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Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems

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Microchip Technology (Nasdaq: MCHP) and Acacia have demonstrated the fourth generation of interoperability between Microchip's META-DX2 Ethernet PHY family and Acacia's Coherent Interconnect Module 8 (CIM 8). This collaboration aims to enable optimized terabit-scale data center interconnect systems, addressing the increasing bandwidth requirements between data centers. The interoperable devices offer three key benefits:

1. Optimized DCI bandwidth through Lambda Splitting feature
2. Reduced design risk with verified SerDes interoperation
3. Better support for full bandwidth, multi-rate operation

This partnership helps accelerate and optimize the build-out of cloud computing and AI-ready optical networks while reducing development risk for customers.

Microchip Technology (Nasdaq: MCHP) e Acacia hanno dimostrato la quarta generazione di interoperabilità tra la famiglia di PHY Ethernet META-DX2 di Microchip e il Modulo di Interconnessione Coerente 8 (CIM 8) di Acacia. Questa collaborazione si propone di abilitare sistemi di interconnessione per data center ottimizzati a livello terabit, rispondendo alle crescenti esigenze di larghezza di banda tra i data center. I dispositivi interoperabili offrono tre vantaggi chiave:

1. Larghezza di banda DCI ottimizzata attraverso la funzionalità di Lambda Splitting
2. Riduzione del rischio di progettazione con interop operativa SerDes verificata
3. Maggiore supporto per operazioni multi-rate a piena larghezza di banda

Questa partnership aiuta ad accelerare e ottimizzare l'espansione delle reti ottiche pronte per il cloud computing e l'AI, riducendo al contempo il rischio di sviluppo per i clienti.

Microchip Technology (Nasdaq: MCHP) y Acacia han demostrado la cuarta generación de interoperabilidad entre la familia de PHY Ethernet META-DX2 de Microchip y el Módulo de Interconexión Coherente 8 (CIM 8) de Acacia. Esta colaboración tiene como objetivo habilitar sistemas de interconexión optimizados a nivel terabit para centros de datos, abordando los crecientes requisitos de ancho de banda entre los centros de datos. Los dispositivos interoperables ofrecen tres beneficios clave:

1. Ancho de banda DCI optimizado a través de la función de División de Lambda
2. Reducción del riesgo de diseño con verificación de interoperabilidad SerDes
3. Mejor soporte para operación multi-tasa a ancho de banda completo

Esta asociación ayuda a acelerar y optimizar la construcción de redes ópticas listas para la computación en la nube y la IA, mientras reduce el riesgo de desarrollo para los clientes.

마이크로칩 기술 (Nasdaq: MCHP)와 아카시아는 마이크로칩의 META-DX2 이더넷 PHY 제품군과 아카시아의 Coherent Interconnect Module 8 (CIM 8) 간의 상호 운용성 4세대를 입증했습니다. 이 협력은 데이터 센터 간의 증가하는 대역폭 요구를 해결하여 테라비트 규모의 인터커넥트 시스템을 최적화하는 것을 목표로 합니다. 상호 운용 가능한 장치는 세 가지 주요 이점을 제공합니다:

1. 람다 분할 기능을 통한 최적화된 DCI 대역폭
2. 검증된 SerDes 상호 운용성으로 설계 위험 감소
3. 전체 대역폭, 멀티 레이트 운영에 대한 더 나은 지원

이 파트너십은 클라우드 컴퓨팅 및 AI 준비가 된 광 네트워크의 구축을 가속화하고 최적화하며, 고객을 위한 개발 위험을 줄이는 데 도움을 줍니다.

Microchip Technology (Nasdaq: MCHP) et Acacia ont démontré la quatrième génération d'interopérabilité entre la famille de PHY Ethernet META-DX2 de Microchip et le Module d'Interconnexion Coherent 8 (CIM 8) d'Acacia. Cette collaboration vise à permettre des systèmes d'interconnexion de centres de données optimisés à l'échelle terabit, répondant aux besoins croissants en bande passante entre les centres de données. Les dispositifs interopérables offrent trois avantages clés :

1. Bande passante DCI optimisée grâce à la fonctionnalité de division de lambda
2. Risque de conception réduit grâce à l'interopérabilité SerDes vérifiée
3. Meilleur soutien pour un fonctionnement multi-débit à bande passante pleine

Ce partenariat contribue à accélérer et à optimiser le déploiement de réseaux optiques prêts pour le cloud computing et l'IA, tout en réduisant le risque de développement pour les clients.

Microchip Technology (Nasdaq: MCHP) und Acacia haben die vierte Generation der Interoperabilität zwischen der META-DX2 Ethernet PHY-Familie von Microchip und dem Coherent Interconnect Module 8 (CIM 8) von Acacia demonstriert. Diese Zusammenarbeit soll optimierte Terabit-Interconnect-Systeme für Rechenzentren ermöglichen und die steigenden Bandbreitenanforderungen zwischen den Rechenzentren ansprechen. Die interoperablen Geräte bieten drei Hauptvorteile:

1. Optimierte DCI-Bandbreite durch die Lambda-Splitting-Funktion
2. Reduziertes Entwurfsrisiko durch verifizierte SerDes-Interoperabilität
3. Bessere Unterstützung für vollwertigen, Multi-Rate-Betrieb

Diese Partnerschaft hilft, den Ausbau von Cloud-Computing- und KI-bereiten optischen Netzwerken zu beschleunigen und zu optimieren, während das Entwicklungsrisiko für die Kunden gesenkt wird.

Positive
  • Interoperability between Microchip's META-DX2 and Acacia's CIM 8 enables low-power, bandwidth-optimized solutions
  • META-DX2+ PHY's Lambda Splitting feature maximizes capacity between data centers
  • Verified SerDes interoperation up to 112G per lane reduces design validation requirements
  • META-DX2 integrates 1.6T of encryption, port aggregation, and Lambda Splitting in a compact 112G PAM4 device
Negative
  • None.

Insights

This collaboration between Microchip and Acacia marks a significant advancement in data center interconnect (DCI) technology. The interoperability of Microchip's META-DX2 Ethernet PHY and Acacia's CIM 8 module addresses the growing bandwidth demands of modern data centers, particularly for AI and cloud computing applications.

Key technical benefits include:

  • Optimized DCI bandwidth through Lambda Splitting, enabling configurations like 3x800 GbE over 2x1.2 Tbps waves
  • Reduced design risk with verified SerDes interoperation at up to 112G per lane
  • Support for full bandwidth, multi-rate operation from 100 GbE to 800 GbE

This partnership could potentially accelerate the deployment of high-capacity optical networks, important for handling the exponential growth in data traffic. For investors, this positions both companies favorably in the rapidly evolving data center and telecom infrastructure markets.

The collaboration between Microchip and Acacia is strategically significant in the evolving data center market. With the global data center market projected to grow at a CAGR of 13.8% from 2021 to 2028, this partnership addresses a critical need for higher bandwidth and efficient interconnect solutions.

Key market implications:

  • Potential for increased market share in the data center interconnect segment
  • Competitive advantage through reduced time-to-market for customers
  • Alignment with the trend towards AI and cloud computing, which require high-bandwidth solutions

For investors, this collaboration signals Microchip's commitment to innovation in a high-growth sector. However, the impact on short-term financials may be , as the adoption cycle for such technologies can be gradual in the telecom and data center industries.

The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems

CHANDLER, Ariz., Aug. 13, 2024 (GLOBE NEWSWIRE) -- The latest data center architectures and increased traffic are driving higher bandwidth requirements between data centers. To address this challenge, system developers must streamline the development of a new generation of 1.2 Tbps (1.2T) transport solutions across a wide range of client configurations. This requires that today’s terabit-scale Ethernet PHY devices and coherent optical modules interoperate with each other in Data Center Interconnect (DCI) and metro transport networks. Microchip Technology (Nasdaq: MCHP) today announces that it has worked with Acacia to demonstrate the fourth generation of interoperability between Microchip’s META-DX2 Ethernet PHY family and Acacia’s Coherent Interconnect Module 8 (CIM 8).

The two companies’ interoperable devices enable low-power, bandwidth-optimized, scalable solutions for pluggable optics in DCI and transport networks. They deliver three key benefits as they jointly enable high-capacity, multi-rate muxponders for optical transport platforms:

  • Optimized DCI bandwidth: The META-DX2 family, through its META-DX2+ PHY, uses its unique Lambda Splitting feature to split 400 GbE or 800 GbE clients across multiple wavelengths driven by the CIM8 modules. This maximizes the capacity between data centers in rate configurations such as 3x800 GbE over 2x1.2 Tbps waves or 5x400 GbE over 2x1.0 Tbps waves.
  • Reduced design risk: Microchip and Acacia have jointly verified successful SerDes interoperation at up to 112G per lane for Ethernet and OTN clients, which reduces design validation and system qualification requirements.
  • Better support for full bandwidth, multi-rate operation: The META-DX2+ crosspoint and gearbox functions enable 100 GbE to 800 GbE client modules to connect with full bandwidth to CIM8 modules.

“This interoperability extends a long-established partnership with Acacia to help accelerate and optimize the build-out of cloud computing and AI-ready optical networks while reducing development risk for our customers,” said Maher Fahmi, vice president for Microchip’s communications business unit. “Our META-DX2 is the first solution of its kind to integrate 1.6T of encryption, port aggregation and Lambda Splitting into the most compact 112G PAM4 device in the market.”

“With Acacia’s CIM 8 coherent modules verified to interoperate with Microchip’s META-DX2 devices, we see this as a robust solution that reduces system time-to-market,” said Markus Weber, senior director DSP product line management of Acacia. “The compact size and power efficiency of our CIM 8 coherent modules were designed to help network operators deploy and scale capacity of high-bandwidth DWDM connectivity between data centers and throughout transport networks.”

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About Microchip Technology:
Microchip Technology Inc. is a leading provider of smart, connected and secure embedded control and processing solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s solutions serve approximately 123,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.

Note: The Microchip name and logo and the Microchip logo are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.  All other trademarks mentioned herein are the property of their respective companies.

Editorial Contact:Reader Inquiries:
Kim Dutton1-888-624-7435
480-792-4386 
kim.dutton@microchip.com 

FAQ

What is the purpose of Microchip and Acacia's collaboration for data center interconnect systems?

The collaboration aims to enable optimized terabit-scale data center interconnect systems by demonstrating interoperability between Microchip's META-DX2 Ethernet PHY family and Acacia's Coherent Interconnect Module 8 (CIM 8), addressing increasing bandwidth requirements between data centers.

How does Microchip's META-DX2+ PHY optimize DCI bandwidth?

Microchip's META-DX2+ PHY uses its unique Lambda Splitting feature to split 400 GbE or 800 GbE clients across multiple wavelengths driven by the CIM8 modules, maximizing capacity between data centers in various rate configurations.

What are the key benefits of the Microchip (MCHP) and Acacia interoperable devices for DCI and transport networks?

The key benefits are: 1) Optimized DCI bandwidth through Lambda Splitting, 2) Reduced design risk with verified SerDes interoperation, and 3) Better support for full bandwidth, multi-rate operation enabling 100 GbE to 800 GbE client modules to connect with full bandwidth to CIM8 modules.

What is the significance of Microchip's META-DX2 integration capabilities?

Microchip's META-DX2 is the first solution to integrate 1.6T of encryption, port aggregation, and Lambda Splitting into the most compact 112G PAM4 device in the market, offering advanced functionality in a single package.

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