Globalfoundries Inc. Stock Price, News & Analysis

GLOBALFOUNDRIES (Nasdaq: GFS) reported preliminary Q3 2025 results for the quarter ended September 30, 2025. Key metrics: revenue $1.688B, gross margin 24.8% (Non-IFRS 26.0%), operating margin 11.6% (Non-IFRS 15.4%), net income $249M and diluted EPS $0.44. Non-IFRS adjusted EBITDA was $573M. Cash, cash equivalents and marketable securities totaled $4.2B. Wafer shipments were 602k 300mm-equivalent (up 10% year-over-year).

Guidance for Q4 2025: revenue of $1.800B ± $25M, IFRS gross margin ~27.6% ±100bps (Non-IFRS ~28.5%), and Non-IFRS diluted EPS ~$0.47 ± $0.05. Recent commercial items include CBIC production release, expanded Silicon Labs partnership on 40nm ULP, and planned Dresden capacity expansion to >1M wafers/year by end of 2028.

GlobalFoundries (Nasdaq: GFS) has licensed 650V and 80V GaN technology from TSMC to accelerate its next-generation power portfolio for datacenter, industrial and automotive customers. The licensed technology will be qualified at GF’s Burlington, Vermont facility, using the site's high-voltage GaN-on-silicon expertise to speed volume production.

Development is set for early 2026 with production planned later in 2026. GF positions the move as a way to provide U.S.-based GaN capacity and address higher efficiency, power density and compactness needs in power systems.

GlobalFoundries (NASDAQ: GFS) and Silicon Labs (NASDAQ: SLAB) expanded a strategic partnership on October 30, 2025 to develop energy-efficient wireless technologies and scale U.S. semiconductor manufacturing.

Silicon Labs will have its wireless SoCs produced on GF’s new 40nm Ultra Low Power (40ULP-ESF3) platform at GF’s Malta, New York fab. The platform combines ultra-low standby leakage, embedded SuperFlash, high endurance and integrated analog features for always-on, secure, battery-powered IoT edge applications. Development is underway and production is expected to ramp over the next several years.

GlobalFoundries (NASDAQ: GFS) announced a planned €1.1 billion investment to expand its Dresden manufacturing site under project SPRINT. The plan targets a production capacity of more than 1 million wafers per year by end of 2028 and aims to make Dresden the largest site of its kind in Europe. The program is expected to receive support from the German federal government and the State of Saxony and requires EU approval later this year. The expansion will add end-to-end European processes for semiconductor security and focus on low-power, embedded secure memory, wireless connectivity, automotive, IoT, defense and physical AI applications. GF has invested >€10 billion in Dresden since 2009.

GlobalFoundries (NASDAQ: GFS) announced that, effective immediately on Oct 27, 2025, John Hollister is leaving as Chief Financial Officer for personal reasons and Sam Franklin will serve as Interim CFO while a search for a permanent CFO is conducted.

Management said the company expects third-quarter 2025 results to be within or above previously announced guidance ranges. GF will host its Q3 2025 earnings conference call on Nov 12, 2025 at 8:30 a.m. ET.

GlobalFoundries (NASDAQ: GFS) will host a conference call and webcast to review its third quarter 2025 financial results on Wednesday, November 12, 2025 at 8:30 a.m. ET. The call follows the company’s results release and will be open to the financial community and investors by registration.

Participants can register to join the conference call and access a live webcast on GlobalFoundries’ Investor Relations site at https://investors.gf.com. The company said results and the webcast recording will be posted on its investor site. For investor inquiries, contact ir@gf.com.

GlobalFoundries describes itself as a global semiconductor manufacturer serving automotive, smart mobile, IoT, and communications markets with manufacturing sites across the U.S., Europe, and Asia.

GlobalFoundries (NASDAQ: GFS) announced a strategic collaboration with Corning to develop detachable fiber connector solutions for GF's silicon photonics platform. The partnership focuses on integrating Corning's GlassBridge™ solution, a glass-waveguide based edge-coupler, with GF's platform to address growing AI datacenter demands for high-bandwidth, power-efficient optical connectivity.

The collaboration combines Corning's expertise in glass, optical fiber, and connectivity technologies with GF's high-volume manufacturing capabilities in silicon photonics. The partnership aims to enable scalable, high-density optical packaging solutions for AI datacenters. Demonstrations of the technology will be showcased at the ECOC Exhibition in Copenhagen and GF Technology Summit in Munich.

GlobalFoundries (Nasdaq: GFS) has announced a strategic partnership with Egis Technology to develop direct time-of-flight (dToF) sensors on GF's 55nm platform. The collaboration, revealed at GF's Technology Summit in Shanghai, introduces a first-generation FSI SPAD device featuring superior Dark Count Rate and Near-Infrared Photon Detection capabilities.

The new solution enables the development of highly integrated, low-power sensors for smart mobile, IoT, and automotive applications. Key features include high-voltage bias, VCSEL driver, MCU, and ranging core on a single chip. Applications span from laser-assisted auto focus in mobile devices to presence detection in smart buildings and collision avoidance in robots.

The 55nm SPAD technology is now available for mass production at GF's Singapore facility, with process design kit and GlobalShuttle multi-project wafer program access for prototyping.

GlobalFoundries (Nasdaq: GFS) has achieved a significant milestone as its Singapore 300mm fab has been inducted into the World Economic Forum's Global Lighthouse Network (GLN) of advanced manufacturers. The recognition highlights GF's successful deployment of Fourth Industrial Revolution (4IR) technologies and digital transformation initiatives.

Since 2020, GF has implemented over 60 smart manufacturing solutions utilizing AI, machine learning, IoT, and advanced analytics. The company is focusing on digital innovation across its global operations in the U.S., Europe, and Asia, while developing strategic partnerships with academia, solution providers, and government agencies to build a robust digital talent pipeline.