Marvell Extends Connectivity Leadership for Accelerated Infrastructure with 200G/Lane Partner Demonstrations at DesignCon
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Insights
The integration of Marvell's 224G long-reach (LR) DSP SerDes technology into copper interconnects is a significant advancement for data center infrastructure, particularly in the context of the burgeoning demand for AI and cloud services. The projected growth rates of networking bandwidth and AI-specific bandwidth underscore the urgency for such technological improvements. This development is likely to be well-received by cloud service providers who are currently facing the challenge of upgrading their infrastructure to keep pace with the exponential growth in data processing requirements.
From a market perspective, the successful demonstration of 200G/lane copper links could signal an impending shift in data center design and operation. The ability to double the I/O lane speed with existing copper infrastructure not only enhances efficiency but also offers a cost-effective alternative to more expensive fiber optic solutions. The expected growth in AEC silicon revenue, as forecasted by the 650 Group, suggests a robust market opportunity for companies like Marvell and its partners.
For investors, the focus should be on the potential market share gains for Marvell and its partners within the data center connectivity space. The adoption of these technologies could create a competitive advantage and possibly lead to increased revenue streams. However, it is also important to monitor the execution of these technological rollouts and the adoption rate among cloud service providers.
The technical leap to 200G/lane copper interconnects represents a doubling of bandwidth capabilities over the current 100G/lane systems, which is a substantial increase in data throughput. Marvell's advancements in DSP SerDes technology, particularly with the move to production on 3nm processes, position the company at the forefront of semiconductor innovation for data center applications. This move aligns with the industry's trend towards higher performance and greater energy efficiency.
The use of advanced PAM4 DSP technology enables higher data rates over copper, which has traditionally been limited by signal integrity issues at high frequencies. The extension of copper's viability with active electrical cables (AECs) is particularly noteworthy, as it suggests that copper can continue to be a relevant medium for high-speed data transmission in data centers despite the rise of optical interconnects.
For stakeholders, the implications are twofold: on the one hand, there is the prospect of extending the lifecycle of existing copper-based infrastructure and on the other, there is the potential for reducing capital expenditures by delaying or avoiding the transition to more expensive interconnect technologies. It's crucial to assess how these advancements in copper interconnect technology might influence the competitive landscape of semiconductor and data center infrastructure providers.
Marvell Technology's demonstration of 200G/lane copper interconnects, in collaboration with its partners, can be seen as a strategic move to capture a larger share of the data center infrastructure market. This technology is poised to meet the high-speed demands of next-generation data centers, which could lead to increased sales and potentially higher margins if the cost of implementation remains lower than fiber optic alternatives.
The financial implications for Marvell and its partners, such as Amphenol, Keysight Technologies, Molex and TE Connectivity, include the potential for revenue growth driven by the adoption of their 200G/lane solutions. The forecasted $1 billion AEC silicon revenue by 2028 indicates a significant market opportunity. The financial performance of these companies may be positively impacted if they can secure a first-mover advantage and establish a dominant position in this emerging market segment.
Investors should consider the scalability of this technology and its impact on the overall profitability of the companies involved. It is also important to evaluate the risks associated with the rapid pace of technological change in the semiconductor industry and the potential for subsequent innovations to render current advancements obsolete.
Amphenol, Keysight Technologies, Molex and TE Connectivity showcase 200G/lane copper links with Marvell DSPs for increasing data center bandwidth
The demonstrations are taking place during DesignCon at the
Cloud service providers are undertaking wide-ranging infrastructure upgrades to accommodate the insatiable demand for generative AI and other services. Networking bandwidth in the cloud is growing at over
Electrical copper cables are used for short reach (0-5m) server to top-of-rack switch connectivity and for certain cloud-optimized intra-rack interconnects in data centers. Boosting baseline I/O lane speed to 200G/lane represents a 2x increase in bandwidth over current leading-edge 100G/lane systems. Marvell 200G/lane LR DSP SerDes are expected to be incorporated into a wide range of networking platforms that will extend the reach of copper links with cabled-backplane, cabled-host connections and other cabling solutions. Marvell 200G/lane LR DSP SerDes will also extend copper connectivity bandwidth and enable 1.6T Active Electrical Cables (AECs).
"Driven by the market's need for increased speed, Molex is collaborating with Marvell to deliver an industry-leading, comprehensive 224G connector, cable, and backplane portfolio that ensures optimal channel performance for AI, machine learning (ML) and 1.6T high-speed applications," said Vivek Shah, director, New Product Development, Molex.
"Keysight is working with its partners and standard bodies to enable the next generation high-performance computing infrastructure to cope with the rapidly expanding computing and networking needs to support the upcoming AI applications," said Dr. Joachim Peerlings, vice president and general manager of Keysight's Network and Data Center Solutions Group.
"Active electrical technology extends the life of copper in data centers," said Alan Weckel, co-founder of 650 Group. "It will quickly become one of the standard building blocks for data centers. AEC silicon revenue is expected to grow at
Marvell is a leader in AEC and DSP technology. In March 2022, Marvell released the
"Virtually every class of connection in the cloud—from connections between distant data centers to connections between components within a chip package—will be transformed over the next several years. Active electrical cable (AEC) connectivity will be a critical component for short reach interconnects at 200G," said Venu Balasubramonian, vice president of product marketing for the High Speed Connectivity Group at Marvell. "We are actively collaborating with our ecosystem partners and our hyperscale customers to deploy 200G/lane copper interconnect technologies to enable the scaling of bandwidth needed to keep up with the pace of AI innovation."
Demos at DesignCon
Amphenol (booth 833)
Amphenol, in collaboration with Marvell, will be showcasing a live demonstration of a cabled-fabric across multiple applications within a data center rack. The demonstration will feature Amphenol Paladin®HD2 right-angle female (RAF) board mount connector, a Paladin®HD2 pass-thru cable assembly, and UltraPass™. UltraPass™ is Amphenol's newest OverPass™ solution for providing high-density, 224 Gb/s performance for near-ASIC interfaces.
Keysight Technologies (booth 1039)
In order to process the large datasets associated with AI and large language models, bandwidth improvements are needed in both the compute-oriented interfaces as well as those used to enable higher speed data networks. Keysight and Marvell will demonstrate the testing and validation of next-gen SerDes designs running at 212 Gbps per lane which are used to enable high-performance computing. This demo will be based on the latest development of the OIF-CEI 224G and IEEE 802.3dj standard bodies.
Molex (booth 739)
Through the collaboration with Marvell, Molex is demonstrating an OSFP SMT and DAC channel, OSFP BiPass/Flyover internal cable solution, and iHD backplane capabilities, all driven by Marvell 200G LR SerDes. In addition, Molex plans to adopt Marvell 200G DSP technology for the next evolution of Active Electrical Cables (AECs).
TE Connectivity (booth 913)
TE is showcasing a cabled backplane architecture plus over-the-board (OTB) near-chip connectivity, utilizing 224G AdrenaLINE Catapult near-chip connector and AdrenaLINE Slingshot cabled backplane connector (cable-to-cable and cable-to-board). The demo is being driven by Marvell 224 Gbps DSP SerDes silicon.
1. 650 Group, DC Semiconductors Report Nov 29, 2023.
About Marvell
To deliver the data infrastructure technology that connects the world, we're building solutions on the most powerful foundation: our partnerships with our customers. Trusted by the world's leading technology companies for over 25 years, we move, store, process and secure the world's data with semiconductor solutions designed for our customers' current needs and future ambitions. Through a process of deep collaboration and transparency, we're ultimately changing the way tomorrow's enterprise, cloud, automotive, and carrier architectures transform—for the better.
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FAQ
What is the purpose of the collaboration between Marvell Technology and its partners at DesignCon?
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What is Marvell's role in the growth of AEC silicon revenue?
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What previous releases demonstrate Marvell's leadership in AEC and DSP technology?
