Marvell to Showcase Accelerated Infrastructure for AI at 2024 OCP Global Summit
Marvell Technology (NASDAQ: MRVL) will showcase its accelerated infrastructure portfolio at the 2024 OCP Global Summit in San Jose, California, from October 15-17. The company will demonstrate how its innovations enable the next generation of AI and cloud data centers. Marvell will exhibit next-generation silicon technologies, including PAM4 DSPs, PCIe retimers, Ethernet network switches, and CXL devices, designed to meet the scaling requirements of AI-driven workloads and optimize cloud network performance.
Visitors to Marvell's booth B1 can explore products such as Alaska 1.6T PAM4 DSPs, PCIe Gen 6 retimers, COLORZ 800 ZR/ZR+ modules, and Teralynx Ethernet switches. Marvell experts will lead discussions on topics like scaling interconnect and memory for AI clusters, overcoming computing's memory challenges, and open network switching for hyperscale cloud AI infrastructure. The event will feature keynote panels, expo hall sessions, and workshops focusing on various aspects of AI and cloud connectivity.
Marvell Technology (NASDAQ: MRVL) presenterà il suo portafoglio di infrastrutture accelerate al 2024 OCP Global Summit a San Jose, California, dal 15 al 17 ottobre. L'azienda mostrerà come le sue innovazioni abilitino la prossima generazione di centri dati AI e cloud. Marvell esporrà tecnologie silicio di nuova generazione, tra cui PAM4 DSP, retimer PCIe, switch di rete Ethernet e dispositivi CXL, progettati per soddisfare le esigenze di scalabilità dei carichi di lavoro guidati dall'AI e ottimizzare le prestazioni della rete cloud.
I visitatori dello stand B1 di Marvell possono esplorare prodotti come DSP PAM4 Alaska 1.6T, retimer PCIe Gen 6, moduli COLORZ 800 ZR/ZR+ e switch Ethernet Teralynx. Esperti di Marvell guideranno discussioni su argomenti come scalabilità dell'interconnessione e memoria per cluster AI, superamento delle sfide di memoria nel computing e switching di rete aperto per infrastrutture cloud AI hyperscale. L'evento presenterà pannelli di apertura, sessioni nella sala esposizioni e workshop focalizzati su vari aspetti della connettività AI e cloud.
Marvell Technology (NASDAQ: MRVL) presentará su cartera de infraestructura acelerada en la Cumbre Global OCP 2024 en San José, California, del 15 al 17 de octubre. La compañía demostrará cómo sus innovaciones permiten la próxima generación de centros de datos de IA y en la nube. Marvell exhibirá tecnologías de silicio de última generación, incluidos PAM4 DSP, retimores PCIe, conmutadores de red Ethernet y dispositivos CXL, diseñados para cumplir con los requisitos de escalabilidad de las cargas de trabajo impulsadas por IA y optimizar el rendimiento de la red en la nube.
Los visitantes al stand B1 de Marvell pueden explorar productos como DSP PAM4 Alaska 1.6T, retimores PCIe Gen 6, módulos COLORZ 800 ZR/ZR+ y conmutadores Ethernet Teralynx. Expertos de Marvell liderarán discusiones sobre temas como escalabilidad de interconexiones y memoria para clústeres de IA, superación de los desafíos de memoria en la computación y conmutación de redes abiertas para infraestructuras de nube AI a gran escala. El evento contará con paneles principales, sesiones en el salón de exposiciones y talleres centrados en diversos aspectos de la conectividad de IA y la nube.
마벨 테크놀로지(Marvell Technology, NASDAQ: MRVL)는 10월 15일부터 17일까지 캘리포니아 산호세에서 열리는 2024 OCP 글로벌 서밋에서 가속화된 인프라 포트폴리오를 선보일 예정입니다. 이 회사는 자사의 혁신이 AI 및 클라우드 데이터 센터의 차세대 구축을 어떻게 가능하게 하는지 보여줄 것입니다. 마벨은 AI 기반 워크로드의 확장 요구를 충족하고 클라우드 네트워크 성능을 최적화하기 위해 설계된 PAM4 DSP, PCIe 리타이머, 이더넷 네트워크 스위치 및 CXL 장치 등 차세대 실리콘 기술을 전시합니다.
마벨 부스 B1을 방문하는 고객은 1.6T PAM4 DSP 알래스카, PCIe Gen 6 리타이머, COLORZ 800 ZR/ZR+ 모듈, 테랄링크 이더넷 스위치와 같은 제품을 탐색할 수 있습니다. 마벨 전문가들은 AI 클러스터를 위한 인터커넥션 및 메모리 확장, 컴퓨팅의 메모리 문제 극복, 그리고 하이퍼스케일 클라우드 AI 인프라를 위한 오픈 네트워크 스위칭과 같은 주제에 대해 논의할 것입니다. 이 이벤트는 키노트 패널, 전시홀 세션 및 AI 및 클라우드 연결의 다양한 측면에 초점을 맞춘 워크숍으로 구성됩니다.
Marvell Technology (NASDAQ: MRVL) présentera son portefeuille d'infrastructure accélérée lors du Sommet Mondial OCP 2024 à San José, Californie, du 15 au 17 octobre. La société démontrera comment ses innovations permettent la prochaine génération de centres de données AI et cloud. Marvell exposera des technologies à base de silicium de nouvelle génération, y compris PAM4 DSP, retimers PCIe, commutateurs réseau Ethernet et dispositifs CXL, conçus pour répondre aux exigences d'évolutivité des charges de travail alimentées par l'IA et optimiser les performances du réseau cloud.
Les visiteurs du stand B1 de Marvell pourront explorer des produits tels que les DSP PAM4 Alaska 1.6T, les retimers PCIe Gen 6, les modules COLORZ 800 ZR/ZR+ et les commutateurs Ethernet Teralynx. Des experts de Marvell dirigeront des discussions sur des sujets tels que l'évolutivité de l'interconnexion et de la mémoire pour les clusters AI, la surmonter des défis de mémoire en informatique et le changement de réseau ouvert pour les infrastructures cloud AI hyperscale. L'événement comprendra des panels d'ouverture, des sessions dans le hall d'exposition et des ateliers axés sur divers aspects de la connectivité AI et cloud.
Marvell Technology (NASDAQ: MRVL) wird sein beschleunigtes Infrastruktursortiment auf dem OCP Global Summit 2024 in San Jose, Kalifornien, vom 15. bis 17. Oktober präsentieren. Das Unternehmen wird demonstrieren, wie seine Innovationen die nächste Generation von AI- und Cloud-Rechenzentren ermöglichen. Marvell wird Siliziumtechnologien der nächsten Generation ausstellen, darunter PAM4 DSPs, PCIe Retimer, Ethernet-Netzwerkswitches und CXL-Geräte, die darauf ausgelegt sind, die Skalierungsanforderungen von AI-gesteuerten Workloads zu erfüllen und die Netzwerkleistung in der Cloud zu optimieren.
Besucher am Stand B1 von Marvell können Produkte wie Alaska 1.6T PAM4 DSPs, PCIe Gen 6 Retimer, COLORZ 800 ZR/ZR+ Module und Teralynx Ethernet-Switches erkunden. Experten von Marvell werden Diskussionen zu Themen wie Skalierung von Interkonnektivität und Speicher für AI-Cluster, Überwindung von Speicherrisiken in der Berechnung und offene Netzwerktechnologien für hyperscale Cloud AI-Infrastrukturen leiten. Die Veranstaltung wird Keynote-Panels, Sessions in der Ausstellungshalle und Workshops anbieten, die sich mit verschiedenen Aspekten der AI- und Cloud-Konnektivität befassen.
- Marvell is showcasing advanced technologies for AI and cloud data centers
- The company is presenting next-generation silicon technologies to meet AI-driven workload requirements
- Marvell experts are leading discussions on critical topics in AI and cloud infrastructure
- None.
Data Center Portfolio Powers the Next Generation of AI and Cloud
At the 2024 OCP Global Summit, Marvell will showcase next-generation silicon technologies, including PAM4 DSPs, PCIe retimers, Ethernet network switches, and Compute Express Link® (CXL) devices. These innovations are designed to meet the scaling requirements of AI-driven workloads, optimize cloud network performance, and address the evolving needs of data centers globally.
Join Marvell at the 2024 OCP Global Summit in
Visit booth B1 to discover how the Marvell accelerated infrastructure portfolio is driving the future of AI and cloud networks. Products and solutions include:
Alaska ® 1.6T PAM4 DSPs for AECs- Alaska PCIe Gen 6 retimers and Gen 7 SerDes
- COLORZ® 800 ZR/ZR+ modules for data center interconnect
- Nova and Spica PAM4 DSPs for AI and cloud connectivity
- Orion coherent DSP for DCI modules
- Teralynx® Ethernet switches for cloud and AI networking
Marvell experts will lead several discussions and sessions focused on scaling accelerated infrastructure:
- Keynote Panel: Scaling Interconnect and Memory for AI Clusters
Date: Tuesday, October 15, 2024
Time: 9:36 a.m.
Location: Concourse Level - Grand Ballroom 220
Marvell panelist: Nigel Alvares, Vice President, Global Marketing - Marvell® Structera™: Overcoming Computing's Memory Challenges with Optimized CXL Devices
Date: Tuesday, October 15, 2024
Time: 2:40 p.m.
Location: Lower Level – LL 20A
Marvell presenter: Khurram Malik, Director, Product Marketing - Expo Hall Session: DSPs in AI and Cloud Connectivity
Date: Tuesday, October 15, 2024
Time: 4:25 p.m.
Location: Concourse Level – Expo Hall Stage
Marvell presenter: Venu Balasubramonian, Vice President of Product Marketing, Connectivity Business Unit - Executive Session: Open Network Switching for Hyperscale Cloud AI Infrastructure
Date: Tuesday, October 15, 2024
Time: 4:40 p.m.
Location: Concourse Level – 210DH
Marvell presenter: Nick Kucharewski, Senior Vice President and General Manager of the Network Switching Business Unit - AI/HPC Future Fabrics Panel
Date: Wednesday, October 16, 2024
Time: 9:40 a.m.
Location: Lower Level – LL20BC
Marvell panelist: Jack Harwood, Senior Distinguished Engineer - Panel: What is the Right Path Forward for the Industry?
Date: Wednesday, October 16, 2024
Time: 11:00 a.m.
Location: Concourse Level – 220C
Marvell panelist: Dr. Loi Nguyen, Executive Vice President and General Manager, Cloud Optics - Workshop: Leverage the Full Ecosystem to Enable AI
Date: Wednesday, October 16, 2024
Time: 12:30 p.m.
Location: Lower Level – LL20D
Marvell presenter: Jack Harwood, Senior Distinguished Engineer - Panel: Open Compute Components Executive Panel: Delivering AI Systems at Scale in A Multi-Vendor Environment
Date: Thursday, October 17, 2024
Time: 8:20 a.m.
Location: Concourse Level – 220C
Marvell panelist: Dr. Loi Nguyen, Executive Vice President and General Manager, Cloud Optics - Memory wall mitigation and acceleration of AI workloads, and in-memory databases using CXL Near Memory Compute accelerator
Date: Thursday, October 17, 2024
Time: 12:30 p.m.
Location: Concourse Level – 210BF
Marvell presenter: Gaurav Agarwal, Sr. Director Engineering
About Marvell
To deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.
Marvell and the M logo are trademarks of Marvell or its affiliates. Please visit www.marvell.com for a complete list of Marvell trademarks. Other names and brands may be claimed as the property of others.
This press release contains forward-looking statements within the meaning of the federal securities laws that involve risks and uncertainties. Forward-looking statements include, without limitation, any statement that may predict, forecast, indicate or imply future events, results or achievements. Actual events, results or achievements may differ materially from those contemplated in this press release. Forward-looking statements are only predictions and are subject to risks, uncertainties and assumptions that are difficult to predict, including those described in the "Risk Factors" section of our Annual Reports on Form 10-K, Quarterly Reports on Form 10-Q and other documents filed by us from time to time with the SEC. Forward-looking statements speak only as of the date they are made. Readers are cautioned not to put undue reliance on forward-looking statements, and no person assumes any obligation to update or revise any such forward-looking statements, whether as a result of new information, future events or otherwise.
For further information, contact:
Kim Markle
pr@marvell.com
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