GMG's THERMAL-XR(R) Demonstrates Potential for Electronics Heat Sink Miniaturization and Efficiency
Graphene Manufacturing Group (GMGMF) has announced progress in the commercialization of THERMAL-XR®, their graphene-based coating for heat sinks in electronics. Third-party verified modeling shows that THERMAL-XR® coating can reduce heat sink size by up to 39% while maintaining equivalent thermal performance.
The coating demonstrates a 23% reduction in maximum temperature reached (62°C vs 80°C) compared to uncoated heat sinks of equal size. With projected global PCB production reaching 530 million square meters by 2030, and 5.2 billion units requiring heat sinks, the potential market for THERMAL-XR® could reach 26.5 million liters annually by 2030, assuming 0.1% market penetration.
Graphene Manufacturing Group (GMGMF) ha annunciato progressi nella commercializzazione di THERMAL-XR®, il loro rivestimento a base di grafene per dissipatori di calore nell'elettronica. La modellazione verificata da terzi mostra che il rivestimento THERMAL-XR® può ridurre le dimensioni del dissipatore di calore fino al 39% pur mantenendo prestazioni termiche equivalenti.
Il rivestimento dimostra una riduzione del 23% nella temperatura massima raggiunta (62°C contro 80°C) rispetto ai dissipatori di calore non rivestiti di pari dimensioni. Con la produzione globale di PCB prevista a 530 milioni di metri quadrati entro il 2030 e 5,2 miliardi di unità che richiedono dissipatori di calore, il mercato potenziale per THERMAL-XR® potrebbe raggiungere 26,5 milioni di litri all'anno entro il 2030, supponendo una penetrazione di mercato dello 0,1%.
Graphene Manufacturing Group (GMGMF) ha anunciado avances en la comercialización de THERMAL-XR®, su recubrimiento a base de grafeno para disipadores de calor en electrónica. La modelización verificada por terceros muestra que el recubrimiento THERMAL-XR® puede reducir el tamaño de los disipadores de calor en hasta un 39% manteniendo un rendimiento térmico equivalente.
El recubrimiento demuestra una reducción del 23% en la temperatura máxima alcanzada (62°C frente a 80°C) en comparación con disipadores de calor sin recubrimiento del mismo tamaño. Con la producción global de PCB proyectada en 530 millones de metros cuadrados para 2030 y 5,2 mil millones de unidades que requieren disipadores de calor, el mercado potencial para THERMAL-XR® podría alcanzar 26,5 millones de litros anuales para 2030, asumiendo una penetración de mercado del 0,1%.
그래핀 제조 그룹 (GMGMF)는 전자 기기의 히트 싱크용 그래핀 기반 코팅인 THERMAL-XR®의 상용화 진전을 발표했습니다. 제3자가 검증한 모델링에 따르면, THERMAL-XR® 코팅은 동등한 열 성능을 유지하면서 히트 싱크 크기를 최대 39%까지 줄일 수 있습니다.
이 코팅은 같은 크기의 비코팅 히트 싱크와 비교하여 최대 온도가 23% 감소하는 것을 보여줍니다 (62°C 대 80°C). 2030년까지 전 세계 PCB 생산이 5억 3천만 제곱미터에 이를 것으로 예상되며, 52억 개 유닛이 히트 싱크를 필요로 하기 때문에, THERMAL-XR®의 잠재적 시장은 2030년까지 연간 2,650만 리터에 이를 수 있으며, 시장 침투율이 0.1%라고 가정할 때 가능합니다.
Graphene Manufacturing Group (GMGMF) a annoncé des progrès dans la commercialisation de THERMAL-XR®, leur revêtement à base de graphène pour les dissipateurs thermiques dans l'électronique. La modélisation vérifiée par des tiers montre que le revêtement THERMAL-XR® peut réduire la taille des dissipateurs thermiques jusqu'à 39% tout en maintenant des performances thermiques équivalentes.
Le revêtement montre une réduction de 23% de la température maximale atteinte (62°C contre 80°C) par rapport aux dissipateurs thermiques non recouverts de même taille. Avec une production mondiale prévue de PCB atteignant 530 millions de mètres carrés d'ici 2030 et 5,2 milliards d'unités nécessitant des dissipateurs de chaleur, le marché potentiel pour THERMAL-XR® pourrait atteindre 26,5 millions de litres par an d'ici 2030, en supposant une pénétration de marché de 0,1%.
Graphene Manufacturing Group (GMGMF) hat Fortschritte bei der Kommerzialisierung von THERMAL-XR®, ihrem graphenbasierten Beschichtungssystem für Kühlkörper in der Elektronik, angekündigt. Unabhängig verifiziertes Modeling zeigt, dass die THERMAL-XR®-Beschichtung die Größe des Kühlkörpers um bis zu 39% reduzieren kann, während die gleiche Wärmeleistung aufrechterhalten wird.
Die Beschichtung zeigt eine 23%ige Reduktion der maximal erreichten Temperatur (62°C zu 80°C) im Vergleich zu unbehandelten Kühlkörpern gleicher Größe. Bei einer voraussichtlichen globalen PCB-Produktion von 530 Millionen Quadratmetern bis 2030 und 5,2 Milliarden Einheiten, die Kühlkörper benötigen, könnte der potenzielle Markt für THERMAL-XR® bis 2030 jährlich 26,5 Millionen Liter erreichen, vorausgesetzt, die Marktdurchdringung beträgt 0,1%.
- THERMAL-XR® coating reduces heat sink maximum temperature by 23%
- Enables 39% size reduction in heat sinks while maintaining performance
- Potential market of 26.5 million liters annually by 2030
- Product addresses growing thermal management needs in electronics industry
- Only 0.1% market penetration assumed in projections
- Product still in testing phase with potential customers
Brisbane, Queensland, Australia--(Newsfile Corp. - December 11, 2024) - Graphene Manufacturing Group Ltd. (TSXV: GMG) (OTCQX: GMGMF) ("GMG" or the "Company") is pleased to provide a business update on the commercialisation progress of THERMAL-XR® Powered by GMG Graphene.
CUSTOMER ENGAGEMENT UPDATE
GMG continues to make progress in testing with companies in multiple industries for the use of THERMAL-XR® in their products, including on heat sinks for electronics. Figure 1 shows an aluminium heat sink that is commonly used in electronics for removing heat from printed circuit boards, electrical circuits and processing silicon chips, and that has been coated with THERMAL-XR®.
Figure 1: THERMAL-XR® Coated Electronics Heat Sink
To view an enhanced version of this graphic, please visit:
https://images.newsfilecorp.com/files/8082/233324_9491c90934ed3928_001full.jpg
HEAT SINK MINIATURISATION:
Third-party verified modelling demonstrates that applying THERMAL-XR® to a heat sink could reduce its size by up to
To view an enhanced version of this graphic, please visit:
https://images.newsfilecorp.com/files/8082/233324_9491c90934ed3928_002full.jpg
| Material | Ambient Temp. (˚C) | Power (W) | Emissivity | Convection Type | Heat Sink Dimensions (mm) | Max Temp. (˚C) | Temperature Difference Between Aluminium and THERMAL-XR® | |||
| Width | Length | Height | ΔT(˚C) | ΔT% | ||||||
| Aluminium | 25 | 80 | 0.11 | Natural Convection | 62 | 58 | 38 | 80 | -18 | |
| THERMAL-XR® | 0.95 | 62 | ||||||||
Figure 2: Modelling of an Electronic Heat Sink with THERMAL-XR® coated on all sides, excluding the base, shows a
To view an enhanced version of this graphic, please visit:
https://images.newsfilecorp.com/files/8082/233324_9491c90934ed3928_003full.jpg
| Material | Ambient Temp. (˚C) | Power (W) | Emissivity | Convection Type | No. of Fins | Heat Sink Size (mm) | Temperature (˚C) | ||||
| Width | Length | Height | ΔW% | Max | Min | ||||||
| Aluminium | 25 | 80 | 0.11 | Natural Convection | 8 | 62 | 58 | 38 | - | 80 | 76.7 |
| THERMAL-XR® | 0.95 | 5 | 38 | 58 | 38 | - | 80 | 75 | |||
Figure 3: A heat sink coated with THERMAL-XR® on all sides, excluding the base, that is
Global Printed Circuit Board (PCB) production is projected[1] to reach 530 million square meters annually by the year 2030, or about 5.3 trillion printed circuit boards. As PCB density increases, higher current loads lead to more heat, with 5.2 billion units expected to require heat sinks for cooling. THERMAL-XR® coated on the heat sinks, enhances the heat sink efficiency, enabling smaller heat sinks and more compact PCB assemblies. The total amount of THERMAL-XR® that could be used for this application to improve performance is 26.5 million litres per annum by 2030, assuming
GMG's Managing Director and CEO, Craig Nicol, commented: "Heat sinks are a critical component of modern electronics, but they come with various challenges, especially as devices become smaller, faster, and more powerful. GMG's THERMAL-XR® offers a potential solution in heat sink miniaturization, enabling up to
About THERMAL-XR® powered by GMG Graphene:
THERMAL-XR® COATING SYSTEM is a unique method of improving the thermal heat transfer of heat exchange surfaces. The process coats and protects heat exchange surfaces while increasing the heat transfer rate by leveraging the physics of GMG Graphene, resulting in an efficiency improvement and a potential power reduction.
THERMAL-XR® is powered by GMG Graphene. PATENT PENDING
About GMG www.graphenemg.com
GMG is a clean-technology company which seeks to offer energy saving and energy storage solutions, enabled by graphene, including that manufactured in-house via a proprietary production process. GMG has developed a proprietary production process to decompose natural gas (i.e. methane) into its elements, carbon (as graphene), hydrogen and some residual hydrocarbon gases. This process produces high quality, low cost, scalable, 'tuneable' and low/no contaminant graphene suitable for use in clean-technology and other applications.
The Company's present focus is to de-risk and develop commercial scale-up capabilities, and secure market applications. In the energy savings segment, GMG has focused on graphene enhanced heating, ventilation and air conditioning ("HVAC-R") coating (or energy-saving coating), lubricants and fluids.
In the energy storage segment, GMG and the University of Queensland are working collaboratively with financial support from the Australian Government to progress R&D and commercialization of graphene aluminium-ion batteries ("G+AI Batteries").
GMG's 4 critical business objectives are:
- Produce Graphene and improve/scale cell production processes
- Build Revenue from Energy Savings Products
- Develop Next-Generation Battery
- Develop Supply Chain, Partners & Project Execution Capability
For further information please contact:
- Craig Nicol, Chief Executive Officer & Managing Director of the Company at craig.nicol@graphenemg.com, +61 415 445 223
- Leo Karabelas at Focus Communications Investor Relations, leo@fcir.ca, +1 647 689 6041
Neither the TSX Venture Exchange nor its Regulation Services Provider (as that term is defined in the policies of the TSX Venture Exchange) accept responsibility for the adequacy or accuracy of this news release.
Cautionary Note Regarding Forward-Looking Statements
This news release includes certain statements and information that may constitute forward-looking information within the meaning of applicable Canadian securities laws. Forward-looking statements relate to future events or future performance and reflect the expectations or beliefs of management of the Company regarding future events. Generally, forward-looking statements and information can be identified by the use of forward-looking terminology such as "intends", "expects" or "anticipates", or variations of such words and phrases or statements that certain actions, events or results "may", "could", "should", "would" or will "potentially" or "likely" occur. This information and these statements, referred to herein as "forward‐looking statements", are not historical facts, are made as of the date of this news release and include without limitation, the progression of testing and sales of THERMAL-XR® in multiple industries, the benefits of using THERMAL-XR® on heat sinks, the projected growth of PCB production, and the number of PCBs which will require heat sinks in the future.
Such forward-looking statements are based on a number of assumptions of management, including, without limitation, that the Company will continue to receive interest in testing and buying THERMAL-XR® from multiple industries, that the use of THERMAL-XR® on heat sinks will result in the benefits expected by management, that the use of THERMAL-XR® will allow heat sinks to be smaller while delivering equivalent thermal performance, that PCB production will grow as currently projected, and that the number of PCBs requiring heat sinks in the future will align with current estimates. Additionally, forward-looking information involves a variety of known and unknown risks, uncertainties and other factors which may cause the actual plans, intentions, activities, results, performance or achievements of GMG to be materially different from any future plans, intentions, activities, results, performance or achievements expressed or implied by such forward-looking statements. Such risks include, without limitation: that the Company will not continue to receive interest in testing and purchasing THERMAL-XR® from multiple industries, that THERMAL-XR® will not have the expected benefits when applied to heat sinks, that the size of heat sinks will not be reduced, that PCB production will not grow as expected, that PCBs will not require heat sinks in the future, that THERMAL-XR® coated heat sinks will not enable more compact printed circuit board assemblies, that there will not be demand for THERMAL-XR® in the heat sink market, risks relating to the extent and duration of the conflict in Eastern Europe and its impact on global markets, the volatility of global capital markets, political instability, the failure of the Company to obtain regulatory approvals, attract and retain skilled personnel, unexpected development and production challenges, unanticipated costs and the risk factors set out under the heading "Risk Factors" in the Company's annual information form dated October 3, 2024 available for review on the Company's profile at www.sedarplus.ca.
Although management of the Company has attempted to identify important factors that could cause actual results to differ materially from those contained in forward-looking statements or forward-looking information, there may be other factors that cause results not to be as anticipated, estimated or intended. There can be no assurance that such statements will prove to be accurate, as actual results and future events could differ materially from those anticipated in such statements. Accordingly, readers should not place undue reliance on forward-looking statements and forward-looking information. Readers are cautioned that reliance on such information may not be appropriate for other purposes. The Company does not undertake to update any forward-looking statement, forward-looking information or financial out-look that are incorporated by reference herein, except in accordance with applicable securities laws. We seek safe harbor.
[1] Areas of PCB production projected from the source, Prismark Printed Circuit Board Market Report 2021, page 13
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FAQ
What performance improvements does THERMAL-XR® coating show for GMGMF's heat sinks?
What is the projected market size for GMGMF's THERMAL-XR® in heat sink applications by 2030?
How does THERMAL-XR® coating impact heat sink design for GMGMF?
What is the total addressable market for GMGMF's THERMAL-XR® in PCB production by 2030?
