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Interlink Electronics, Inc. Presenting and Exhibiting at LOPEC 2024 - the world's leading exhibition and conference for flexible, organic, and printed electronics

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Interlink Electronics, Inc. (Nasdaq: LINK) announces its participation in LOPEC 2024, showcasing its 40 years of success in printed electronics. The company highlights its leadership in sensors and printed electronic solutions, emphasizing its continuous innovation and commercialization. Interlink's executives will present new technologies at the event, solidifying its position in the industry.
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Interlink has 40 years of successful commercialization of printed electronics

IRVINE, Calif., Feb. 29, 2024 /PRNewswire/ -- Interlink Electronics, Inc. (Nasdaq: LINK) is pleased to announce that it will present and exhibit at LOPEC 2024 at the ICM in Munich, Germany, on the 6th and 7th of March. LOPEC is the world's leading exhibition and conference for flexible, organic, and printed electronics. As a global provider of sensors and printed electronic solutions, we are pleased to be in Munich to demonstrate that we are a leading player in the printed electronics value chain. Every year in Munich, the leading industry players come together to share their innovations and drive the development of the next generation of materials, equipment and applications of flexible printed electronics.

Interlink has successfully developed and supplied our printed force and piezoelectric sensor solutions to leading OEMs and electronics companies for nearly 40 years. Interlink has also pioneered the development of printed electrochemical gas sensors and has supplied our proprietary gas and environmental air quality solutions to the market for over ten years. We continue to expand our product portfolio of printed sensors and related technologies through internal development and strategic acquisitions. 

"We have a proven track record of successful innovation and commercialization in printed electronics. As we grow and expand our product platforms and global presence, we are ideally positioned to help drive these technologies' rapid growth and adoption," said Steven N. Bronson, Chairman, President, and CEO of Interlink Electronics. "We are a critical part of the printed electronics value chain and are excited to participate and engage with other key players in this market in Munich," he added.

In addition, we are pleased to announce that Dr. Sreeni Rao and Dr. Gene Chen will present our new piezoelectric sensors and the latest developments on our gas and environmental sensors at the LOPEC Exhibitor Forum at 4:30 pm on March 6.

About Interlink Electronics, Inc.

Interlink Electronics is a world-leading provider of sensors and printed electronic solutions that support a wide range of applications, including Human-Machine Interface ("HMI") devices and IoT solutions, utilizing our expertise in materials science, manufacturing, firmware, and software to produce in-house system solutions for custom specifications. We have a proven track record of supplying mission-critical technological solutions in diverse markets, including medical devices, automotive, gas detection and environmental quality monitoring, oil and gas and general industrial, and consumer electronics, providing standard and custom-designed sensors that offer the flexibility and functionality needed for today's sophisticated applications.

The Company's products and solutions currently focus on three main fields:

  • For nearly 40 years, the Company has led the printed electronics industry in commercializing its patented Force Sensing Resistor® technology, which offers pressure and position sensing and rugged capabilities in various temperatures. Our piezoelectric film sensors offer strain, bend, and vibration sensing and can be used on curved surfaces, while our advanced matrix sensor solutions offer multiple touch capabilities. We supply some of the world's top electronics manufacturers with intuitive sensor and interface technologies for use in advanced applications such as medical robotics and vehicle collision detection.
  • Our Gas and Environmental Sensors division has over 25 years of experience in cutting-edge design and manufacture of electrochemical gas-sensing technology for industry, community, health, and home. We provide advanced sensor solutions, precision sensing instruments, and custom engineering services for detecting gases such as carbon monoxide, ozone, hydrogen, NOX gases, and ammonia for transdermal alcohol detection and air quality monitoring. Our innovative printed sensor design enables high-sensitivity, low-power, and cost-effective solutions for broad adoption in the rapidly growing IOT market.
  • Our Calman Technology subsidiary brings over 25 years of experience in designing and manufacturing membrane keypads, graphic overlays, printed electronics, and industrial label products. We offer IP-rated digital and hybrid printed devices featuring integrated backlighting, shielding, and printed electronics with advanced ink printing materials. Calman has customers in medical devices and defense technologies, giving the Company a base in Europe.

We serve our international customer base from our corporate headquarters in Irvine, California; our Global Product Development and Materials Science Center and distribution and logistics center in Camarillo, California; our advanced printed-electronics manufacturing facilities in Shenzhen, China, and Irvine, Scotland; and our proprietary gas-sensor production and product development facility in Newark, California.

For more information, please visit InterlinkElectronics.com.

About LOPEC

LOPEC (Large-area, Organic & Printed Electronics Convention) is the world's leading trade fair and conference for flexible, organic, and printed electronics. Every year it brings together leading players from application to research from all continents in the high-tech metropolis of Munich. The mix of trade fairs and conferences allows visitors to experience LOPEC in various ways. It shows where one of the most exciting future technologies stands today and its enormous potential. The LOPEC Conference is the world's most important communication platform for research, knowledge, and solutions in printed electronics.

Forward-Looking Statements

This release contains "forward-looking statements" within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements can be generally identified by phrases such as "thinks," "anticipates," "believes," "estimates," "expects," "intends," "plans," and similar words. Forward-looking statements in this press include statements about our acquisition program, our projected revenue and earnings growth, and the effects of recent acquisitions, including contributions to our products, manufacturing operations, and the markets we serve. Forward-looking statements are not guarantees of future performance and are inherently subject to uncertainties and other factors that could cause actual results to differ materially from the forward-looking statement. These statements are based upon, among other things, assumptions made by and information currently available to management, including management's own knowledge and assessment of the Company's industry, R&D initiatives, competition, and capital requirements. Other factors and uncertainties that could affect the Company's forward-looking statements include, among other things, the following: our success in predicting new markets and the acceptance of our latest products; efficient management of our infrastructure; the pace of technological developments and industry standards evolution and their effect on our target product and market choices; the effect of outsourcing technology development; changes in the ordering patterns of our customers; a decrease in the quality and/or reliability of our products; protection of our proprietary intellectual property; competition by alternative sophisticated as well as generic products; continued availability of raw materials for our products at competitive prices; disruptions in our manufacturing facilities; risks of international sales and operations including fluctuations in exchange rates; compliance with regulatory requirements applicable to our manufacturing operations; and customer concentrations. Additional factors that could cause actual results to differ materially from those anticipated by our forward-looking statements are under the captions "Risk Factors" and "Management's Discussion and Analysis of Financial Condition and Results of Operations" in our most recent Annual Report (Form 10-K) or Quarterly Report (Form 10-Q) filed with the Securities and Exchange Commission. Forward-looking statements are made as of the date of this release, and we expressly disclaim any obligation to publicly update or revise any forward-looking statements, whether as a result of new information, future events, or otherwise.

Contact:
Interlink Electronics, Inc.
IR@iefsr.com
Steven N. Bronson, CEO
805-623-4184

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SOURCE Interlink Electronics

FAQ

What event is Interlink Electronics participating in?

Interlink Electronics is participating in LOPEC 2024, the world's leading exhibition and conference for flexible, organic, and printed electronics.

How long has Interlink Electronics been supplying printed force and piezoelectric sensor solutions?

Interlink Electronics has been supplying printed force and piezoelectric sensor solutions to leading OEMs and electronics companies for nearly 40 years.

Who will present Interlink's new technologies at the LOPEC Exhibitor Forum?

Dr. Sreeni Rao and Dr. Gene Chen will present Interlink's new piezoelectric sensors and the latest developments on gas and environmental sensors at the LOPEC Exhibitor Forum.

What is the CEO of Interlink Electronics, Steven N. Bronson, excited about?

Steven N. Bronson, Chairman, President, and CEO of Interlink Electronics, is excited to participate and engage with other key players in the printed electronics market at LOPEC 2024.

Interlink Electronics, Inc.

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