유체 분배 시스템의 다양한 구성도 강조되어 높은 처리량으로 정확한 분배 결과를 시연할 것입니다. 전문가들이 노드슨이 신뢰할 수 있는 반도체 제품 제조를 어떻게 지원할 수 있는지 논의할 수 있습니다. SEMICON 타이완은 2024년 9월 4일부터 6일까지 타이베이의 TaiNEX에서 개최됩니다.
Nordson Electronics Solutions présentera des technologies avancées de distribution de fluides pour l'emballage de semi-conducteurs lors de SEMICON Taïwan 2024, stand L0516. L'entreprise mettra en avant le système de distribution de fluides ASYMTEK Forte®, conçu pour une haute productivité et précision dans diverses applications d'emballage de semi-conducteurs. Nordson présentera également des développements pour l'emballage de niveau panneau à haut débit (PLP) et l'emballage de niveau wafer (WLP), abordant des défis tels que le gauchissement lors de la distribution de fluides.
Le salon mettra en valeur différentes configurations du système de distribution de fluides ASYMTEK Vantage® pour WLP et PLP, démontrant des résultats de distribution précis avec un haut débit. Des experts seront disponibles pour discuter de la façon dont Nordson peut soutenir la fabrication de produits semi-conducteurs fiables. Le SEMICON Taïwan est prévu du 4 au 6 septembre 2024, au TaiNEX, Taipei Taïwan.
Nordson Electronics Solutions wird fortschrittliche Flüssigkeitsdosiertechnologien für die Halbleiterverpackung auf der SEMICON Taiwan 2024, Stand L0516, präsentieren. Das Unternehmen wird das ASYMTEK Forte® Flüssigkeitsdosiersystem vorstellen, das für hohe Produktivität und Genauigkeit in verschiedenen Halbleiterverpackungsanwendungen konzipiert ist. Nordson wird auch Entwicklungen für Hochdurchsatz-Panel-Level-Verpackung (PLP) und Wafer-Level-Verpackung (WLP) präsentieren, um Herausforderungen wie Verformung bei der Flüssigkeitsdosierung zu bewältigen.
Die Ausstellung wird verschiedene Konfigurationen des ASYMTEK Vantage® Flüssigkeitsdosiersystems für WLP und PLP hervorheben und präzise Dosierergebnisse mit hoher Durchsatzleistung demonstrieren. Experten stehen zur Verfügung, um zu besprechen, wie Nordson die Herstellung zuverlässiger Halbleiterprodukte unterstützen kann. Die SEMICON Taiwan findet vom 4. bis 6. September 2024 im TaiNEX in Taipeh, Taiwan, statt.
- Showcasing advanced fluid dispensing technologies for semiconductor packaging
- Featuring high-productivity and accurate ASYMTEK Forte® fluid dispensing system
- Presenting solutions for high-throughput panel-level and wafer-level packaging
- Demonstrating precise dispense results with high throughput on ASYMTEK Vantage® system
- None.
- Visit booth #L0516 to discuss the latest developments in fluid dispensing for advanced semiconductor packaging
Technologies from Nordson Electronics Solutions are being developed to address challenges during the fluid dispensing process for semiconductor applications. Especially for wafer-level and panel-level packaging, these technologies ensure high-throughput, precise dispense results within the same footprint as current equipment. (Photo: Business Wire)
On display will be the ASYMTEK Forte® fluid dispensing system, configured for high productivity and accuracy for many semiconductor packaging and microelectronics manufacturing applications. The Forte system is ideal to tackle high-volume underfill, dispense gap fill, and sealing lines for fan-out/fan-in, strips, and module assembly.
Other featured technologies include developments for high-throughput panel-level packaging (PLP) and wafer-level packaging (WLP), and handling the challenges of warpage during fluid dispensing operations. Presentations will be available to show different configurations for WLP and PLP on the ASYMTEK Vantage® fluid dispensing system, and how these systems can successfully ensure precise dispense results with high throughput.
Experts will be ready to discuss how Nordson can support your manufacturing of reliable semiconductor products. SEMICON Taiwan will be held at TaiNEX,
About Nordson Electronics Solutions
Nordson Electronics Solutions makes reliable electronics an everyday reality. Through our ASYMTEK, MARCH, and SELECT brands, we supply the world's semiconductor, printed circuit board, and precision assembly manufacturers with the innovative fluid dispensing and surface treatment solutions they need to protect sensitive electronics. Day after day, year after year, across the globe, for 40 years, we've delivered cutting-edge engineering and applications excellence to help our customers succeed.
About Nordson Corporation
Nordson Corporation (NASDAQ: NDSN) is an innovative precision technology company that leverages a scalable growth framework to deliver top tier growth with leading margins and returns. The Company’s direct sales model and applications expertise serves global customers through a wide variety of critical applications. Its diverse end market exposure includes consumer non-durable, medical, electronics, and industrial end markets. Founded in 1954 and headquartered in
View source version on businesswire.com: https://www.businesswire.com/news/home/20240827315203/en/
Roberta Foster-Smith
Nordson Electronics Solutions
2747 Loker Ave West
Tel: +1.760.431.1919
Email: roberta.foster-smith@nordson.com
For information in
Alex Wu
Sales Director, ASYMTEK and SELECT Taiwan
Nordson Advanced Technology LLC,
Tel: +886.932.227.770
Email: alex.wu@nordson.com
Source: Nordson Electronics Solutions
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