Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
Micron Technology (MU) has broken ground on a new High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, representing an investment of approximately $7 billion through the end of the decade. The facility, the first of its kind in Singapore, is scheduled to begin operations in 2026, with significant capacity expansion planned for 2027 to meet growing AI demands.
The investment will initially create 1,400 jobs, with plans to expand to 3,000 positions, including roles in packaging development, assembly, and test operations. The facility will strengthen Singapore's semiconductor ecosystem and feature sustainable technologies including greenhouse gas abatement, water recycling, and waste circularity measures. The building will be highly automated with AI-based solutions and designed to meet LEED certification requirements.
Additionally, Micron plans to support long-term NAND manufacturing requirements in Singapore, with flexibility in managing capacity ramps for both HBM and NAND facilities based on market demand.
Micron Technology (MU) ha avviato la costruzione di una nuova struttura per il packaging avanzato della High-Bandwidth Memory (HBM) a Singapore, rappresentando un investimento di circa 7 miliardi di dollari entro la fine del decennio. L'impianto, il primo del suo genere a Singapore, è previsto che inizi le operazioni nel 2026, con un significativo ampliamento della capacità programmato per il 2027 per soddisfare la crescente domanda dell'AI.
L'investimento creerà inizialmente 1.400 posti di lavoro, con piani di espansione fino a 3.000 posizioni, comprese funzioni nello sviluppo del packaging, nell'assemblaggio e nelle operazioni di test. La struttura rafforzerà l'ecosistema dei semiconduttori di Singapore e presenterà tecnologie sostenibili, inclusi misure di riduzione dei gas serra, riciclo dell'acqua e circolarità dei rifiuti. L'edificio sarà altamente automatizzato con soluzioni basate sull'AI e progettato per soddisfare i requisiti di certificazione LEED.
Inoltre, Micron prevede di supportare i requisiti a lungo termine della produzione di NAND a Singapore, con flessibilità nella gestione degli aumenti di capacità sia per gli impianti HBM che NAND in base alla domanda di mercato.
Micron Technology (MU) ha comenzado la construcción de una nueva instalación de empaque avanzado para memoria de alta capacidad (HBM) en Singapur, representando una inversión de aproximadamente 7 mil millones de dólares hasta finales de la década. La instalación, la primera de su tipo en Singapur, tiene prevista su operación para 2026, con una expansión significativa de capacidad programada para 2027 para satisfacer la creciente demanda de IA.
La inversión inicialmente creará 1,400 empleos, con planes de expandirse a 3,000 puestos, incluidos roles en desarrollo de empaque, ensamblaje y operaciones de prueba. La instalación fortalecerá el ecosistema de semiconductores de Singapur y contará con tecnologías sostenibles que incluyen la reducción de gases de efecto invernadero, reciclaje de agua y medidas de circularidad de desechos. El edificio será altamente automatizado con soluciones basadas en IA y diseñado para cumplir con los requisitos de certificación LEED.
Además, Micron planea apoyar los requisitos de fabricación de NAND a largo plazo en Singapur, con flexibilidad para gestionar incrementos de capacidad tanto para las instalaciones de HBM como para las de NAND según la demanda del mercado.
마이크론 테크놀로지 (MU)가 싱가포르에 새로운 고대역폭 메모리 (HBM) 고급 패키징 시설을 건설하기 시작했습니다. 이는 10년 말까지 약 70억 달러의 투자를 나타냅니다. 이 시설은 싱가포르 최초의 시설로 2026년 운영을 시작할 예정이며, 2027년에는 AI 수요 증가에 대응하기 위한 상당한 용량 확장이 계획되어 있습니다.
이 투자로 초기에는 1,400개의 일자리가 창출되며, 향후 3,000개의 일자리로 확대할 계획입니다. 이에는 패키징 개발, 조립 및 테스트 운영 분야가 포함됩니다. 이 시설은 싱가포르의 반도체 생태계를 강화하고 온실가스 저감, 물 재활용 및 폐기물 순환 조치를 포함한 지속 가능한 기술을 특징으로 합니다. 이 건물은 AI 기반 솔루션으로 고도로 자동화되며 LEED 인증 요구 사항을 충족하도록 설계될 것입니다.
또한 마이크론은 싱가포르에서 장기적인 NAND 제조 요구 사항을 지원할 계획이며, 시장 수요에 따라 HBM 및 NAND 시설의 용량 증대 관리를 유연하게 운영할 것입니다.
Micron Technology (MU) a commencé la construction d'une nouvelle installation d'emballage avancé pour la mémoire à haute bande passante (HBM) à Singapour, représentant un investissement d'environ 7 milliards de dollars d'ici la fin de la décennie. L'installation, la première de son genre à Singapour, devrait commencer ses opérations en 2026, avec une importante expansion de capacité prévue pour 2027 afin de répondre à la demande croissante en IA.
L'investissement créera initialement 1.400 emplois, avec des projets d'expansion jusqu'à 3.000 postes, y compris des rôles dans le développement d'emballage, l'assemblage et les opérations de test. L'installation renforcera l'écosystème des semi-conducteurs de Singapour et comportera des technologies durables, notamment des mesures de réduction des gaz à effet de serre, de recyclage de l'eau et de circularité des déchets. Le bâtiment sera hautement automatisé avec des solutions basées sur l'IA et conçu pour répondre aux exigences de certification LEED.
De plus, Micron prévoit de soutenir les besoins de fabrication de NAND à long terme à Singapour, avec une flexibilité dans la gestion des augmentations de capacité pour les installations HBM et NAND en fonction de la demande du marché.
Micron Technology (MU) hat den Bau einer neuen fortschrittlichen Verpackungsanlage für High-Bandwidth Memory (HBM) in Singapur begonnen, was eine Investition von etwa 7 Milliarden US-Dollar bis zum Ende des Jahrzehnts darstellt. Die Anlage, die erste ihrer Art in Singapur, soll 2026 den Betrieb aufnehmen, mit einer erheblichen Kapazitätserweiterung, die für 2027 geplant ist, um der wachsenden Nachfrage nach KI gerecht zu werden.
Die Investition wird zunächst 1.400 Arbeitsplätze schaffen, mit Plänen zur Erweiterung auf 3.000 Positionen, einschließlich Rollen in der Verpackungsentwicklung, Montage und Testbetrieb. Die Anlage wird das Halbleiter-Ökosystem Singapurs stärken und nachhaltige Technologien wie Treibhausgasminderung, Wasserrückgewinnung und Abfallkreislaufmaßnahmen umfassen. Das Gebäude wird hochautomatisiert mit KI-basierten Lösungen und wird so konzipiert, dass es die Anforderungen für die LEED-Zertifizierung erfüllt.
Zusätzlich plant Micron, die langfristigen NAND-Herstellungsanforderungen in Singapur zu unterstützen, mit Flexibilität in der Verwaltung des Kapazitätsausbaus sowohl für HBM- als auch für NAND-Anlagen in Abhängigkeit von der Marktnachfrage.
- Major $7 billion investment in new HBM facility targeting growing AI market demand
- Creation of 1,400 initial jobs, expanding to 3,000 positions
- Strategic expansion of advanced packaging capacity starting 2027
- Flexibility to adjust HBM and NAND capacity based on market demand
- Significant capital expenditure requiring long-term return justification
- Operations won't begin until 2026, with meaningful capacity expansion in 2027
Insights
The
The Singapore location offers significant advantages: established semiconductor ecosystem, skilled workforce and strategic proximity to key Asian markets. The 3,000 planned jobs signal long-term commitment and will create valuable technical expertise in the region. The facility's dual-purpose capability for both HBM and NAND manufacturing provides important operational flexibility to adjust to market demands.
Most crucially, this positions Micron to capture a larger share of the rapidly growing AI memory market, currently dominated by SK Hynix and Samsung. The timing is strategic as AI infrastructure buildout accelerates globally.
The advanced packaging facility's technical specifications are particularly noteworthy. Integration of AI-based automation systems and LEED certification requirements indicates a state-of-the-art manufacturing approach that will likely yield superior quality control and operational efficiency. The greenhouse gas abatement and water recycling systems demonstrate forward-thinking sustainability integration that could reduce long-term operational costs.
The facility's location adjacent to existing operations creates valuable synergies in logistics and operational management. The planned automation level suggests significantly higher margins compared to traditional packaging facilities, with potential yield improvements of
This investment significantly strengthens Micron's competitive position in the high-margin HBM market. The timing is particularly strategic given the projected
The phased investment approach through 2030 helps manage capital allocation efficiently while maintaining strong balance sheet health. Expected return on investment should materialize by 2027-2028, coinciding with peak AI infrastructure buildout. This positions Micron to potentially capture
Approximate
SINGAPORE, Jan. 08, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore. Micron marked the occasion with a ceremony attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore Economic Development Board, Pee Beng Kong, Executive Vice President of the Singapore Economic Development Board, and Tan Boon Khai, CEO of JTC Corporation.
The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron’s total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth. The launch of this facility will further strengthen Singapore’s local semiconductor ecosystem and innovation.
“As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly,” said Sanjay Mehrotra, president and CEO of Micron. “With the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead.”
Micron’s HBM advanced packaging investment of approximately US
Png Cheong Boon, Chairman of the Singapore Economic Development Board, said, “We welcome this significant investment by Micron, which reflects its confidence in Singapore’s competitiveness as a critical node in the global semiconductor supply chain. This is Singapore’s first high-bandwidth memory advanced packaging facility, allowing us to contribute to global AI growth. It expands Singapore’s partnership with Micron and further strengthens the semiconductor ecosystem in Singapore.”
Micron’s future expansion plans in Singapore will also support long-term manufacturing requirements for NAND.
Micron will maintain flexibility in managing the pace of capacity ramps in both the HBM and NAND facilities to align with market demand.
Micron’s current facility in Singapore is the first front-end semiconductor fab in the world to be recognized as the Advanced Fourth Industrial Revolution Lighthouse and Sustainability Lighthouse by the World Economic Forum. The new HBM advanced packaging facility will be built in alignment with Micron’s sustainability commitments. It will feature technologies such as a greenhouse gas abatement, water recycling and waste circularity (reduce, reuse, recycle, recover). The new building will be highly automated through AI-based intelligent solutions and designed to meet the Leadership in Energy and Environmental Design (LEED) certification requirements.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence (AI) and compute-intensive applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com.
© 2025 Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are subject to change without notice. Micron, the Micron logo, and all other Micron trademarks are the property of Micron Technology, Inc. All other trademarks are the property of their respective owners.
Micron Media Relations Contact
Mark Plungy
Micron Technology, Inc.
+1 (408) 203-2910
mplungy@micron.com
Micron Investor Relations Contact
Satya Kumar
Micron Technology, Inc.
+1 (408) 450-6199
satyakumar@micron.com
FAQ
What is the total investment value of Micron's (MU) new Singapore HBM facility?
When will Micron's (MU) new Singapore HBM facility begin operations?
How many jobs will Micron's (MU) new Singapore facility create?
What type of manufacturing will Micron's (MU) new Singapore facility support?
What sustainability features will Micron's (MU) new Singapore HBM facility include?
