Intel Corp - INTC STOCK NEWS

Intel has unveiled next-generation AI solutions with the launch of Xeon 6 and Gaudi 3. The Xeon 6 with Performance-cores (P-cores) doubles the performance for AI and HPC workloads, while Gaudi 3 AI accelerators offer up to 20% more throughput and 2x price/performance vs H100 for inference of LLaMa 2 70B.

Key features of Xeon 6 include increased core count, double the memory bandwidth, and AI acceleration capabilities in every core. Gaudi 3 boasts 64 Tensor processor cores, 8 matrix multiplication engines, 128GB of HBM2e memory, and 24 200Gb Ethernet ports.

Intel is collaborating with IBM to deploy Gaudi 3 as a service on IBM Cloud, aiming to lower TCO and enhance performance. The company is also partnering with OEMs like Dell Technologies and Supermicro to develop co-engineered AI systems.

Flapmax and Intel have announced the launch of the Quantum AI Challenge, an initiative aimed at fostering innovation among Historically Black Colleges and Universities (HBCUs). The challenge invites students, faculty, and researchers to solve real-world problems using quantum computing and AI technologies. Applications open on September 20, 2024.

Participants will gain access to cutting-edge AI hardware, tools, and mentorship from global experts. The challenge focuses on defining and solving complex optimization problems in industries like healthcare, energy, material science, and supply chain. Selected teams will receive Intel AI PCs to run Python-based quantum simulations enhanced with AI.

The initiative builds on Flapmax's collaboration with Intel to accelerate AI innovation in underserved populations. It aims to empower HBCU students to lead in AI and quantum computing, addressing global challenges and developing practical applications across key industries.

Remark Holdings (OTCQX: MARK) announced the successful optimization of its Smart Safety Platform (SSP) for Intel Architecture. The SSP, an AI-powered solution for businesses, offers video analytics, real-time alerts, and scalable integration. The optimization, leveraging OpenVINO, enhances performance on Intel's hardware, including the 4th Gen Xeon scalable processor with Flex 140 GPU.

This optimization results in faster processing times, reduced latency, and increased throughput for AI workloads. The collaboration between Remark AI and Intel, as part of the Intel Partner Alliance, aims to provide efficient and versatile AI solutions across various industries and deployment scenarios.

Intel (INTC) and Amazon Web Services (AWS) have announced a multi-year, multi-billion-dollar collaboration to produce custom chip designs. Intel will manufacture an AI fabric chip on Intel 18A and a custom Xeon 6 chip on Intel 3 for AWS. This expansion of their longstanding partnership aims to accelerate U.S.-based chip manufacturing and create a vibrant AI ecosystem in Ohio.

The collaboration underscores both companies' commitment to domestic semiconductor production. Intel reaffirms its plans for leading-edge manufacturing in New Albany, while AWS plans to invest $7.8 billion to expand its data center operations in Central Ohio. This builds on AWS's existing $10.3 billion investment in Ohio since 2015.

The partnership is expected to drive innovation, support business growth, and contribute to a sustainable domestic AI supply chain. Both companies will explore potential for further designs on Intel's advanced process nodes, including those to be produced in Intel's Ohio facilities.

Intel has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. This initiative aims to expand trusted manufacturing of leading-edge semiconductors for the U.S. government, building on previous collaborations with the Department of Defense (DoD). As the only American company designing and manufacturing leading-edge logic chips, Intel will help secure the domestic chip supply chain and enhance U.S. technological resilience.

The award is separate from Intel's proposed funding agreement in March 2023 for semiconductor facility construction. Intel Foundry is advancing its Intel 18A technology, set for production in 2025. The company has made significant progress in DoD projects like SHIP and RAMP-C, delivering multi-chip package prototypes and onboarding defense industrial base customers including Boeing, Northrop Grumman, and Microsoft.

Mobileye (MBLY) has decided to end internal development of next-generation FMCW lidar for autonomous and highly automated driving systems. This decision is based on advancements in EyeQ6-based computer vision perception, improved imaging radar performance, and cost reductions in third-party time-of-flight lidar units. The company emphasizes that this change does not impact any customer product programs or general product development.

The lidar R&D unit will be wound down by the end of 2024, affecting about 100 employees. Operating expenses for this unit are expected to total approximately $60 million in 2024. While not materially impacting 2024 results, this action will reduce future lidar development spending. Mobileye continues to prioritize imaging radar development, which is meeting performance specifications and is expected to enter production next year.

Intel has launched its most efficient x86 processors ever, the Intel® Core™ Ultra 200V series. These processors offer exceptional AI performance, compatibility, and power efficiency for leading laptop manufacturers. Key features include:

- Up to 50% lower package power and 120 total platform TOPS
- 4x more powerful fourth-generation NPU
- 30% average performance uplift in graphics with new Xe2 microarchitecture
- Up to 3x performance per thread and 80% peak performance uplift
- 20 hours of battery life in productivity use cases

The processors will power over 80 consumer designs from 20+ top manufacturers, available globally starting September 24. They support various AI-accelerated features for content creation, security, productivity, and gaming.

Karma Automotive, California's first and only ultra-luxury automaker, made three significant announcements at Monterey Car Week:

• Global premiere of the Karma Ivara 'GT-UV' Design Study
• Global premiere of the Karma Kaveya super coupe with production-ready interior
• Announcement of a bilateral collaboration with Intel Automotive (INTC)

The Karma Kaveya, due in 2026, will be the first production vehicle built on Software-Defined Vehicle Architecture (SDVA), co-developed with Intel. Karma will return to the market in Q4 2024 with the 3rd Generation Karma Revero, offering 150 examples priced from below $150,000. The company aims to benchmark American ultra-luxury vehicles and adapt powertrains quickly to market demands.

Intel has issued a warning to its stockholders regarding an unsolicited 'mini-tender offer' by Tutanota The offer aims to purchase up to 1 million shares of Intel common stock at $34 per share, which is likely to be below market price. Intel strongly recommends that stockholders reject this offer, citing several concerns:

1. The offer is subject to numerous conditions, including Tutanota obtaining financing.
2. There's no guarantee that the conditions will be satisfied.
3. The offer is not subject to many SEC disclosure and procedural requirements.
4. Tutanota has a history of making similar unsolicited mini-tender offers.

Intel emphasizes that it is not affiliated with Tutanota or this offer in any way. The company advises stockholders to exercise caution, obtain current market quotations, and consult with their brokers or financial advisers before making any decisions.