Welcome to our dedicated page for Micron Technology news (Ticker: MU), a resource for investors and traders seeking the latest updates and insights on Micron Technology stock.
Micron Technology, Inc. (NASDAQ: MU) is a major semiconductor manufacturer focused on memory and storage solutions, and its news flow reflects this role at the center of the data economy and AI adoption. The company regularly issues updates on its DRAM, NAND and NOR product portfolio, as well as announcements tied to AI data centers, automotive applications and strategic manufacturing investments.
Investors and observers following MU news can expect quarterly earnings releases and outlook updates, typically furnished via Form 8‑K, where Micron discusses revenue trends, margins, cash flow and guidance. These releases often highlight performance across its Cloud Memory, Core Data Center, Mobile and Client, and Automotive and Embedded business units, along with commentary on demand driven by AI and compute‑intensive workloads.
Micron’s news stream also features product announcements, such as low‑power DRAM modules for AI data centers, automotive UFS 4.1 storage built on G9 NAND, and Crucial‑branded gaming memory. These stories detail technical attributes like bandwidth, power efficiency, endurance and compliance with automotive safety and cybersecurity standards, illustrating how Micron’s technology is applied in real‑world systems.
Corporate developments are another recurring theme, including board of directors updates, decisions about portfolio focus such as the planned exit from the Crucial consumer business, and participation in investor conferences. News about large‑scale manufacturing projects, notably the planned New York megafab, provides insight into Micron’s long‑term capacity and geographic footprint.
By monitoring this MU news page, readers can follow how Micron communicates its financial performance, product roadmap, governance changes and strategic investments that shape its position in the semiconductor and AI ecosystems.
Micron (Nasdaq:MU) announced that its cash tender offers for six series of senior notes expired on March 31, 2026, and that each series was validly tendered in aggregate.
The company expects to accept all validly tendered notes and to make payment on April 3, 2026. Aggregate principal amounts tendered total approximately $4.315 billion, with $140.085 million subject to guaranteed delivery procedures.
Micron (Nasdaq: MU) priced cash tender offers for six series of outstanding senior notes due 2031–2035, totaling $5.4 billion principal outstanding.
Notes Consideration ranges from $1,048.11 to $1,079.93 per $1,000, with settlement expected on April 3, 2026 and an Expiration Time of 5:00 p.m. ET on March 31, 2026.
Micron (Nasdaq: MU) commenced cash tender offers to purchase any and all of six series of its senior notes, totaling $5.4 billion in principal outstanding across maturities 2031–2035.
The offers expire at 5:00 p.m. ET on March 31, 2026 with settlement expected on April 3, 2026; accrued interest will be paid to, but not including, settlement.
Micron (Nasdaq: MU) reported record fiscal Q2 2026 results for the quarter ended Feb 26, 2026, with $23.86B revenue, GAAP net income of $13.79B (GAAP EPS $12.07) and non-GAAP net income of $14.02B (non-GAAP EPS $12.20).
Adjusted free cash flow was $6.9B, capital expenditures were $5.0B, cash and investments totaled $16.7B, and the board approved a 30% quarterly dividend increase to $0.15 per share. FQ3 guidance: revenue ~$33.5B ± $0.75B and diluted EPS around $18.90–$19.15.
Micron (Nasdaq: MU) announced high-volume production of AI-optimized memory and storage: HBM4 36GB 12H (volume shipments in Q1 2026) and HBM4 48GB 16H samples, PCIe Gen6 Micron 9650 SSD in volume, and SOCAMM2 192GB in production for NVIDIA Vera Rubin platforms.
Key specs: >11 Gb/s pin speeds, >2.8 TB/s bandwidth (2.3x vs HBM3E), >20% power efficiency improvement, 28 GB/s sequential read and 5.5M random read IOPS for the 9650, and SOCAMM2 scaling to 48–256GB.
Micron (Nasdaq: MU) completed its acquisition of Powerchip’s P5 Tongluo site in Taiwan on March 15, 2026, adding an existing ~300,000 square feet of 300mm cleanroom space to its Taichung mega campus.
Retrofitting begins in March 2026, the site is slated to support meaningful product shipments beginning in fiscal 2028, and Micron plans a second facility of about 270,000 square feet with construction starting by the end of fiscal 2026.
Micron (Nasdaq: MU) began shipping customer samples of the world’s first 256GB SOCAMM2 LPDRAM module on March 3, 2026, enabled by a monolithic 32Gb LPDDR5X die. The module delivers 2TB per 8-channel CPU, one-third the power and one-third the footprint of equivalent RDIMMs, and targets AI and HPC servers.
Micron cites 2.3x faster time to first token for long-context LLM inference and 3x better performance per watt in standalone CPU HPC workloads; the design supports serviceability and liquid-cooled architectures.
Micron (NASDAQ: MU) opened India’s first semiconductor assembly and test facility in Sanand, Gujarat on February 28, 2026. The site has over 500,000 sq ft of cleanroom space, began commercial production, and represents a combined investment of approximately $2.75 billion.
Micron expects to assemble and test tens of millions of chips in 2026, scaling to hundreds of millions in 2027, delivered to global customers; the site is ISO 9001:2015 certified and designed to meet LEED Gold with zero liquid discharge.
Micron Technology (Nasdaq: MU) will report fiscal second quarter results and host an earnings conference call on Wednesday, March 18, 2026 at 2:30 p.m. Mountain time. The call will be webcast live, and presentation replays will be available on the company's investor relations website for about one year.
Micron (Nasdaq: MU) said company executives will participate at the Wolfe Research Auto, Auto Tech and Semiconductor Conference in New York on Wednesday, February 11, 2026 at 6:50 a.m. Mountain time.
Live webcasts and replays will be available via Micron's investor relations site at investors.micron.com.