GlobalFoundries Announces New York Advanced Packaging and Photonics Center
GlobalFoundries (GFS) announced plans to establish a New York Advanced Packaging and Photonics Center for advanced packaging and testing of U.S.-made chips. The center, supported by investments from New York State and the U.S. Department of Commerce, will be located within GF's New York manufacturing facility.
The facility will focus on silicon photonics and 3D/heterogeneously integrated chips for AI, automotive, aerospace, defense, and communications applications. GF's total investment is expected to be $575 million, plus $186 million in R&D over 10+ years. The project will receive up to $20 million from New York state and $75 million from the U.S. Department of Commerce.
The center aims to create approximately 100 new full-time jobs in New York over the next five years and will provide end-to-end U.S.-based solutions for chips made at GF's New York facility, addressing the current concentration of advanced packaging in Asia.
GlobalFoundries (GFS) ha annunciato piani per istituire un Centro Avanzato di Imballaggio e Fotonica di New York per l'imballaggio avanzato e il collaudo di chip prodotti negli Stati Uniti. Il centro, supportato da investimenti dello Stato di New York e del Dipartimento del Commercio degli Stati Uniti, sarà situato all'interno dell'impianto di produzione di GF a New York.
La struttura si concentrerà sulla fotonica al silicio e sui chip integrati in 3D/eterogenei per applicazioni in intelligenza artificiale, automotive, aerospaziale, difesa e comunicazioni. L'investimento totale di GF è previsto essere di 575 milioni di dollari, oltre 186 milioni di dollari in ricerca e sviluppo nel corso di oltre 10 anni. Il progetto riceverà fino a 20 milioni di dollari dallo Stato di New York e 75 milioni di dollari dal Dipartimento del Commercio degli Stati Uniti.
Il centro mira a creare circa 100 nuovi posti di lavoro a tempo pieno a New York nei prossimi cinque anni e fornirà soluzioni complete basate negli Stati Uniti per i chip prodotti presso l'impianto di GF a New York, affrontando l'attuale concentrazione dell'imballaggio avanzato in Asia.
GlobalFoundries (GFS) anunció planes para establecer un Centro Avanzado de Empaque y Fotónica de Nueva York para el empaque avanzado y la prueba de chips fabricados en EE. UU. El centro, respaldado por inversiones del Estado de Nueva York y del Departamento de Comercio de EE. UU., estará ubicado dentro de la instalación de fabricación de GF en Nueva York.
La instalación se centrará en la fotónica de silicio y chips integrados 3D/heterogéneos para aplicaciones en inteligencia artificial, automotriz, aeroespacial, defensa y comunicaciones. Se espera que la inversión total de GF sea de 575 millones de dólares, más 186 millones de dólares en I+D durante más de 10 años. El proyecto recibirá hasta 20 millones de dólares del estado de Nueva York y 75 millones de dólares del Departamento de Comercio de EE. UU.
El centro tiene como objetivo crear aproximadamente 100 nuevos empleos a tiempo completo en Nueva York durante los próximos cinco años y proporcionará soluciones completas basadas en EE. UU. para los chips fabricados en la instalación de GF en Nueva York, abordando la actual concentración de empaque avanzado en Asia.
GlobalFoundries (GFS)는 미국산 칩의 고급 포장 및 테스트를 위한 뉴욕 고급 포장 및 포토닉스 센터를 설립할 계획을 발표했습니다. 이 센터는 뉴욕주 및 미국 상무부의 투자 지원을 받아 GF의 뉴욕 제조 시설 내에 위치할 것입니다.
이 시설은 인공지능, 자동차, 항공우주, 방위 및 통신 응용 프로그램을 위한 실리콘 포토닉스 및 3D/이질적으로 통합된 칩에 중점을 둘 것입니다. GF의 총 투자는 5억 7,500만 달러로 예상되며, 1억 8,600만 달러의 연구개발비가 10년 이상 소요될 것입니다. 이 프로젝트는 뉴욕주로부터 최대 2천만 달러와 미국 상무부로부터 7500만 달러를 지원받을 것입니다.
센터는 향후 5년 동안 뉴욕에서 약 100개의 새로운 정규직 일자리를 창출하고, GF의 뉴욕 시설에서 제조된 칩을 위한 미국 기반의 종합 솔루션을 제공하여 아시아에서의 고급 포장 집중 문제를 해결하는 것을 목표로 합니다.
GlobalFoundries (GFS) a annoncé des plans pour établir un Centre Avancé d'Emballage et de Photonique de New York pour l'emballage avancé et le test de puces fabriquées aux États-Unis. Ce centre, soutenu par des investissements de l'État de New York et du Département du Commerce des États-Unis, sera situé dans l'usine de fabrication de GF à New York.
La structure se concentrera sur la photonique au silicium et les puces intégrées 3D/hétérogènes pour les applications en intelligence artificielle, automobile, aérospatiale, défense et communications. L'investissement total de GF devrait atteindre 575 millions de dollars, plus 186 millions de dollars en R&D sur plus de 10 ans. Le projet recevra jusqu'à 20 millions de dollars de l'État de New York et 75 millions de dollars du Département du Commerce des États-Unis.
Le centre vise à créer environ 100 nouveaux emplois à temps plein à New York au cours des cinq prochaines années et fournira des solutions complètes basées aux États-Unis pour les puces fabriquées dans l'installation GF de New York, abordant la concentration actuelle de l'emballage avancé en Asie.
GlobalFoundries (GFS) hat Pläne angekündigt, ein Fortgeschrittenes Verpackungs- und Photonikkzentrum in New York einzurichten, das sich mit fortschrittlicher Verpackung und Test von in den USA hergestellten Chips befasst. Das Zentrum, unterstützt durch Investitionen des Bundesstaates New York und des US-Handelsministeriums, wird in der Produktionsstätte von GF in New York untergebracht sein.
Die Einrichtung wird sich auf Silizium-Photonik und 3D/heterogen integrierte Chips für Anwendungen in KI, Automobil, Luft- und Raumfahrt, Verteidigung und Kommunikation konzentrieren. Die Gesamtsumme der Investition von GF wird voraussichtlich 575 Millionen US-Dollar betragen, plus 186 Millionen US-Dollar für Forschung und Entwicklung über einen Zeitraum von mehr als 10 Jahren. Das Projekt wird bis zu 20 Millionen US-Dollar vom Bundesstaat New York und 75 Millionen US-Dollar vom US-Handelsministerium erhalten.
Das Zentrum zielt darauf ab, in den nächsten fünf Jahren etwa 100 neue Vollzeitarbeitsplätze in New York zu schaffen und umfassende, in den USA basierende Lösungen für die in der GF-New Yorker Einrichtung hergestellten Chips anzubieten, um die derzeitige Konzentration der fortschrittlichen Verpackung in Asien anzugehen.
- Secured $95 million in government funding ($75M federal + $20M state)
- Creating 100 new full-time jobs over next 5 years
- Expanding into growing silicon photonics market for AI and automotive applications
- Strengthening U.S. domestic semiconductor supply chain
- Strategic investment of $575M plus $186M in R&D over 10+ years
- Significant capital expenditure required ($575M + $186M R&D)
- Long-term ROI timeline (10+ years)
- Relatively modest job creation (100 jobs) compared to investment size
Insights
The establishment of GF's $575 million advanced packaging facility in New York marks a strategic shift in U.S. semiconductor manufacturing capabilities. The center addresses critical supply chain vulnerabilities by bringing end-to-end chip production onshore. The integration of silicon photonics with advanced packaging capabilities positions GF to capitalize on the growing AI infrastructure market, where chip interconnect speeds and power efficiency are paramount.
The facility's 12LP+ and 22FDX® platforms with wafer-to-wafer bonding capabilities enable the production of sophisticated 3D and heterogeneously integrated chips - essential for next-generation AI and automotive applications. The Trusted Foundry accreditation is particularly valuable, allowing GF to secure defense contracts that require domestic production from start to finish.
This investment significantly strengthens GF's competitive position in the high-margin advanced packaging segment. The $186 million R&D commitment over 10+ years, combined with $95 million in government support, demonstrates a strong public-private partnership that reduces capital risk. The creation of 100 new jobs is modest relative to the investment size, suggesting high automation and potential for strong operating margins.
The strategic focus on silicon photonics targets the rapidly growing AI infrastructure market, where competitors like TSMC and Intel are also expanding capabilities. The Trusted Foundry status provides a moat in the defense sector, while the domestic advanced packaging capability could command premium pricing from customers prioritizing supply chain security.
This project exemplifies the CHIPS Act's goal of reshoring critical semiconductor capabilities. The combination of federal ($75 million) and state ($20 million) funding leverages significant private investment to address strategic vulnerabilities in the U.S. semiconductor supply chain. The Trusted Foundry certification is particularly valuable for national security, as it enables fully domestic production of sensitive defense-related chips.
The investment aligns with broader government initiatives to strengthen domestic semiconductor manufacturing and reduce dependence on Asian packaging facilities. The focus on advanced technologies like silicon photonics and 3D integration supports U.S. leadership in next-generation semiconductor capabilities.
First of-its-kind center will offer advanced packaging and test capabilities in New York for U.S.-made essential chips used in AI, automotive, aerospace and defense, and other applications
MALTA, N.Y., Jan. 17, 2025 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Supported by investments from the State of New York and the U.S. Department of Commerce, the first-of-its-kind center aims to enable semiconductors to be securely manufactured, processed, packaged and tested entirely onshore in the United States to meet the growing demand for GF’s silicon photonics and other essential chips needed for critical end markets including AI, automotive, aerospace and defense, and communications.
Growth in AI is driving the adoption of silicon photonics and 3D and heterogeneously integrated (HI) chips to meet power, bandwidth and density requirements in datacenters and edge devices. Silicon photonics chips are also positioned to address power and performance needs in automotive, communications, radar, and other critical infrastructure applications. To meet this growing demand, GF’s New York Advanced Packaging and Photonics Center is expected to offer:
- Advanced packaging, assembly and testing for GF’s differentiated silicon photonics platform, which brings together optical and electrical components on a single chip to realize power efficiencies and performance advantages.
- Full turnkey advanced packaging, bump, assembly and testing for aerospace and defense customers under GF’s Trusted Foundry accreditation, allowing chips used in sensitive national security systems to never leave the U.S. during production.
- New production capabilities for the advanced packaging, wafer-to-wafer bonding, assembly and testing of 3D and HI chips using GF’s 12LP+, 22FDX®, and other leading platforms.
“We’re proud to partner at the state and federal level on this new center, which is a direct response to our customers asking for more geodiversity in their supply chains and additional support with advanced packaging solutions for GF silicon photonics, Trusted, and 3D/HI offerings,” said Dr. Thomas Caulfield, president and CEO of GF. “The New York Advanced Packaging and Photonics Center will be unique in our industry and will play a vital role in the continued growth of the Empire State’s world-class semiconductor manufacturing and innovation ecosystem.”
The New York Advanced Packaging and Photonics Center aims to expand GF’s advanced packaging capabilities – the process of transforming chips into individual packages ready for end-product use – to provide customers an end-to-end U.S.-based solution for chips made at GF’s New York manufacturing facility. Across the semiconductor industry, most advanced packaging today takes place in Asia.
GF’s overall investment in the New York Advanced Packaging and Photonics Center is expected to be
New York state will provide up to
GF employs approximately 2,500 people at its Malta, New York, fab and has invested more than
About GF
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented and diverse team delivers results with an unyielding focus on security, longevity and sustainability. For more information, visit www.gf.com.
©GlobalFoundries Inc., GF, GlobalFoundries, the GF logos and other GF marks are trademarks of GlobalFoundries Inc. or its subsidiaries. All other trademarks are the property of their respective owners.
Forward-looking Information
This press release includes “forward-looking statements” that reflect our current expectations and views of future events. These forward-looking statements are made under the “safe harbor” provisions of the U.S. Private Securities Litigation Reform Act of 1995 and include but are not limited to, statements regarding our financial outlook, future guidance, product development, business strategy and plans, and market trends, opportunities and positioning. These statements are based on current expectations, assumptions, estimates, forecasts, projections and limited information available at the time they are made. Words such as “expect,” “anticipate,” “should,” “believe,” “hope,” “target,” “project,” “goals,” “estimate,” “potential,” “predict,” “may,” “will,” “might,” “could,” “intend,” “shall,” “outlook,” “plan,” “aim,” and variations of these terms or the negative of these terms and similar expressions are intended to identify these forward-looking statements, although not all forward-looking statements contain these identifying words. Forward-looking statements are subject to a broad variety of risks and uncertainties, both known and unknown. Any inaccuracy in our assumptions and estimates could affect the realization of the expectations or forecasts in these forward-looking statements. For example, our business could be impacted by geopolitical conditions such as the ongoing political and trade tensions with China and the wars in Ukraine and Israel; domestic political developments, including with respect to the incoming U.S. presidential administration; the market for our products may develop or recover more slowly than expected or than it has in the past; we may fail to achieve the full benefits of our restructuring plan; our operating results may fluctuate more than expected; there may be significant fluctuations in our results of operations and cash flows related to our revenue recognition or otherwise; a network or data security incident that allows unauthorized access to our network or data or our customers’ data could result in a system disruption, loss of data or damage our reputation; we could experience interruptions or performance problems associated with our technology, including a service outage; global economic conditions could deteriorate, including due to increasing interest rates, rising inflation and any potential recession; and our expected results and planned expansions and operations may not proceed as planned if funding we expect to receive (including the awards under the CHIPS and Science Act and New York State Green CHIPS Program) is delayed or withheld for any reason. It is not possible for us to predict all risks, nor can we assess the impact of all factors on our business or the extent to which any factor, or combination of factors, may cause actual results or outcomes to differ materially from those contained in any forward-looking statements we may make. Moreover, we operate in a competitive and rapidly changing market, and new risks may emerge from time to time. These statements are based on our historical performance and on our current plans, estimates and projections in light of information currently available to us, and therefore you should not place undue reliance on them.
Although we believe that the expectations reflected in our statements are reasonable, we cannot guarantee that the future results, levels of activity, performance or events and circumstances described in the forward-looking statements will be achieved or occur. Moreover, neither we, nor any other person, assumes responsibility for the accuracy and completeness of these statements. Except to the extent required by federal securities laws, we undertake no obligation to update any information or any forward-looking statements as a result of new information, subsequent events or any other circumstances after the date hereof, or to reflect the occurrence of unanticipated events. Investors are urged to review in detail the risks and uncertainties discussed in our 2023 Annual Report on Form 20-F, current reports on Form 6-K and other reports filed with the Securities and Exchange Commission.
Media Contact:
Michael Mullaney
michael.mullaney@gf.com
FAQ
What is the total investment value for GFS's New York Advanced Packaging and Photonics Center?
How much government funding will GFS receive for the New York Advanced Packaging Center?
How many jobs will GFS's New York Advanced Packaging Center create?
What types of chips will GFS's New York Advanced Packaging Center focus on?
When will GFS's New York Advanced Packaging Center begin operations?
