Keysight Unveils Wire Bond Inspection Solution for Semiconductor Manufacturing
Keysight Technologies (NYSE: KEYS) has introduced the Electrical Structural Tester (EST), a cutting-edge wire bond inspection solution for semiconductor manufacturing. The EST employs advanced nano Vectorless Test Enhanced Performance (nVTEP) technology to detect subtle defects like wire sag, near shorts, and stray wires. Key benefits include:
1. Advanced defect detection using capacitive coupling analysis
2. High-volume manufacturing capability, testing up to 20 ICs simultaneously
3. Throughput of up to 72,000 units per hour
4. Big data analytics integration for enhanced yield
The EST addresses critical testing challenges in the semiconductor industry, particularly for mission-critical applications in medical devices and automotive systems. It will be showcased at SEMICON Taiwan 2024.
Keysight Technologies (NYSE: KEYS) ha introdotto il Tester Elettrico Strutturale (EST), una soluzione innovativa per l'ispezione dei collegamenti a filo nella produzione di semiconduttori. L'EST utilizza una tecnologia avanzata chiamata nano Test Senza Vettore Performance Migliorata (nVTEP) per rilevare difetti sottili come il cedimento dei fili, cortocircuiti parziali e fili erranti. I principali vantaggi includono:
1. Rilevamento avanzato dei difetti tramite analisi di accoppiamento capacitivo
2. Capacità di produzione di alta quantità, testando fino a 20 IC contemporaneamente
3. Capacità di produzione fino a 72.000 unità all'ora
4. Integrazione di analisi di big data per un rendimento migliorato
L'EST affronta sfide critiche nei test dell'industria dei semiconduttori, in particolare per applicazioni mission-critical nei dispositivi medici e nei sistemi automotive. Sarà presentato al SEMICON Taiwan 2024.
Keysight Technologies (NYSE: KEYS) ha presentado el Probador Estructural Eléctrico (EST), una solución de inspección de enlaces de alambre de vanguardia para la fabricación de semiconductores. El EST emplea tecnología avanzada de Prueba Mejorada de Rendimiento Sin Vector (nVTEP) para detectar defectos sutiles como la caída de alambre, cortocircuitos cercanos y alambres perdidos. Los principales beneficios incluyen:
1. Detección avanzada de defectos utilizando análisis de acoplamiento capacitivo
2. Capacidad de fabricación de alto volumen, probando hasta 20 CI simultáneamente
3. Rendimiento de hasta 72,000 unidades por hora
4. Integración de análisis de big data para un mayor rendimiento
El EST aborda desafíos críticos de prueba en la industria de semiconductores, particularmente para aplicaciones críticas en dispositivos médicos y sistemas automotrices. Se mostrará en SEMICON Taiwan 2024.
Keysight Technologies (NYSE: KEYS)가 반도체 제조를 위한 최첨단 배선 본딩 검사 솔루션인 전기 구조 테스트기 (EST)를 도입했습니다. EST는 미세한 결함을 감지하기 위해 나노 벡터리스 테스트 향상 성능 (nVTEP) 기술을 사용해 배선 처짐, 근접 단락 및 이탈 배선을 감지합니다. 주요 이점은 다음과 같습니다:
1. 정전 용량 결합 분석을 통한 고급 결함 감지
2. 동시에 최대 20개의 IC를 테스트할 수 있는 대량 생산 능력
3. 시간당 최대 72,000개 유닛 처리량
4. 수율 향상을 위한 빅데이터 분석 통합
EST는 의료 장치 및 자동차 시스템의 미션 크리티컬 애플리케이션을 위한 반도체 산업의 중요한 테스트 과제를 해결합니다. 2024년 SEMICON 대만에서 선보일 예정입니다.
Keysight Technologies (NYSE: KEYS) a introduit le Testeur Électrique Structurel (EST), une solution de pointe pour l'inspection des liaisons de fils dans la fabrication de semi-conducteurs. L'EST utilise une technologie avancée de Test Amélioré de Performance Sans Vecteur Nano (nVTEP) pour détecter des défauts subtils tels que la courbure des fils, les courts-circuits proches et les fils errants. Les principaux avantages incluent :
1. Détection avancée des défauts grâce à l'analyse par couplage capacitif
2. Capacité de fabrication en haute quantité, testant jusqu'à 20 CI simultanément
3. Débit allant jusqu'à 72 000 unités par heure
4. Intégration d'analyses de big data pour améliorer le rendement
L'EST répond à des défis de test critiques dans l'industrie des semi-conducteurs, en particulier pour des applications essentielles dans les dispositifs médicaux et les systèmes automobile. Il sera présenté au SEMICON Taiwan 2024.
Keysight Technologies (NYSE: KEYS) hat den Elektrischen Struktur-Tester (EST) eingeführt, eine hochmoderne Lösung zur Inspektion von Drahtbondings in der Halbleiterfertigung. Der EST nutzt fortschrittliche Nano Vektorlose Testverbesserte Leistung (nVTEP) Technologie, um subtile Defekte wie Drahtabfall, nahe Kurzschlüsse und abweichende Drähte zu erkennen. Die wichtigsten Vorteile sind:
1. Fortschrittliche Defekterkennung mittels kapazitiver Kopplungsanalyse
2. Hohe Produktionskapazität mit bis zu 20 gleichzeitig getesteten ICs
3. Durchsatz von bis zu 72.000 Einheiten pro Stunde
4. Integration von Big Data-Analysen zur Verbesserung der Ausbeute
Der EST adressiert kritische Testherausforderungen in der Halbleiterindustrie, insbesondere für mission-critical Anwendungen in medizinischen Geräten und Automobilsystemen. Er wird auf der SEMICON Taiwan 2024 vorgestellt.
- Introduction of advanced Electrical Structural Tester (EST) for wire bond inspection
- Capability to test up to 20 integrated circuits simultaneously
- High throughput of up to 72,000 units per hour
- Integration of big data analytics for yield enhancement
- None.
Insights
Keysight's new Electrical Structural Tester (EST) represents a significant advancement in semiconductor testing technology. The nVTEP technology enables detection of subtle defects like wire sag and near shorts, addressing a critical gap in current testing methodologies. This innovation is particularly relevant for high-reliability applications in medical and automotive sectors.
The EST's ability to test 20 ICs simultaneously with a throughput of
While the EST shows promise, its market impact will depend on adoption rates and performance in real-world manufacturing environments. Investors should monitor customer feedback and Keysight's ability to scale this technology across the semiconductor industry.
The EST's introduction is a game-changer for semiconductor quality control. Traditional sampling techniques often miss critical defects, leading to costly field failures. By enabling 100% inspection at high speeds, the EST could significantly reduce defect escape rates and improve overall product reliability.
The system's high-volume readiness is crucial. With the ability to test multiple ICs simultaneously, it addresses the industry's need for faster, more efficient testing without sacrificing accuracy. This could lead to reduced manufacturing cycle times and improved yield rates.
However, implementation may require significant changes to existing production lines. Manufacturers will need to weigh the initial investment against long-term benefits. The true value of the EST will be determined by its ability to detect defects that other methods miss, potentially saving millions in warranty claims and recalls.
- Solution identifies subtle defects such as wire sag, near shorts, and stray wires for comprehensive assessment of wire bond integrity
- Advanced capacitive-based test methodology enables superior defect detection
- Test platform is high volume manufacturing ready, capable of testing 20 integrated circuits simultaneously for throughput of up to 72,000 units per hour
The semiconductor industry is faced with testing challenges due to the increasing density of chips in mission-critical applications such as medical devices and automotive systems. Current testing methodologies often fall short in detecting wire bond structural defects, which lead to costly latent failures. In addition, traditional testing approaches frequently rely on sampling techniques that do not adequately identify wire bond structural defects.
The EST addresses these testing challenges by using cutting-edge nano Vectorless Test Enhanced Performance (nVTEP) technology to create a capacitive structure between the wire bond and a sensor plate. Using this method the EST can identify subtle defects such as wire sag, near shorts, and stray wires to enable comprehensive assessment of wire bond integrity.
Key benefits of the EST include:
- Advanced defect detection – Identifies a wide range of wire bond defects, both electrical and non-electrical, by analyzing changes in capacitive coupling patterns to ensure the functionality and reliability of electronic components.
- High volume manufacturing ready – Enables throughput of up to 72,000 units per hour through the ability to test up to 20 integrated circuits simultaneously, which boosts productivity and efficiency in high-volume production environments.
- Big data analytics integration – Captures defects and enhances yield through advanced methods like marginal retry test (MaRT), dynamic part averaging test (DPAT), and real-time part averaging test (RPAT).
Carol Leh, Vice President, Electronic Industrial Solutions Group Center of Excellence, Keysight, said: “Keysight is dedicated to pioneering innovative solutions that address the most pressing challenges in the wire bonding process. The Electrical Structural Tester empowers chip manufacturers to enhance production efficiency by rapidly identifying wire bond defects, ensuring superior quality and reliability in high-volume manufacturing.”
The Electrical Structural Tester will be showcased at the Keysight booth (K3283) at SEMICON Taiwan 2024, Taipei Nangang Exhibition Center Hall 1, September 4-6, 2024.
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About Keysight Technologies
At Keysight (NYSE: KEYS), we inspire and empower innovators to bring world-changing technologies to life. As an S&P 500 company, we’re delivering market-leading design, emulation, and test solutions to help engineers develop and deploy faster, with less risk, throughout the entire product life cycle. We’re a global innovation partner enabling customers in communications, industrial automation, aerospace and defense, automotive, semiconductor, and general electronics markets to accelerate innovation to connect and secure the world. Learn more at Keysight Newsroom and www.keysight.com.
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Source: Keysight Technologies, Inc.
FAQ
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