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Laser Photonics Propels R&D Efforts in Laser Wire Stripping and Marking

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Laser Photonics (NASDAQ: LASE) and its subsidiary Control Micro Systems (CMS) announced the expansion of their Laser Marking and Stripping technologies development project. The technology offers non-contact wire stripping and marking capabilities with high precision, preventing damage to conductors and insulation while maintaining shield integrity.

The systems, compliant with aerospace SAE standards, feature Through the Optics Vision (TTOV) for precise processing and include CMS Process Engine software. They are suitable for various wire types, including coaxial cables and medical-grade wires, offering high-speed capabilities and easy integration into production lines.

This R&D expansion aligns with LPC's diversification strategy, focusing particularly on aerospace and defense industries' growing demands. The technology reduces maintenance requirements compared to traditional methods while ensuring high throughput, accuracy, and repeatability.

Laser Photonics (NASDAQ: LASE) e la sua sussidiaria Control Micro Systems (CMS) hanno annunciato l'espansione del loro progetto di sviluppo delle tecnologie di marcatura e stripping laser. Questa tecnologia offre capacità di stripping e marcatura dei fili senza contatto e con alta precisione, prevenendo danni ai conduttori e all'isolamento, mantenendo l'integrità della schermatura.

I sistemi, conformi agli standard aerospaziali SAE, dispongono della tecnologia Through the Optics Vision (TTOV) per un processamento preciso e includono il software CMS Process Engine. Sono adatti a vari tipi di cavi, compresi i cavi coassiali e i cavi di grado medico, offrendo capacità ad alta velocità e facile integrazione nelle linee di produzione.

Questa espansione della ricerca e sviluppo è in linea con la strategia di diversificazione di LPC, concentrandosi in particolare sulle crescenti esigenze dell'industria aerospaziale e della difesa. La tecnologia riduce i requisiti di manutenzione rispetto ai metodi tradizionali, garantendo al contempo un’elevata produttività, precisione e ripetibilità.

Laser Photonics (NASDAQ: LASE) y su subsidiaria Control Micro Systems (CMS) anunciaron la expansión de su proyecto de desarrollo de tecnologías de marcaje y desforramiento láser. La tecnología ofrece capacidades de desforramiento y marcaje de cables sin contacto y con alta precisión, previniendo daños a los conductores y al aislamiento mientras mantiene la integridad de la pantalla.

Los sistemas, que cumplen con los estándares aeronáuticos SAE, cuentan con la tecnología Through the Optics Vision (TTOV) para un procesamiento preciso e incluyen el software CMS Process Engine. Son adecuados para varios tipos de cables, incluidos cables coaxiales y de grado médico, ofreciendo capacidades de alta velocidad y fácil integración en las líneas de producción.

Esta expansión en I+D se alinea con la estrategia de diversificación de LPC, enfocándose particularmente en las crecientes demandas de las industrias aeroespacial y de defensa. La tecnología reduce los requisitos de mantenimiento en comparación con los métodos tradicionales, asegurando al mismo tiempo un alto rendimiento, precisión y repetibilidad.

레이저 포토닉스 (NASDAQ: LASE)와 그 자회사 컨트롤 마이크로 시스템즈 (CMS)가 레이저 마킹 및 스트리핑 기술 개발 프로젝트의 확장을 발표했습니다. 이 기술은 비접촉 방식의 와이어 스트리핑 및 마킹 기능을 제공하며, 높은 정밀도로 도체와 절연체의 손상을 방지하고 차폐의 무결성을 유지합니다.

항공우주 SAE 표준을 준수하는 시스템은 정밀 처리를 위한 Through the Optics Vision (TTOV) 기술을 특징으로 하며, CMS Process Engine 소프트웨어를 포함합니다. 코액시얼 케이블 및 의료 등급의 케이블을 포함한 다양한 유형의 케이블에 적합하며, 고속 처리 기능과 생산 라인에의 용이한 통합이 가능합니다.

이번 R&D 확장은 LPC의 다양화 전략과 일치하며, 특히 항공우주 및 방위 산업의 증가하는 수요에 집중하고 있습니다. 이 기술은 전통적인 방법에 비해 유지보수 요구사항을 줄이면서 높은 처리량, 정확성 및 반복성을 보장합니다.

Laser Photonics (NASDAQ: LASE) et sa filiale Control Micro Systems (CMS) ont annoncé l'expansion de leur projet de développement de technologies de marquage et de dénudage laser. Cette technologie offre des capacités de dénudage et de marquage de fils sans contact et avec une grande précision, prévenant les dommages aux conducteurs et à l'isolation tout en maintenant l'intégrité de l'écran.

Les systèmes, conformes aux normes aérospatiales SAE, disposent de la technologie Through the Optics Vision (TTOV) pour un traitement précis et incluent le logiciel CMS Process Engine. Ils conviennent à divers types de câbles, y compris les câbles coaxiaux et les câbles de qualité médicale, offrant des capacités à grande vitesse et une intégration facile dans les lignes de production.

Cette expansion de la R&D s'inscrit dans la stratégie de diversification de LPC, se concentrant particulièrement sur les demandes croissantes des industries aérospatiales et de défense. La technologie réduit les exigences de maintenance par rapport aux méthodes traditionnelles tout en garantissant un débit élevé, une précision et une répétabilité.

Laser Photonics (NASDAQ: LASE) und seine Tochtergesellschaft Control Micro Systems (CMS) haben die Expansion ihres Projekts zur Entwicklung von Lasermarkierungs- und Strip-Technologien angekündigt. Die Technologie bietet kontaktfreies Abisolieren und Markieren von Drähten mit hoher Präzision und verhindert Beschädigungen an Leitern und Isolierung, während die Integrität des Schirms gewahrt bleibt.

Die Systeme, die den Luftfahrt-Standards der SAE entsprechen, verfügen über die Through the Optics Vision (TTOV)-Technologie für präzise Verarbeitung und beinhalten die CMS Process Engine-Software. Sie sind für verschiedene Kabeltypen geeignet, einschließlich koaxialer Kabel und medizinischer Drähte, und bieten Hochgeschwindigkeitsfähigkeiten sowie eine einfache Integration in Produktionslinien.

Diese F&E-Expansion ist mit der Diversifizierungsstrategie von LPC auf Einklang, die sich insbesondere auf die wachsenden Anforderungen der Luft- und Raumfahrt- sowie Verteidigungsindustrie konzentriert. Die Technologie reduziert die Wartungsanforderungen im Vergleich zu herkömmlichen Methoden und gewährleistet gleichzeitig hohe Durchsatzraten, Genauigkeit und Wiederholbarkeit.

Positive
  • Expansion into growing aerospace and defense markets
  • Technology compliant with aerospace SAE standards
  • Reduced maintenance requirements compared to traditional methods
  • Versatile application across various wire types and industries
Negative
  • None.

Insights

The expansion of laser wire stripping and marking technologies represents a strategic move in a niche but growing market segment. The key technological differentiator lies in the Through the Optics Vision (TTOV) system, which provides real-time processing verification - a critical feature for high-precision aerospace and medical device applications.

From a market perspective, this R&D expansion targets two high-value sectors: aerospace/defense and medical devices. The SAE compliance is particularly noteworthy, as it opens doors to tier-1 aerospace suppliers who require stringent certification standards. The medical device market's increasing demand for precise, contamination-free wire processing also presents a substantial opportunity.

However, several factors temper the immediate impact of this announcement:

  • The R&D expansion builds on existing technology rather than introducing revolutionary capabilities
  • No specific investment figures or revenue projections are provided
  • The competitive landscape includes established players with similar capabilities
  • The announcement lacks concrete timelines for market deployment

While the technology's benefits are clear - including reduced maintenance, high precision and versatility - this appears to be more of a strategic positioning move rather than a significant near-term catalyst for business growth. The focus on aerospace and medical applications suggests a quality-over-quantity approach, which could lead to higher margins but likely won't drive substantial volume growth in the immediate term.

ORLANDO, Fla.--(BUSINESS WIRE)-- Laser Photonics Corporation (LPC) (NASDAQ: LASE), a leading global industrial developer of laser systems for cleaning and other material processing applications, and its subsidiary, Control Micro Systems (CMS), announced the expansion of their Laser Marking and Stripping technologies development project.

Laser processing has emerged as an effective method of wire stripping and marking due to its non-contact nature, precision and versatility. The technology prevents any damage to conductors and insulation during stripping and marking, keeping the shield intact and eliminating weak spots for breakage or conductor resistance. It accomplishes this while lowering the need for frequent cleaning and maintenance that traditional methods require.

Laser wire stripping and marking systems by CMS offer high-speed capabilities for various wire colors and sizes, including basic wires, coaxial cables, wire conduit shielding, and electrical wires. The technology is compliant with aerospace SAE standards while also serving as a great solution for marking medical-grade cables and wires due to its precision and versatility.

“By combining the expertise of Control Micro Systems and Laser Photonics, we aim to enhance wire stripping and marking systems to meet the growing demand we have seen, starting with the aerospace and defense industries,” said John Armstrong, Executive Vice President of LPC.

Professionals continue to adopt laser wire stripping and marking technology for its numerous benefits. The systems developed by CMS are ideal for small, sensitive surfaces and can be standalone or integrated into high-speed line operations.

Control Micro System’s Class I wire stripping and marking systems feature Through the Optics Vision (TTOV) for precise processing and data verification and include CMS Process Engine software with a user-friendly interface and optional production line communication. Easy setup and quick changeovers ensure high throughput with excellent accuracy and repeatability, delivering high yield and customer value.

Leveraging Control Micro System’s specialized expertise, LPC is channeling resources into R&D in the Laser Wire Stripping and Marking manufacturing area, aligning with its comprehensive diversification strategy. This move aims to enhance shareholder value and build resilience in evolving markets. For more information about the wire stripping and marking product line or LPC’s lines of cleaning, cutting, welding, marking, or engraving laser systems, visit https://www.laserphotonics.com.

About Laser Photonics Corporation

Laser Photonics is a vertically integrated manufacturer and R&D Center of Excellence for industrial laser technologies and systems. Laser Photonics seeks to disrupt the $46 billion, centuries-old sand and abrasives blasting markets, focusing on surface cleaning, rust removal, corrosion control, de-painting and other laser-based industrial applications. Laser Photonics’ new generation of leading-edge laser blasting technologies and equipment also addresses the numerous health, safety, environmental and regulatory issues associated with old methods. As a result, Laser Photonics quickly gained a reputation as an industry leader in industrial laser systems with a brand that stands for quality, technology and product innovation. Currently, world-renowned and Fortune 1000 manufacturers in the aviation, automotive, defense, energy, maritime, nuclear and space industries are using Laser Photonics’ “unique-to-industry” systems. For more information, visit https://www.laserphotonics.com.

About Control Micro Systems

Control Micro Systems, is a 40-year U.S. pioneer in software controls development for laser machines. Today, the company produces turnkey laser material processing systems for marking, cutting, drilling, welding, and more. Its cutting-edge laser systems are expertly engineered for high-precision applications in a wide range of industries and tailored to each client’s unique manufacturing needs. CMS counts several top 20 global life sciences companies among their customers. For more information, visit Control Micro Systems, a Laser Photonics company.

Cautionary Note Concerning Forward-Looking Statements

This press release contains “forward-looking statements” (within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended), including statements regarding the Company’s plans, prospects, potential results and use of proceeds. These statements are based on current expectations as of the date of this press release and involve a number of risks and uncertainties, which may cause results and uses of proceeds to differ materially from those indicated by these forward-looking statements. These risks include, without limitation, those described under the caption “Risk Factors” in the Registration Statement. Any reader of this press release is cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date of this press release. The Company undertakes no obligation to revise or update any forward-looking statements to reflect events or circumstances after the date of this press release except as required by applicable laws or regulations.

Investor Relations Contact:

laser@haydenir.com



Contact:

Karla Kizzort

Laser Photonics Corporation

kkizzort@laserphotonics.com

Source: Laser Photonics Corporation

FAQ

What new technology is Laser Photonics (LASE) developing for wire processing?

Laser Photonics is developing advanced laser marking and stripping technologies that offer non-contact wire processing with high precision, preventing damage to conductors and insulation while maintaining shield integrity.

Which industries is Laser Photonics (LASE) targeting with its wire stripping technology?

The company is primarily targeting the aerospace and defense industries, while also serving medical device manufacturers due to the technology's precision and versatility.

What are the key features of LASE's Control Micro Systems wire stripping technology?

The technology features Through the Optics Vision (TTOV), CMS Process Engine software, user-friendly interface, high-speed capabilities, and optional production line communication.

How does LASE's laser wire stripping technology improve upon traditional methods?

The technology reduces maintenance requirements, prevents damage to conductors, eliminates weak spots, and offers higher precision while maintaining shield integrity compared to traditional methods.

What types of wires can LASE's new laser system process?

The system can process various wire types including basic wires, coaxial cables, wire conduit shielding, and electrical wires, with capabilities for different wire colors and sizes.

Laser Photonics Corporation

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