Laser Photonics Propels R&D Efforts in PCB Depaneling
Laser Photonics (NASDAQ: LASE) and its subsidiary Control Micro Systems (CMS Laser) announced the expansion of their PCB Depaneling technology development project for the electronics market. The company is advancing its laser processing technology, which offers advantages including non-contact operation, narrow kerf width, and precision in PCB depaneling.
The company provides systems with both CO2 and UV laser options, where CO2 lasers offer speed and cost efficiency, while UV lasers provide cleaner cuts with minimal charring. CMS Laser's Class I PCB depaneling systems feature Through the Optics Vision (TTOV) technology and CMS Process Engine software, enabling precise processing and user-friendly operation.
Laser Photonics (NASDAQ: LASE) e la sua sussidiaria Control Micro Systems (CMS Laser) hanno annunciato l'espansione del loro progetto di sviluppo della tecnologia di depanelizzazione delle schede PCB per il mercato dell'elettronica. L'azienda sta avanzando nella sua tecnologia di lavorazione laser, che offre vantaggi come il funzionamento senza contatto, una larghezza di taglio ridotto e precisione nella depanelizzazione delle PCB.
L'azienda fornisce sistemi con opzioni di laser CO2 e UV, dove i laser CO2 offrono velocità ed efficienza dei costi, mentre i laser UV garantiscono tagli più puliti con una minima bruciatura. I sistemi di depanelizzazione PCB di Classe I di CMS Laser sono dotati della tecnologia Through the Optics Vision (TTOV) e del software CMS Process Engine, che consentono una lavorazione precisa e un funzionamento intuitivo.
Laser Photonics (NASDAQ: LASE) y su subsidiaria Control Micro Systems (CMS Laser) anunciaron la expansión de su proyecto de desarrollo de tecnología de despanelado de PCB para el mercado electrónico. La empresa está avanzando en su tecnología de procesamiento láser, que ofrece ventajas como operación sin contacto, un ancho de corte estrecho y precisión en el despanelado de PCB.
La empresa proporciona sistemas con opciones de láser CO2 y UV, donde los láseres CO2 ofrecen velocidad y eficiencia de costos, mientras que los láseres UV proporcionan cortes más limpios con un mínimo de quemado. Los sistemas de despanelado de PCB de Clase I de CMS Laser cuentan con la tecnología Through the Optics Vision (TTOV) y el software CMS Process Engine, lo que permite un procesamiento preciso y una operación fácil de usar.
레이저 포토닉스 (NASDAQ: LASE)와 그 자회사 컨트롤 마이크로 시스템 (CMS 레이저)가 전자 시장을 위한 PCB 디패널링 기술 개발 프로젝트 확대를 발표했습니다. 이 회사는 비접촉 작동, 좁은 절단 폭, PCB 디패널링의 정밀성과 같은 이점을 제공하는 레이저 가공 기술을 발전시키고 있습니다.
회사는 CO2 및 UV 레이저 옵션이 모두 포함된 시스템을 제공하며, CO2 레이저는 속도와 비용 효율성을 제공하고, UV 레이저는 최소한의 탄화로 깔끔한 절단을 제공합니다. CMS 레이저의 클래스 I PCB 디패널링 시스템은 Through the Optics Vision (TTOV) 기술과 CMS Process Engine 소프트웨어를 갖추고 있어 정밀한 가공과 사용자 친화적인 작업을 가능하게 합니다.
Laser Photonics (NASDAQ: LASE) et sa filiale Control Micro Systems (CMS Laser) ont annoncé l'expansion de leur projet de développement de la technologie de dépanelisation des cartes PCB pour le marché de l'électronique. L'entreprise fait progresser sa technologie de traitement laser, qui offre des avantages tels que le fonctionnement sans contact, une largeur de coupe étroite et une précision dans la dépanelisation des PCB.
L'entreprise propose des systèmes avec des options de laser CO2 et UV, où les lasers CO2 offrent rapidité et efficacité de coût, tandis que les lasers UV assurent des coupes plus nettes avec un minimum de brûlure. Les systèmes de dépanelisation de PCB de Classe I de CMS Laser sont équipés de la technologie Through the Optics Vision (TTOV) et du logiciel CMS Process Engine, permettant un traitement précis et une utilisation conviviale.
Laser Photonics (NASDAQ: LASE) und ihre Tochtergesellschaft Control Micro Systems (CMS Laser) haben die Erweiterung ihres Projekts zur Entwicklung von PCB-Dipaneling-Technologie für den Elektronikmarkt angekündigt. Das Unternehmen entwickelt seine Laserverarbeitungstechnologie weiter, die Vorteile wie kontaktlosen Betrieb, eine schmale Schnittbreite und Präzision beim PCB-Dipaneling bietet.
Das Unternehmen bietet Systeme mit CO2- und UV-Laseroptionen an, wobei CO2-Laser Geschwindigkeit und Kosteneffizienz bieten, während UV-Laser sauberere Schnitte mit minimalem Verkohlung gewährleisten. Die PCB-Dipaneling-Systeme der Klasse I von CMS Laser verfügen über die Through the Optics Vision (TTOV)-Technologie und die CMS Process Engine-Software, die präzise Verarbeitung und benutzerfreundlichen Betrieb ermöglichen.
- Expansion of PCB Depaneling technology development project indicates market growth potential
- Diverse product offering with both CO2 and UV laser solutions
- Advanced features including Through the Optics Vision and specialized software
- None.
Insights
The PCB depaneling technology expansion represents incremental progress rather than a breakthrough innovation. While laser-based PCB separation offers advantages over mechanical methods, this R&D effort appears to be playing catch-up in an established market segment. The dual CO2/UV laser approach is standard industry practice, with the technical specifications mentioned being on par with existing solutions.
The integration of Through the Optics Vision (TTOV) and CMS Process Engine software indicates basic automation capabilities but doesn't demonstrate significant competitive advantages. Market dynamics suggest moderate growth potential in PCB manufacturing, particularly for flexible and miniature components, but LPC faces strong competition from established players. The lack of specific performance metrics, cost advantages, or unique technological differentiators makes it difficult to assess potential market impact.
Key Technical Context: PCB depaneling technology is important for electronics manufacturing, particularly in high-mix, low-volume production scenarios. The CO2 laser's higher speed suits basic PCB materials, while UV lasers target high-end applications requiring minimal thermal impact. However, without quantifiable improvements in precision, speed, or cost-effectiveness, this R&D initiative appears more sustaining than disruptive.
Laser processing has emerged as an effective method of PCB depaneling due to its non-contact nature, narrow kerf width, and precision. This method eliminates part-induced stress and the need for consumables like cutting oils, ensuring cleanliness and high-quality results.
Custom-tailored depaneling laser technology by CMS Laser features high speed, pinpoint accuracy and machine vision alignment. The company offers PCB depaneling systems integrating CO2 and UV laser types. The main deciding factor when determining which laser to use is the relative importance of cycle time versus the cleanliness of the cut edge. CO2 lasers provide fast cuts and cost efficiency, while UV lasers offer clean cuts with minimal charring.
“By bringing together the talented engineers and technicians of Control Micro Systems and Laser Photonics, we plan to boost the development of PCB depaneling systems to meet the growing demand in the market,” said John Armstrong, Executive Vice President of LPC.
Many manufacturers have chosen laser routing as it’s ideal for flexible, highly sensitive, small PCBs used across electronic devices. CMS Laser’s solutions offer precision and efficiency suitable for standalone or integrated SMT line operations.
CMS Laser’s Class I PCB depaneling systems feature Through the Optics Vision (TTOV) for precise processing and data verification and include CMS Process Engine software, offering a user-friendly interface and optional production line communication. Easy setup and quick changeovers ensure high throughput with excellent accuracy and repeatability, delivering high yield and customer value.
Leveraging CMS Laser’s specialized expertise, LPC is channeling resources into R&D in the PCB manufacturing area, aligning with its comprehensive diversification strategy. This move aims to enhance shareholder value and build resilience in evolving markets. For more information, visit the LPC website at www.laserphotonics.com.
About Laser Photonics Corporation
Laser Photonics is a vertically integrated manufacturer and R&D Center of Excellence for industrial laser technologies and systems. Laser Photonics seeks to disrupt the
About CMS Laser
Control Micro Systems (CMS Laser), is a 40-year
Cautionary Note Concerning Forward-Looking Statements
This press release contains “forward-looking statements” (within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended), including statements regarding the Company’s plans, prospects, potential results and use of proceeds. These statements are based on current expectations as of the date of this press release and involve a number of risks and uncertainties, which may cause results and uses of proceeds to differ materially from those indicated by these forward-looking statements. These risks include, without limitation, those described under the caption “Risk Factors” in the Registration Statement. Any reader of this press release is cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date of this press release. The Company undertakes no obligation to revise or update any forward-looking statements to reflect events or circumstances after the date of this press release except as required by applicable laws or regulations.
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Investor Relations Contact:
laser@haydenir.com
Media Contact:
Karla Kizzort
Laser Photonics Corporation
kkizzort@laserphotonics.com
Source: Laser Photonics Corporation
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