Welcome to our dedicated page for Micron Technology news (Ticker: MU), a resource for investors and traders seeking the latest updates and insights on Micron Technology stock.
Micron Technology, Inc. reports developments in memory and storage semiconductors for data centers, AI infrastructure, mobile and client devices, automotive systems, and embedded markets. The company’s updates center on DRAM, NAND, NOR, high-bandwidth memory, LPDDR memory, data center SSDs, and related storage products, including capacity and power-efficiency advances for compute-intensive workloads.
Recurring news also covers quarterly results by Cloud Memory, Core Data Center, Mobile and Client, and Automotive and Embedded units; customer and ecosystem collaborations; strategic investments tied to edge AI and physical AI; investor conference appearances; and balance-sheet actions such as cash tender offers for senior notes.
Micron (Nasdaq: MU) is sampling a 256GB DDR5 RDIMM built on its 1-gamma DRAM, targeting AI and HPC servers. The module supports up to 9,200 MT/s, over 40% faster than current volume DDR5, and uses advanced 3DS TSV packaging.
A single 256GB module can cut operating power by more than 40% compared with two 128GB modules, helping data centers stay within power and thermal limits. Micron is co-validating the module with key server ecosystem partners to ensure broad platform compatibility.
Micron (Nasdaq: MU) is shipping the 245TB Micron 6600 ION SSD, the company’s highest-capacity commercial SSD aimed at AI, cloud, enterprise and hyperscale workloads.
The 245TB drive claims 82% fewer racks versus HDDs, consumes up to 30W, and uses Micron G9 QLC NAND; Micron reports large lab-based energy and throughput gains versus HDD deployments.
Micron (Nasdaq: MU) announced executives will participate at the J.P. Morgan Global Technology, Media and Communications Conference in Boston on Wednesday, May 20, 2026 at 6:40 a.m. Mountain time. Live webcasts and replay access are available on Micron's investor relations website.
SiMa.ai announced a strategic investment from Micron (Nasdaq: MU) to scale production-ready Physical AI solutions on April 8, 2026. The collaboration integrates Micron LPDDR5X memory with SiMa.ai's Modalix MLSoC and makes SiMa.ai SoMs featuring Micron memory available to customers today.
The partnership targets edge use cases — robotics, autonomous systems and industrial automation — aiming to improve performance-per-watt through hardware-software co-optimization and SiMa.ai's Palette software.
Micron (Nasdaq:MU) announced that its cash tender offers for six series of senior notes expired on March 31, 2026, and that each series was validly tendered in aggregate.
The company expects to accept all validly tendered notes and to make payment on April 3, 2026. Aggregate principal amounts tendered total approximately $4.315 billion, with $140.085 million subject to guaranteed delivery procedures.
Micron (Nasdaq: MU) priced cash tender offers for six series of outstanding senior notes due 2031–2035, totaling $5.4 billion principal outstanding.
Notes Consideration ranges from $1,048.11 to $1,079.93 per $1,000, with settlement expected on April 3, 2026 and an Expiration Time of 5:00 p.m. ET on March 31, 2026.
Micron (Nasdaq: MU) commenced cash tender offers to purchase any and all of six series of its senior notes, totaling $5.4 billion in principal outstanding across maturities 2031–2035.
The offers expire at 5:00 p.m. ET on March 31, 2026 with settlement expected on April 3, 2026; accrued interest will be paid to, but not including, settlement.
Micron (Nasdaq: MU) reported record fiscal Q2 2026 results for the quarter ended Feb 26, 2026, with $23.86B revenue, GAAP net income of $13.79B (GAAP EPS $12.07) and non-GAAP net income of $14.02B (non-GAAP EPS $12.20).
Adjusted free cash flow was $6.9B, capital expenditures were $5.0B, cash and investments totaled $16.7B, and the board approved a 30% quarterly dividend increase to $0.15 per share. FQ3 guidance: revenue ~$33.5B ± $0.75B and diluted EPS around $18.90–$19.15.
Micron (Nasdaq: MU) announced high-volume production of AI-optimized memory and storage: HBM4 36GB 12H (volume shipments in Q1 2026) and HBM4 48GB 16H samples, PCIe Gen6 Micron 9650 SSD in volume, and SOCAMM2 192GB in production for NVIDIA Vera Rubin platforms.
Key specs: >11 Gb/s pin speeds, >2.8 TB/s bandwidth (2.3x vs HBM3E), >20% power efficiency improvement, 28 GB/s sequential read and 5.5M random read IOPS for the 9650, and SOCAMM2 scaling to 48–256GB.
Micron (Nasdaq: MU) completed its acquisition of Powerchip’s P5 Tongluo site in Taiwan on March 15, 2026, adding an existing ~300,000 square feet of 300mm cleanroom space to its Taichung mega campus.
Retrofitting begins in March 2026, the site is slated to support meaningful product shipments beginning in fiscal 2028, and Micron plans a second facility of about 270,000 square feet with construction starting by the end of fiscal 2026.