Corning Unveils EXTREME ULE® Glass to Enable Next Generation of Microchips
Corning Incorporated (NYSE: GLW) has unveiled Corning® EXTREME ULE® Glass, a next-generation material designed to support chip manufacturers in meeting the growing demand for advanced and intelligent technologies. This new glass will help improve photomasks, which are critical for mass-producing today's most advanced microchips.
EXTREME ULE® Glass is designed to withstand high-intensity extreme ultraviolet (EUV) lithography, including high numerical aperture (High NA) EUV. Its thermal expansion qualities deliver consistency and performance across all photomasks, while its flatness and uniformity reduce photomask waviness. This allows for the application of advanced coatings and limits unwanted variability for manufacturers.
The new glass is an evolution of Corning's ULE® (Ultra-Low Expansion) glass portfolio, known for its near-zero expansion characteristics. Corning expects its innovative glass-forming process to reduce energy use and waste generation, contributing to the company's sustainability commitment.
Corning Incorporated (NYSE: GLW) ha presentato il Corning® EXTREME ULE® Glass, un materiale di nuova generazione progettato per supportare i produttori di chip nel soddisfare la crescente domanda di tecnologie avanzate e intelligenti. Questo nuovo vetro contribuirà a migliorare i fotomask, fondamentali per la produzione di massa dei microchip più avanzati di oggi.
Il vetro EXTREME ULE® è progettato per resistere alla litografia ultravioletta estrema (EUV) ad alta intensità, inclusa la EUV ad alta apertura numerica (High NA). Le sue qualità di espansione termica garantiscono coerenza e prestazioni in tutti i fotomask, mentre la sua planarità e uniformità riducono l'ondulazione dei fotomask. Questo consente l'applicazione di rivestimenti avanzati e limita la variabilità indesiderata per i produttori.
Il nuovo vetro rappresenta un'evoluzione del portafoglio di vetri ULE® (Ultra-Low Expansion) di Corning, noto per le sue caratteristiche di espansione quasi zero. Corning prevede che il suo innovativo processo di formazione del vetro riduca il consumo energetico e la generazione di rifiuti, contribuendo all'impegno di sostenibilità dell'azienda.
Corning Incorporated (NYSE: GLW) ha presentado el Corning® EXTREME ULE® Glass, un material de próxima generación diseñado para apoyar a los fabricantes de chips en el cumplimiento de la creciente demanda de tecnologías avanzadas e inteligentes. Este nuevo vidrio ayudará a mejorar las fotomáscaras, que son críticas para la producción en masa de los microchips más avanzados de hoy.
El vidrio EXTREME ULE® está diseñado para resistir la litografía ultravioleta extrema (EUV) de alta intensidad, incluida la EUV de alta apertura numerica (High NA). Sus cualidades de expansión térmica ofrecen consistencia y rendimiento en todas las fotomáscaras, mientras que su planitud y uniformidad reducen la ondulación de las fotomáscaras. Esto permite la aplicación de recubrimientos avanzados y limita la variabilidad no deseada para los fabricantes.
El nuevo vidrio es una evolución del portafolio de vidrio ULE® (Ultra-Low Expansion) de Corning, conocido por sus características de expansión casi cero. Corning espera que su innovador proceso de formación de vidrio reduzca el consumo de energía y la generación de desechos, contribuyendo al compromiso de sostenibilidad de la empresa.
코닝 주식회사 (NYSE: GLW)는 칩 제조업체들이 고급 및 지능형 기술에 대한 증가하는 수요를 충족할 수 있도록 설계된 차세대 소재인 Corning® EXTREME ULE® Glass를 공개했습니다. 이 새로운 유리는 오늘날 가장 진보된 마이크로칩을 대량 생산하는 데 중요한 포토마스크를 개선하는 데 도움을 줄 것입니다.
EXTREME ULE® Glass는 고강도 극자외선 (EUV) 리소그래피, 특히 높은 수치 조리개 (High NA) EUV를 견딜 수 있도록 설계되었습니다. 열 팽창 특성은 모든 포토마스크에서 일관성과 성능을 제공하며, 평탄성과 균일성은 포토마스크의 물결 모양을 줄입니다. 이를 통해 고급 코팅을 적용할 수 있고, 제조업체의 원하지 않는 변동성을 제한할 수 있습니다.
새로운 유리는 코닝의 ULE® (Ultra-Low Expansion) 유리 포트폴리오의 진화된 형태로, 거의 제로에 가까운 팽창 특성으로 알려져 있습니다. 코닝은 혁신적인 유리 성형 과정이 에너지 사용과 폐기물 생성을 줄여 회사의 지속 가능성 약속에 기여할 것이라고 기대하고 있습니다.
Corning Incorporated (NYSE: GLW) a dévoilé le Corning® EXTREME ULE® Glass, un matériau de nouvelle génération conçu pour aider les fabricants de puces à répondre à la demande croissante de technologies avancées et intelligentes. Ce nouveau verre contribuera à améliorer les photomasks, qui sont critiques pour la production de masse des microchips les plus avancés d'aujourd'hui.
Le verre EXTREME ULE® est conçu pour résister à la lithographie ultraviolette extrême (EUV) à haute intensité, y compris l'EUV à grande ouverture numérique (High NA). Ses propriétés d'expansion thermique assurent cohérence et performance dans tous les photomasks, tandis que sa planéité et son uniformité réduisent les ondulations des photomasks. Cela permet l'application de revêtements avancés et limite la variabilité indésirable pour les fabricants.
Le nouveau verre est une évolution du portefeuille de verre ULE® (Ultra-Low Expansion) de Corning, connu pour ses caractéristiques d'expansion quasi nulles. Corning s'attend à ce que son processus innovant de formation de verre réduise la consommation d'énergie et la génération de déchets, contribuant ainsi à l'engagement de durabilité de l'entreprise.
Corning Incorporated (NYSE: GLW) hat das Corning® EXTREME ULE® Glass vorgestellt, ein Material der nächsten Generation, das Chip-Herstellern helfen soll, der wachsenden Nachfrage nach fortschrittlichen und intelligenten Technologien gerecht zu werden. Dieses neue Glas wird zur Verbesserung von Fotomasken beitragen, die für die Massenproduktion der fortschrittlichsten Mikrochips von heute entscheidend sind.
EXTREME ULE® Glass ist darauf ausgelegt, der hochintensiven extremen Ultraviolett (EUV) Lithographie standzuhalten, einschließlich EUV mit hoher numerischer Apertur (High NA). Seine thermischen Expansionseigenschaften gewährleisten Konsistenz und Leistung in allen Fotomasken, während seine Ebenheit und Homogenität die Welligkeit der Fotomasken reduzieren. Dies ermöglicht die Anwendung fortschrittlicher Beschichtungen und begrenzt unerwünschte Variabilität für die Hersteller.
Das neue Glas ist eine Weiterentwicklung des ULE® (Ultra-Low Expansion) Glasportfolios von Corning, das für seine nahezu Null-Erweiterungseigenschaften bekannt ist. Corning erwartet, dass der innovative Glasbildungsprozess den Energieverbrauch und die Abfallproduktion reduziert und damit zur Nachhaltigkeitsverpflichtung des Unternehmens beiträgt.
- Introduction of EXTREME ULE® Glass to support advanced chip manufacturing
- Designed to withstand high-intensity EUV lithography, including High NA EUV
- Improves photomask performance and consistency
- Reduces photomask waviness, limiting unwanted variability
- Expected to reduce energy use and waste generation in production
- None.
Insights
Corning's unveiling of EXTREME ULE® Glass represents a significant advancement in semiconductor manufacturing technology. This innovation addresses critical challenges in producing advanced microchips, particularly for AI applications. The glass's ability to withstand high-intensity EUV lithography, including High NA EUV, is important for creating more complex and smaller chip designs.
Key benefits include:
- Enhanced thermal stability for consistent manufacturing
- Improved flatness and uniformity, reducing photomask waviness
- Compatibility with advanced coatings
- Potential for higher yields in chip production
This development aligns with the industry's pursuit of Moore's Law and could strengthen Corning's position in the semiconductor supply chain. While the immediate financial impact is not quantified, the long-term implications for Corning's market share and revenue in the growing AI chip market could be substantial.
Corning's EXTREME ULE® Glass launch is strategically timed to capitalize on the booming AI market and increasing demand for advanced semiconductors. The global semiconductor industry, valued at
This product positions Corning to benefit from:
- Growing EUV lithography market, expected to reach
$15.45 billion by 2027 - Increasing AI chip demand, with the AI chip market projected to hit
$83.25 billion by 2027 - Sustainability trends in manufacturing, aligning with ESG investor priorities
While competitors like Asahi Glass and Schott also operate in this space, Corning's innovation could provide a competitive edge. Investors should monitor Corning's ability to secure partnerships with leading chip manufacturers and its market share gains in the coming quarters.
“As the demands of integrated chipmaking grow with the rise of artificial intelligence, glass innovation is more important than ever,” said Claude Echahamian, Vice President & General Manager, Corning Advanced Optics. “EXTREME ULE® Glass will expand Corning’s vital role in the ongoing pursuit of Moore’s Law by helping enable higher-powered EUV manufacturing as well as higher yield.”
The thermal expansion qualities of EXTREME ULE® Glass help deliver remarkable consistency and performance across all photomasks. In addition, the glass’s exceptional flatness and uniformity significantly reduces photomask waviness, helping limit unwanted variability for manufacturers and allowing for the application of advanced coatings.
EXTREME ULE® Glass marks an evolution in Corning’s portfolio of ULE® (Ultra-Low Expansion) glass, a titania-silicate glass material with near-zero expansion characteristics long used for EUV photomasks and lithography mirrors. By using its innovative glass-forming process,
For more information on Corning’s latest semiconductor manufacturing innovations, visit www.corning.com/advanced-optics.
About Corning Incorporated
View source version on businesswire.com: https://www.businesswire.com/news/home/20240929815986/en/
Media Relations:
Jamie Post
(607) 974-4843
PostJl@corning.com
Investor Relations:
Ann H.S. Nicholson
(607) 974-6716
NicholsoAs@corning.com
Source: Corning Incorporated
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