GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
GlobalFoundries (GFS) and NXP Semiconductors announced a collaboration to develop next-generation solutions using GF's 22FDX platform. The partnership focuses on automotive, IoT, and smart mobile devices, with manufacturing in Dresden and Malta, New York. The 22FDX technology offers up to 50% higher performance and 70% less power consumption compared to other planar CMOS technologies. The platform integrates digital, analog, RF, power management, and non-volatile memory onto a single die, optimizing performance through dynamic voltage adjustment. Qualified for Automotive Grade 1 and 2 applications, it ensures reliability in extreme conditions up to 150°C junction temperature.
GlobalFoundries (GFS) e NXP Semiconductors hanno annunciato una collaborazione per sviluppare soluzioni di nuova generazione utilizzando la piattaforma 22FDX di GF. La partnership si concentra su settori come l'automotive, l'IoT e i dispositivi mobili intelligenti, con produzione a Dresda e Malta, New York. La tecnologia 22FDX offre prestazioni fino a 50% superiori e un consumo energetico del 70% inferiore rispetto ad altre tecnologie CMOS piane. La piattaforma integra funzioni digitali, analogiche, RF, gestione dell'energia e memoria non volatile su un singolo chip, ottimizzando le prestazioni attraverso la regolazione dinamica della tensione. Certificata per applicazioni di Grado Automobilistico 1 e 2, garantisce affidabilità in condizioni estreme fino a 150°C di temperatura di giunzione.
GlobalFoundries (GFS) y NXP Semiconductors anunciaron una colaboración para desarrollar soluciones de próxima generación utilizando la plataforma 22FDX de GF. La asociación se centra en la automoción, el IoT y dispositivos móviles inteligentes, con fabricación en Dresde y Malta, Nueva York. La tecnología 22FDX ofrece un rendimiento de hasta 50% más alto y un consumo de energía un 70% menor en comparación con otras tecnologías CMOS planas. La plataforma integra funciones digitales, analógicas, RF, gestión de energía y memoria no volátil en un solo chip, optimizando el rendimiento mediante el ajuste dinámico del voltaje. Calificada para aplicaciones de Grado Automotriz 1 y 2, garantiza fiabilidad en condiciones extremas de hasta 150°C de temperatura de unión.
글로벌파운드리(GFS)와 NXP 반도체가 GF의 22FDX 플랫폼을 통한 차세대 솔루션 개발을 위해 협력한다고 발표했습니다. 이 파트너십은 자동차, IoT 및 스마트 모바일 장치에 중점을 두고 있으며, 드레스덴과 뉴욕 말타에서 제조가 이루어집니다. 22FDX 기술은 다른 평면 CMOS 기술에 비해 최대 50% 더 높은 성능과 70% 낮은 전력 소비를 제공합니다. 이 플랫폼은 단일 칩에 디지털, 아날로그, RF, 전력 관리 및 비휘발성 메모리를 통합하여 동적 전압 조정을 통해 성능을 최적화합니다. 자동차 등급 1 및 2 애플리케이션에 대해 인증을 받았으며, 150°C의 접합 온도까지 극한 조건에서 신뢰성을 보장합니다.
GlobalFoundries (GFS) et NXP Semiconductors ont annoncé une collaboration pour développer des solutions de nouvelle génération utilisant la plate-forme 22FDX de GF. Ce partenariat se concentre sur l'automobile, l'IoT et les dispositifs mobiles intelligents, avec une fabrication à Dresde et à Malta, New York. La technologie 22FDX offre jusqu'à 50% de performance en plus et 70% de consommation d'énergie en moins par rapport aux autres technologies CMOS planes. La plate-forme intègre des fonctions numériques, analogiques, RF, de gestion de l'énergie et de mémoire non volatile sur une seule puce, optimisant les performances grâce à un ajustement dynamique de la tension. Qualifiée pour des applications de Classe Automobile 1 et 2, elle garantit la fiabilité dans des conditions extrêmes allant jusqu'à 150 °C de température de jonction.
GlobalFoundries (GFS) und NXP Semiconductors haben eine Zusammenarbeit zur Entwicklung von Lösungen der nächsten Generation angekündigt, die die 22FDX-Plattform von GF nutzen. Die Partnerschaft konzentriert sich auf Automobilindustrie, IoT und intelligente mobile Geräte mit Fertigung in Dresden und Malta, New York. Die 22FDX-Technologie bietet bis zu 50% höhere Leistung und 70% geringeren Stromverbrauch im Vergleich zu anderen planaren CMOS-Technologien. Die Plattform integriert digitale, analoge, RF-, Energieverwaltungs- und nicht-flüchtige Speicherfunktionen auf einem einzigen Chip und optimiert die Leistung durch dynamische Spannungsanpassung. Sie ist für Automotive Grade 1 und 2 Anwendungen qualifiziert und gewährleistet Zuverlässigkeit unter extremen Bedingungen bis zu 150°C Anschluss-Temperatur.
- Geographic diversification of manufacturing in both Europe and US
- 22FDX platform delivers 50% higher performance and 70% less power efficiency
- Technology qualified for Automotive Grade 1 and 2 applications
- Track record of shipping over 3 billion FDX chips globally
- None.
Insights
This strategic collaboration marks a significant advancement in semiconductor manufacturing, with substantial implications for the automotive and IoT sectors. The 22FDX platform offers compelling technical advantages, delivering up to
The dual-manufacturing location strategy in Dresden and Malta provides important supply chain resilience - a critical factor given recent semiconductor shortages. The platform's Automotive Grade 1 and 2 qualifications, combined with temperature resistance up to 150°C, position it strongly in the growing automotive semiconductor market. The integration of multiple components (digital, analog, RF, power management and NVM) onto a single die will significantly reduce manufacturing costs and improve overall system efficiency.
The automotive implications of this partnership are particularly noteworthy given the industry's rapid shift toward electrification and advanced driver assistance systems. The 22FDX platform's high-temperature tolerance and automotive-grade qualifications address critical reliability requirements for vehicle electronics. The platform's power efficiency advantages will be especially valuable for electric vehicles, where every watt of power savings translates to extended range.
The geographical diversification of manufacturing between Europe and the US aligns with automotive OEMs' increasing focus on supply chain security and regional manufacturing requirements, particularly important given recent geopolitical tensions affecting semiconductor availability.
Building on years of collaboration, this new process technology collaboration will provide power-efficient and secure connectivity solutions for essential consumer and industrial applications manufactured both in Europe and the U.S.
MALTA, N.Y. and EINDHOVEN, Netherlands, Oct. 23, 2024 (GLOBE NEWSWIRE) -- GlobalFoundries (Nasdaq: GFS) (GF) and NXP Semiconductors (NASDAQ: NXPI) today announced collaboration to drive next-generation solutions across a range of end markets including automotive, IoT and smart mobile devices. This collaboration leverages GF’s 22FDX® process technology platform and global manufacturing footprint to optimize the power, performance and time-to-market of NXP’s solutions. GF’s 22FDX chips will be manufactured in Dresden and Malta, New York, providing NXP geographically diverse supply for their customers.
The new collaboration, building on the longtime relationship between NXP and GF, will enable NXP to provide more compact and power-efficient solutions while increasing the overall performance of their system solutions. The companies will leverage GF's 22FDX platform, which optimizes performance by dynamically adjusting to the lowest possible voltage, delivering ultra-low power consumption and high performance for the most demanding applications. Purpose-built for intelligence at the edge, 22FDX optimizes energy management to deliver up to
“NXP’s innovative portfolio of high-performance solutions is crucial to enabling the essential technologies at the center of our increasingly connected world,” said Andy Micallef, executive vice president and chief operations and manufacturing officer at NXP. “GF’s 22FDX platform’s power efficiency and enhanced performance effectively enables our customers to build the next generation of connected and secure solutions. Additionally, GF’s robust manufacturing presence for 22FDX in Germany and the U.S. helps support our goals of having supply control and geographic resilience in our manufacturing base."
“Our close collaboration for over a decade has been a testament to the strength of our shared vision and commitment,” said Niels Anderskouv, chief business officer at GF. “As we move forward, we’re excited to build on this foundation and further enable NXP’s next-generation solutions with high-power efficiency and optimal performance, without customers needing to compromise on either.”
The 22FDX platform also maximizes performance per area by integrating digital, analog, RF, power management, and non-volatile memory (NVM) onto a single die. With best-in-class RF connectivity, 22FDX delivers responsive and reliable wireless connectivity for simple and secure connections. Integrated NVM reduces power consumption and latency while improving security, especially important given the growing memory footprint for Edge AI processors. Through this integration, NXP will create a one-stop shop platform to serve multiple markets while maximizing IP reuse.
With technology qualified for Automotive Grade 1 and 2 applications, 22FDX ensures exceptional reliability in extreme automotive conditions. As part of GF’s AutoPro™ solutions, the 22FDX platform includes advanced temperature-resistant capabilities up to 150°C junction temperature, which is critical to ensuring the long-term durability and safety of vehicle electronic systems.
Built on a rich heritage of FDX innovation, GF has a robust portfolio of silicon and product-proven IP for Automotive, Communications, and IoT applications. With a secure, global supply chain, GF has shipped more than 3 billion FDX chips to customers worldwide from Dresden and is now also shipping from Malta, N.Y.
Following the companies’ previous joint development of 40nm NVM technology, GF is well positioned to support NXP's next-gen solutions for years to come through its ongoing innovations to its FDX and FDX+ platforms.
About GF
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors the world relies on to live, work and connect. We innovate and partner with customers to deliver more power-efficient, high-performance products for the automotive, smart mobile devices, internet of things, communications infrastructure and other high-growth markets. With our global manufacturing footprint spanning the U.S., Europe, and Asia, GF is a trusted and reliable source for customers around the world. Every day, our talented and diverse team delivers results with an unyielding focus on security, longevity, and sustainability. For more information, visit www.gf.com.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP's "Brighter Together" approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of
Media Contact:
GlobalFoundries
Stephanie Gonzalez
Stephanie.gonzalez@gf.com
NXP Semiconductors
Paige Iven
paige.iven@nxp.com
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