Kulicke & Soffa Announces Thermo-Compression Adoption & Milestones
Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) has announced significant milestones in the adoption of its Thermo-Compression Bonding (TCB) technology. The company has introduced its latest APTURA™ Thermo-Compression platform and secured multiple customer wins for its TCB offerings. K&S has also demonstrated an alternative path to chip-to-wafer hybrid bonding through industry collaborations.
Additionally, K&S has joined the 'US-Joint' consortium, led by Resonac Holdings , to support advanced packaging solutions development. The consortium will establish an R&D facility in Silicon Valley, expected to be fully operational by 2025. K&S reports that its TCB business has grown over 10 times in the past four years, indicating strong market adoption of this technology for advanced chiplet and stacked-die applications in AI, HPC, Mobile, and Edge devices.
Kulicke e Soffa Industries, Inc. (NASDAQ: KLIC) ha annunciato importanti traguardi nell'adozione della sua tecnologia di Thermo-Compression Bonding (TCB). L'azienda ha introdotto la sua più recente piattaforma APTURA™ per la termo-compressione e ha ottenuto numerosi successi con i clienti per le sue offerte TCB. K&S ha anche dimostrato un percorso alternativo per il bonding ibrido chip-to-wafer attraverso collaborazioni con l'industria.
Inoltre, K&S è entrata a far parte del consorzio 'US-Joint', guidato da Resonac Holdings, per supportare lo sviluppo di soluzioni di imballaggio avanzate. Il consorzio stabilirà una struttura di R&S nella Silicon Valley, prevista per essere pienamente operativa entro il 2025. K&S riporta che il suo business TCB è cresciuto oltre 10 volte negli ultimi quattro anni, indicando una forte adozione di questa tecnologia per applicazioni avanzate di chiplet e die impilati in AI, HPC, dispositivi mobili ed Edge.
Kulicke y Soffa Industries, Inc. (NASDAQ: KLIC) ha anunciado hitos significativos en la adopción de su tecnología de Thermo-Compression Bonding (TCB). La compañía ha presentado su más reciente plataforma APTURA™ de termo-compresión y ha asegurado múltiples victorias con clientes para sus ofertas de TCB. K&S también ha demostrado un camino alternativo para el bonding híbrido chip-a-wafel a través de colaboraciones industriales.
Adicionalmente, K&S se ha unido al consorcio 'US-Joint', liderado por Resonac Holdings, para apoyar el desarrollo de soluciones de empaquetado avanzado. El consorcio establecerá una instalación de I+D en Silicon Valley, que se espera esté completamente operativa para 2025. K&S informa que su negocio de TCB ha crecido más de 10 veces en los últimos cuatro años, lo que indica una fuerte adopción de esta tecnología para aplicaciones avanzadas de chiplets y dies apilados en AI, HPC, dispositivos móviles y Edge.
쿨리케 앤 소파 인더스트리즈, Inc. (NASDAQ: KLIC)는 자사의 열 압축 결합(TCB) 기술 채택에 있어 중요한 이정표를 발표했습니다. 회사는 최신 APTURA™ 열 압축 플랫폼을 소개하고 TCB 제품에 대한 고객 확보에 성공했습니다. K&S는 또한 산업 협업을 통해 칩-웨이퍼 하이브리드 결합의 대안 경로를 보여주었습니다.
또한, K&S는 고급 포장 솔루션 개발을 지원하기 위해 Resonac Holdings가 주도하는 'US-Joint' 컨소시엄에 합류했습니다. 이 컨소시엄은 실리콘밸리에 R&D 시설을 설립할 예정이며, 2025년까지 완전히 운영될 것으로 예상됩니다. K&S는 TCB 사업이 지난 4년 동안 10배 이상 성장했으며, 이는 AI, HPC, 모바일 및 엣지 장치의 고급 칩렛 및 적층 다이 응용 프로그램에 대한 강력한 시장 수용을 나타냅니다.
Kulicke et Soffa Industries, Inc. (NASDAQ: KLIC) a annoncé des jalons significatifs dans l'adoption de sa technologie de Thermo-Compression Bonding (TCB). L'entreprise a introduit sa dernière plateforme APTURA™ de thermo-compression et a remporté plusieurs contrats clients pour ses offres TCB. K&S a également démontré un chemin alternatif pour le bonding hybride chip-à-wafer grâce à des collaborations industrielles.
De plus, K&S a rejoint le consortium 'US-Joint', dirigé par Resonac Holdings, pour soutenir le développement de solutions d'emballage avancées. Le consortium établira une installation de R&D dans la Silicon Valley, qui devrait être pleinement opérationnelle d'ici 2025. K&S rapporte que son activité TCB a crû de plus de 10 fois au cours des quatre dernières années, ce qui indique une forte adoption de cette technologie pour des applications avancées de chiplets et de dies empilés dans l'IA, les HPC, les dispositifs mobiles et Edge.
Kulicke und Soffa Industries, Inc. (NASDAQ: KLIC) hat bedeutende Meilensteine bei der Einführung seiner Thermo-Compression Bonding (TCB)-Technologie bekannt gegeben. Das Unternehmen hat seine neueste APTURA™-Thermo-Compression-Plattform eingeführt und mehrere Kundenaufträge für seine TCB-Angebote gesichert. K&S hat auch einen alternativen Weg für das Chip-zu-Wafer-Hybrid-Bonding durch industrielle Zusammenarbeit aufgezeigt.
Darüber hinaus ist K&S dem 'US-Joint' Konsortium beigetreten, das von Resonac Holdings geleitet wird, um die Entwicklung fortschrittlicher Verpackungslösungen zu unterstützen. Das Konsortium wird eine F&E-Einrichtung im Silicon Valley einrichten, die voraussichtlich bis 2025 vollständig betriebsbereit sein wird. K&S berichtet, dass ihr TCB-Geschäft in den letzten vier Jahren um mehr als das Zehnfache gewachsen ist, was auf eine starke Marktakzeptanz dieser Technologie für fortschrittliche Chiplet- und Stacked-Dye-Anwendungen in AI, HPC, mobilen und Edge-Geräten hinweist.
- Introduction of the latest APTURA™ Thermo-Compression platform
- Multiple new customer wins for Thermo-Compression offerings
- Demonstration of an alternative path to chip-to-wafer hybrid bonding
- Joining the 'US-Joint' consortium for advanced packaging solutions development
- TCB business growth of over 10 times in the past four years
- None.
Kulicke & Soffa's recent announcements signify significant progress in Thermo-Compression Bonding (TCB) technology. The company's success in securing multiple customer wins for its APTURA™ platform demonstrates growing market acceptance of this advanced packaging solution. The
The demonstration of an alternative path to chip-to-wafer hybrid bonding through bumpless-FTC is a technological breakthrough. This innovation could potentially expand K&S's addressable market in advanced logic applications, positioning the company as a key player in next-generation semiconductor packaging.
K&S's participation in the US-Joint consortium further solidifies its industry leadership and provides access to collaborative R&D efforts, potentially accelerating innovation and market adoption of advanced packaging solutions.
While specific financial figures are not provided, the rapid growth in K&S's TCB business and multiple customer wins suggest a positive revenue trajectory for this segment. The company's involvement in various advanced packaging technologies (TCB, HPI, Vertical-Fan-Out, SiP) indicates a diversified product portfolio, which could help mitigate risks and capture growth across different market segments.
The planned R&D facility in Silicon Valley, part of the US-Joint consortium, represents a strategic investment that could yield long-term benefits through accelerated innovation and closer customer relationships. However, investors should monitor the capital expenditure associated with this initiative and its impact on near-term profitability.
Overall, K&S's strong position in emerging advanced packaging technologies positions it well for potential long-term growth as the semiconductor industry continues to evolve towards more complex packaging solutions.
Several New Customer Wins as TCB Gains Commercial Momentum
New Path to Hybrid Bonding Demonstrated through Fluxless TCB
K&S Joins Resonac-led "US-Joint" Consortium
Recently, several of Kulicke & Soffa's leading Thermo-Compression offerings have been selected at multiple Assembly & Test customers. In support of the rapid needs for advanced chiplet and stacked-die requirements, these tools will support chip-to-substrate processes targeting applications such as AI, HPC, Mobile and Edge-devices. K&S also continues to pursue additional chip-to-wafer engagements and anticipates making further customer announcements over the coming quarter as its Thermo-Compression momentum, specifically in the area of Fluxless Thermo-Compression bonding (FTC), continues.
Additionally, through industry collaborations with the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS), as well as an FTC customer, Kulicke & Soffa's leading APTURA™ platform has demonstrated an alternative path to chip-to-wafer hybrid bonding, enabled by Thermo-Compression. This innovative bumpless-FTC process creates a true chip-to-wafer, hybrid-bond – supporting bonding for both bumpless, Copper-to-Copper interconnects as well as dielectric materials – for advanced logic applications. While direct Copper-to-Copper bonding is a standard feature of the APTURA platform and gathering broad market attention, this innovative new process further extends the market access for Kulicke & Soffa's broadening portfolio of Advanced Packaging solutions.
Finally, on July 8th, Kulicke & Soffa's membership was announced within the "US-Joint" consortium, formed by Resonac Holdings Corporation ("Resonac"), a leading provider of global semiconductor materials. US-Joint is designed to support industry collaboration and market adoption of advanced packaging solutions through research and development and includes participation of ten American and Japanese semiconductor materials and equipment providers. After the initial establishment of two open consortiums in
US-Joint includes the construction of an R&D facility based in Silicon Valley, which will allow end-customers to verify the latest requirements for advanced device packaging, and also validate new concepts in development. Cleanrooms and equipment installations for this
"Our TCB business has grown by over 10 times over the past four years - faster than many other leading-edge interconnect processes – due to our close customer engagements and industry collaborations like these," stated John Molnar, VP of Advanced Solutions, "The broadening adoption of both Thermo-Compression technology, as well as emerging advanced chiplet-based assembly architectures – throughout our broadly served-markets – remains in early stages."
In support of the long-term industry needs for 2.5D and 3D packaging approaches, which are extending Moore's law, K&S anticipates to aggressively ramp customer engagements and production capacity for FTC and bumpless FTC over the coming years. In addition to Kulicke & Soffa's progress in Thermo-Compression technology, High-Power-Interconnect (HPI) utilization in Automotive and Industrials markets, Vertical-Fan-Out targeting dynamic memory adoption, and the growing industry need for System-in-Package (SiP) applications, provide additional growth opportunities over the long-term.
About Kulicke & Soffa
Founded in 1951, Kulicke and Soffa Industries, Inc. specializes in developing cutting-edge semiconductor and electronics assembly solutions enabling a smarter and more sustainable future. Our ever-growing range of products and services supports growth and facilitates technology transitions across large-scale markets, such as advanced display, automotive, communications, compute, consumer, data storage, energy storage and industrial.
Contacts
Kulicke & Soffa
Marilyn Sim
Public Relations
+65-6880 9309
msim@kns.com
Kulicke & Soffa
Joseph Elgindy
Finance
+1-215-784-7500
investor@kns.com
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SOURCE Kulicke & Soffa Industries, Inc.
FAQ
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