HII is Awarded CHIPS and Science Act Microelectronics Technical Project

Rhea-AI Summary

HII's Mission Technologies division has been selected to lead one of four new microelectronics projects under the CHIPS and Science Act. The project, awarded in collaboration with the Silicon Crossroads Microelectronics Commons (SCMC) Hub, focuses on developing the first broadband Digital Direct Waveform Synthesizer (DDWS) solution. This highly programmable technology offers high-speed communication links, direct data acquisition, secure storage, and a root-of-trust processing environment.

The DDWS project aims to create a highly integrated, ruggedized, reliable, and low-size, weight, power and cost module for Department of Defense applications, including artificial intelligence and machine learning. HII will lead a team consisting of Purdue University, Marvell Government Solutions, NHanced Semiconductors, the Air Force Research Laboratory, and Naval Surface Warfare Center – Crane Division. The project is expected to advance performance in cognitive radar, electromagnetic warfare, intelligence, surveillance, reconnaissance, and electronic signal intelligence systems.

Positive

• HII's Mission Technologies division selected to lead a key microelectronics project under the CHIPS and Science Act
• Project aims to develop advanced Digital Direct Waveform Synthesizer (DDWS) solution for DoD applications
• Collaboration with prestigious institutions and companies in the microelectronics field
• Potential to advance performance in critical defense and intelligence systems

Negative

• None.

MCLEAN, Va., Oct. 09, 2024 (GLOBE NEWSWIRE) -- HII (NYSE: HII) announced today that its Mission Technologies division will lead one of the four new microelectronics projects stemming from the CHIPS and Science Act, which aims to strengthen the nation’s semiconductor manufacturing capabilities and reduce dependency on foreign sources of microelectronics.

The projects are awarded in collaboration with the Silicon Crossroads Microelectronics Commons (SCMC) Hub, as part of the Microelectronics Commons initiative.

Mission Technologies will lead a team in developing the first broadband Digital Direct Waveform Synthesizer (DDWS) solution. The DDWS solution is highly programmable and offers high-speed communication links, direct data acquisition for flexible processing, secure storage, and the ability to create a root-of-trust processing environment.

A photo accompanying this release is available at https://hii.com/newsroom/.

“We're now part of the U.S. reclaiming the microelectronics industry and eliminating our dependency on foreign technology,” said Dino Cencetti, vice president of C5ISR systems operation at Mission Technologies. “We are honored to be a part of this entire program and appreciative of all the work completed by the consortium, hubs and everyone involved. We are excited to get this work going and enable next generation, digital modernization and miniaturization made right here in the U.S.A.”

Michael Bilyeu, SCMC’s technical program manager, announced the awards on September 18 at ceremonies at the MIT Lincoln Laboratory in Lexington, Massachusetts, noting that the “desired end state” for the DDWS project is a highly integrated, ruggedized, reliable, and low-size, weight, power and cost module enabling features such as secure-edge computing targeting artificial intelligence and machine learning for Department of Defense applications.

The Mission Technologies DDWS team consists of HII, Purdue University, Marvell Government Solutions, NHanced Semiconductors, the Air Force Research Laboratory and Naval Surface Warfare Center – Crane Division.

Together, the team will work to advance performance of cognitive radar; electromagnetic warfare; intelligence, surveillance and reconnaissance; and electronic signal intelligence systems. The DDWS will also facilitate sensor integration into smaller platforms, such as autonomous vehicles, small drones and buoys.

About Silicon Crossroads Microelectronic Commons (SCMC) Hub
Led by the Applied Research Institute, the SCMC is an innovation ecosystem of diverse partners driven to accelerate expansion of America’s microelectronics base by leveraging strong collaborative practices that strategically support innovation, workforce development, and infrastructure needs to achieve domestic microelectronics excellence. For more information about the SCMC Hub, visit www.siliconcrossroads.us.

For more information about the Microelectronics Commons initiative, visit: https://www.defense.gov/News/Releases/Release/Article/3908176/.

About HII
HII is a global, all-domain defense provider. HII’s mission is to deliver the world’s most powerful ships and all-domain solutions in service of the nation, creating the advantage for our customers to protect peace and freedom around the world. As the nation’s largest military shipbuilder, and with a more than 135-year history of advancing U.S. national security, HII delivers critical capabilities extending from ships to unmanned systems, cyber, ISR, AI/ML and synthetic training. Headquartered in Virginia, HII’s workforce is 44,000 strong. For more information, visit:

• HII on the web: https://www.HII.com/
• HII on Facebook: https://www.facebook.com/TeamHII
• HII on X: https://www.twitter.com/WeAreHII
• HII on Instagram: https://www.instagram.com/WeAreHII

Contact:
Greg McCarthy
(202) 264-7126
gregory.j.mccarthy@hii-co.com

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/4fa39537-10cd-470d-aa18-ad3d48464b3c

FAQ

What is the CHIPS and Science Act project awarded to HII (NYSE: HII)?

HII's Mission Technologies division has been awarded a project to develop the first broadband Digital Direct Waveform Synthesizer (DDWS) solution, as part of the CHIPS and Science Act's Microelectronics Commons initiative.

What are the key features of the DDWS solution being developed by HII (NYSE: HII)?

The DDWS solution is highly programmable and offers high-speed communication links, direct data acquisition for flexible processing, secure storage, and the ability to create a root-of-trust processing environment.

Who are the partners collaborating with HII (NYSE: HII) on the DDWS project?

HII is leading a team that includes Purdue University, Marvell Government Solutions, NHanced Semiconductors, the Air Force Research Laboratory, and Naval Surface Warfare Center – Crane Division.

What are the potential applications of the DDWS technology being developed by HII (NYSE: HII)?

The DDWS technology is expected to advance performance in cognitive radar, electromagnetic warfare, intelligence, surveillance, reconnaissance, and electronic signal intelligence systems. It will also facilitate sensor integration into smaller platforms like autonomous vehicles, small drones, and buoys.