HII is Awarded CHIPS and Science Act Microelectronics Technical Project
HII's Mission Technologies division has been selected to lead one of four new microelectronics projects under the CHIPS and Science Act. The project, awarded in collaboration with the Silicon Crossroads Microelectronics Commons (SCMC) Hub, focuses on developing the first broadband Digital Direct Waveform Synthesizer (DDWS) solution. This highly programmable technology offers high-speed communication links, direct data acquisition, secure storage, and a root-of-trust processing environment.
The DDWS project aims to create a highly integrated, ruggedized, reliable, and low-size, weight, power and cost module for Department of Defense applications, including artificial intelligence and machine learning. HII will lead a team consisting of Purdue University, Marvell Government Solutions, NHanced Semiconductors, the Air Force Research Laboratory, and Naval Surface Warfare Center – Crane Division. The project is expected to advance performance in cognitive radar, electromagnetic warfare, intelligence, surveillance, reconnaissance, and electronic signal intelligence systems.
La divisione Mission Technologies di HII è stata selezionata per guidare uno dei quattro nuovi progetti di microelettronica nell'ambito del CHIPS and Science Act. Il progetto, assegnato in collaborazione con il Silicon Crossroads Microelectronics Commons (SCMC) Hub, si concentra sullo sviluppo della prima soluzione di Sintetizzatore di Onde Digitali Dirette (DDWS) a banda larga. Questa tecnologia altamente programmabile offre collegamenti di comunicazione ad alta velocità, acquisizione diretta dei dati, archiviazione sicura e un ambiente di elaborazione con radice di fiducia.
Il progetto DDWS mira a creare un modulo altamente integrato, robusto, affidabile e di dimensioni, peso, potenza e costo contenuti per applicazioni del Dipartimento della Difesa, comprese intelligenza artificiale e apprendimento automatico. HII guiderà un team composto dall'Università di Purdue, Marvell Government Solutions, NHanced Semiconductors, il Laboratorio di Ricerca dell'Air Force e il Naval Surface Warfare Center – Crane Division. Si prevede che il progetto migliori le prestazioni in radar cognitivi, guerra elettromagnetica, intelligenza, sorveglianza, ricognizione e sistemi di intelligenza dei segnali elettronici.
La división de Mission Technologies de HII ha sido seleccionada para liderar uno de los cuatro nuevos proyectos de microelectrónica bajo la Ley CHIPS y Ciencia. El proyecto, adjudicado en colaboración con el Silicon Crossroads Microelectronics Commons (SCMC) Hub, se centra en el desarrollo de la primera solución de Sintetizador de Forma de Onda Digital Directa (DDWS) de banda ancha. Esta tecnología altamente programable ofrece enlaces de comunicación de alta velocidad, adquisición directa de datos, almacenamiento seguro y un entorno de procesamiento basado en la confianza.
El proyecto DDWS tiene como objetivo crear un módulo altamente integrado, robusto, confiable y de bajo tamaño, peso, potencia y costo para aplicaciones del Departamento de Defensa, que incluyen inteligencia artificial y aprendizaje automático. HII liderará un equipo compuesto por la Universidad de Purdue, Marvell Government Solutions, NHanced Semiconductors, el Laboratorio de Investigación de la Fuerza Aérea y el Centro de Guerra de Superficie Naval – División Crane. Se espera que el proyecto avance en el rendimiento de radar cognitivo, guerra electromagnética, inteligencia, vigilancia, reconocimiento y sistemas de inteligencia de señales electrónicas.
HII의 Mission Technologies 부문은 CHIPS 및 과학 법안에 따라 4개의 새로운 마이크로일렉트로닉스 프로젝트 중 하나를 이끌도록 선정되었습니다. 이 프로젝트는 Silicon Crossroads Microelectronics Commons (SCMC) 허브와 협력하여 최초의 광대역 디지털 직접 파형 합성기(DDWS) 솔루션 개발에 집중하고 있습니다. 이 고도로 프로그래밍 가능한 기술은 고속 통신 링크, 직접 데이터 수집, 안전한 저장 및 신뢰의 뿌리를 가진 처리 환경을 제공합니다.
DDWS 프로젝트는 인공지능 및 기계학습을 포함한 국방부 애플리케이션을 위해 고도로 통합되고 내구성이 뛰어나며 신뢰할 수 있고 크기, 무게, 전력 및 비용이 낮은 모듈을 만드는 것을 목표로 하고 있습니다. HII는 퍼듀 대학교, Marvell 정부 솔루션, NHanced 반도체, 공군 연구소 및 해군 수상 작전 센터 – 크레인 분소로 구성된 팀을 이끌 것입니다. 이 프로젝트는 인지 레이더, 전자기 전쟁, 정보, 감시, 정찰 및 전자 신호 정보 시스템의 성능 향상을 기대하고 있습니다.
La division Mission Technologies de HII a été sélectionnée pour diriger l'un des quatre nouveaux projets de microélectronique dans le cadre de la loi CHIPS and Science. Le projet, attribué en collaboration avec le Silicon Crossroads Microelectronics Commons (SCMC) Hub, se concentre sur le développement de la première solution de Synthétiseur de Formes d'Ondes Numériques Directes (DDWS) à large bande. Cette technologie hautement programmable offre des liaisons de communication à haute vitesse, l'acquisition directe de données, un stockage sécurisé et un environnement de traitement de confiance.
Le projet DDWS vise à créer un module hautement intégré, robuste, fiable et de faible taille, poids, puissance et coût pour les applications du Département de la Défense, y compris l'intelligence artificielle et l'apprentissage automatique. HII dirigera une équipe composée de l'Université Purdue, de Marvell Government Solutions, de NHanced Semiconductors, du Laboratoire de Recherche de l'Air Force et du Naval Surface Warfare Center - Crane Division. Le projet devrait améliorer les performances en radar cognitif, guerre électromagnétique, renseignement, surveillance, reconnaissance et systèmes de renseignement des signaux électroniques.
Die Mission Technologies-Abteilung von HII wurde ausgewählt, um eines von vier neuen Mikroelektronikprojekten im Rahmen des CHIPS and Science Act zu leiten. Das Projekt, das in Zusammenarbeit mit dem Silicon Crossroads Microelectronics Commons (SCMC) Hub vergeben wurde, konzentriert sich auf die Entwicklung der ersten breitbandigen Digital Direct Waveform Synthesizer (DDWS)-Lösung. Diese hochgradig programmierbare Technologie bietet Hochgeschwindigkeitskommunikationsverbindungen, direkte Datenerfassung, sichere Speicherung und eine vertrauenswürdige Verarbeitungsumgebung.
Das DDWS-Projekt hat zum Ziel, ein hochgradig integriertes, robustes, zuverlässiges und in Größe, Gewicht, Stromverbrauch und Kosten niedrig gehaltenes Modul für Anwendungen des Verteidigungsministeriums, einschließlich künstlicher Intelligenz und maschinellem Lernen, zu schaffen. HII wird ein Team leiten, das aus der Purdue University, Marvell Government Solutions, NHanced Semiconductors, dem Air Force Research Laboratory und dem Naval Surface Warfare Center – Crane Division besteht. Es wird erwartet, dass das Projekt die Leistungsfähigkeit in kognitiven Radarsystemen, elektromagnetischer Kriegsführung, Geheimdienst, Überwachung, Aufklärung und elektronischen Signalaufklärungssystemen verbessert.
- HII's Mission Technologies division selected to lead a key microelectronics project under the CHIPS and Science Act
- Project aims to develop advanced Digital Direct Waveform Synthesizer (DDWS) solution for DoD applications
- Collaboration with prestigious institutions and companies in the microelectronics field
- Potential to advance performance in critical defense and intelligence systems
- None.
Insights
The CHIPS and Science Act project award to HII's Mission Technologies division is a significant development in the U.S. semiconductor industry. This initiative aims to reduce foreign dependency on microelectronics, which is important for national security and technological sovereignty.
The Digital Direct Waveform Synthesizer (DDWS) solution being developed has wide-ranging applications in defense and communication sectors. Its high programmability and capabilities in high-speed communications, data acquisition and secure processing make it a valuable asset for next-generation military and civilian technologies.
For investors, this project represents potential long-term growth in HII's government contracts and technological capabilities. The collaboration with prestigious institutions and companies like Purdue University and Marvell Government Solutions adds credibility and expertise to the project. However, the financial impact may not be immediate, as research and development projects often have extended timelines before yielding commercial results.
HII's involvement in this CHIPS and Science Act project strengthens its position in the defense technology sector. The focus on developing advanced microelectronics for cognitive radar, electromagnetic warfare and intelligence systems aligns well with the current trends in defense modernization.
The emphasis on miniaturization and integration into smaller platforms like autonomous vehicles and drones indicates a forward-looking approach that could give HII a competitive edge in future defense contracts. This project could potentially expand HII's market share in the growing field of autonomous and AI-enabled defense systems.
Investors should note that while this project enhances HII's technological capabilities, the financial impact may be gradual. The success of such R&D initiatives often translates into increased contract opportunities and revenue growth over the medium to long term, rather than immediate financial gains.
MCLEAN, Va., Oct. 09, 2024 (GLOBE NEWSWIRE) -- HII (NYSE: HII) announced today that its Mission Technologies division will lead one of the four new microelectronics projects stemming from the CHIPS and Science Act, which aims to strengthen the nation’s semiconductor manufacturing capabilities and reduce dependency on foreign sources of microelectronics.
The projects are awarded in collaboration with the Silicon Crossroads Microelectronics Commons (SCMC) Hub, as part of the Microelectronics Commons initiative.
Mission Technologies will lead a team in developing the first broadband Digital Direct Waveform Synthesizer (DDWS) solution. The DDWS solution is highly programmable and offers high-speed communication links, direct data acquisition for flexible processing, secure storage, and the ability to create a root-of-trust processing environment.
A photo accompanying this release is available at https://hii.com/newsroom/.
“We're now part of the U.S. reclaiming the microelectronics industry and eliminating our dependency on foreign technology,” said Dino Cencetti, vice president of C5ISR systems operation at Mission Technologies. “We are honored to be a part of this entire program and appreciative of all the work completed by the consortium, hubs and everyone involved. We are excited to get this work going and enable next generation, digital modernization and miniaturization made right here in the U.S.A.”
Michael Bilyeu, SCMC’s technical program manager, announced the awards on September 18 at ceremonies at the MIT Lincoln Laboratory in Lexington, Massachusetts, noting that the “desired end state” for the DDWS project is a highly integrated, ruggedized, reliable, and low-size, weight, power and cost module enabling features such as secure-edge computing targeting artificial intelligence and machine learning for Department of Defense applications.
The Mission Technologies DDWS team consists of HII, Purdue University, Marvell Government Solutions, NHanced Semiconductors, the Air Force Research Laboratory and Naval Surface Warfare Center – Crane Division.
Together, the team will work to advance performance of cognitive radar; electromagnetic warfare; intelligence, surveillance and reconnaissance; and electronic signal intelligence systems. The DDWS will also facilitate sensor integration into smaller platforms, such as autonomous vehicles, small drones and buoys.
About Silicon Crossroads Microelectronic Commons (SCMC) Hub
Led by the Applied Research Institute, the SCMC is an innovation ecosystem of diverse partners driven to accelerate expansion of America’s microelectronics base by leveraging strong collaborative practices that strategically support innovation, workforce development, and infrastructure needs to achieve domestic microelectronics excellence. For more information about the SCMC Hub, visit www.siliconcrossroads.us.
For more information about the Microelectronics Commons initiative, visit: https://www.defense.gov/News/Releases/Release/Article/3908176/.
About HII
HII is a global, all-domain defense provider. HII’s mission is to deliver the world’s most powerful ships and all-domain solutions in service of the nation, creating the advantage for our customers to protect peace and freedom around the world. As the nation’s largest military shipbuilder, and with a more than 135-year history of advancing U.S. national security, HII delivers critical capabilities extending from ships to unmanned systems, cyber, ISR, AI/ML and synthetic training. Headquartered in Virginia, HII’s workforce is 44,000 strong. For more information, visit:
- HII on the web: https://www.HII.com/
- HII on Facebook: https://www.facebook.com/TeamHII
- HII on X: https://www.twitter.com/WeAreHII
- HII on Instagram: https://www.instagram.com/WeAreHII
Contact:
Greg McCarthy
(202) 264-7126
gregory.j.mccarthy@hii-co.com
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/4fa39537-10cd-470d-aa18-ad3d48464b3c
FAQ
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