GlobalFoundries Inc. reports developments in contract semiconductor manufacturing, including financial results, manufacturing technologies, customer platforms and capital allocation. GF serves automotive, smart mobile devices, IoT, communications infrastructure, AI data-center and other semiconductor markets from a global manufacturing footprint spanning the U.S., Europe and Asia.
Company news includes updates on silicon photonics and co-packaged optics, FDX and AutoPro automotive platforms, embedded non-volatile memory such as eMRAM, share repurchases, dividends, secondary share activity, investor-day strategy and intellectual-property actions tied to its process technologies.
GlobalFoundries (Nasdaq: GFS) unveiled its FDX Fusion semiconductor platform roadmap, with manufacturing planned to begin in Dresden, Germany, in 2028. The platform uses fully depleted silicon-on-insulator (FD-SOI) technology for Physical AI, where devices process data and interact with their surroundings. GF expects the first generation to deliver seven-nanometer-class digital performance and more than twice the density of first-generation FDX technology.
Several customers are engaged in early development and evaluation. GF targets demonstrator chips for early customer evaluation in early 2027 and plans an initial process design kit, a set of chip-design resources, for mid-2027. Ongoing Dresden expansion efforts supported under the European Chips Act framework are increasing manufacturing capacity.
GlobalFoundries (Nasdaq: GFS) reached a $2 billion manufacturing agreement with TSMC to establish U.S.-based production of silicon interposers for advanced packaging. The initial term is five years. GlobalFoundries plans to add fabrication capacity at its Malta, New York facility for TSMC's CoWoS packaging ecosystem. Volume production is expected to begin ramping in the first half of 2028, with a framework for future capacity expansion.
GlobalFoundries (GFS) will host a conference call on November 4, 2026, to review its third quarter 2026 financial results.
The call begins at 8:30 a.m. ET, following the results release. The financial results and a webcast will be available on the company’s Investor Relations website.
GlobalFoundries (GFS) and Marvell (MRVL) have expanded a multi-year agreement to increase capacity for GF’s silicon germanium (SiGe) technology at its Burlington, Vermont facility to support growing demand for next-generation optical connectivity in AI and cloud data centers.
The collaboration targets high-performance SiGe used in pluggable optical transceivers, Near-Packaged Optics (NPO) and Co-packaged Optics (CPO), and is expected to add significant capacity for Marvell’s requirements. GF’s SiGe portfolio currently supports 200G-per-lane optical links and has a roadmap for higher-speed generations as bandwidth needs grow. The deal builds on more than a decade of joint work between the companies.
GlobalFoundries (GFS) and Monolithic Power Systems (MPWR) have entered a long-term manufacturing agreement to deploy MPS’s proprietary power management process technology at GF’s advanced 300mm fab in Singapore, with volume production targeted for early 2027.
The collaboration is intended to expand manufacturing capacity for critical high-performance, ultra-efficient power management solutions serving data center, automotive, consumer and industrial markets. Products expected from the Singapore facility include next-generation power solutions for evolving automotive architectures, industrial robotics and automation, and smart power stages for AI and cloud infrastructure. The companies said combining MPS technology with GF manufacturing is expected to support their next phase of growth and provide customers with greater capacity, supply assurance and global scale.
GlobalFoundries (GFS) finalized a definitive agreement with the U.S. Department of Commerce’s CHIPS Research and Development Office for up to $375 million in R&D funding to accelerate its Quantum Technology Solutions (QTS) business and support a secure, U.S.-based quantum chip ecosystem.
The funding, to be received over five years subject to specified milestones, is intended to help scale domestic quantum semiconductor manufacturing and move customers from research and prototyping to commercial production. QTS leverages GF’s capabilities in cryogenic CMOS, advanced packaging and heterogeneous integration. The company also recently entered into a $300 million letter of intent with the same office to accelerate R&D in silicon photonics, another area it expects to be foundational for future AI infrastructure and advanced computing.
GlobalFoundries (GFS) announced customer PDK availability for its new UX platform family, two feature-rich CMOS technologies, at the GF Technology Summit in North America. The UX family includes 40nm (40UX) and 22nm (22UX) nodes designed for intelligent edge devices, advanced sensing systems and Physical AI applications.
40UX targets secure, ultra-low power microcontrollers, SoCs and always-on edge devices for wearables, IoT and wireless connectivity, with volume production at the Singapore site planned by 2027 and future production in Malta, New York. 22UX is an analog-optimized 22nm platform aimed at edge AI, imaging, mixed-signal and stacked CMOS image sensor readout ICs, to be manufactured in Dresden, Germany with a roadmap to multi-site production. Both platforms are accessible for customer engagement and prototyping via GF’s GlobalShuttle multi-project wafer program, with quarterly shuttles scheduled through 2027.
GlobalFoundries (GFS) and RAAAM Memory Technologies announced a strategic collaboration to develop Gain-Cell RAM (GCRAM) on GF’s FDX FD-SOI platform, achieving a projected 40% memory area shrink compared to commodity SRAM.
The partnership has reached a key milestone with the successful tape-out of a GCRAM test vehicle and a jointly designed test chip, targeting advanced edge AI, automotive and IoT applications. The companies report up to 60% memory power reduction versus SRAM and plan to offer GCRAM design access to lead customers in early 2027. NXP Semiconductors is already evaluating the solution, citing its potential to increase on-chip memory capacity and reduce off-chip data movement for greater system-level efficiency.
GlobalFoundries (NASDAQ: GFS) has selected Redpanda as a key partner to build a unified real-time data platform across its global semiconductor manufacturing operations. The Redpanda Data Platform replaces legacy change-data-capture systems, streaming equipment, process, scientific, engineering, supply chain and manufacturing data into a single environment.
Tier-0, mission-critical systems are already live in production as the platform rolls out globally. Leveraging Redpanda's Agentic Data Plane, GlobalFoundries is also developing AI agents to automate workflows and embed real-time insights into IT, procurement and other business functions, with plans to expand adoption over time.
SEALSQ (NASDAQ: LAES) detailed how its SEALQuantum.com Sovereign Quantum Vertical Stack is integrating a broad ecosystem of partners as it prepares the second phase of a $200 million internal quantum investment initiative. More than $65 million has already been deployed, and an additional $100 million is earmarked for allocation through the end of 2027, with phase two beginning in September 2026.
The Stack links secure semiconductors, post-quantum cryptography, digital identity, embedded AI, and satellite infrastructure in a single “Root-to-Qubit-to-Space” trust framework. Partners and portfolio companies including GlobalFoundries (GFS), Quobly, EeroQ, ColibriTD, IC'ALPS, WISeSat.Space, Wecan Group, Miraex and Quantix Edge Security contribute complementary layers, from CMOS-compatible quantum processors to quantum-as-a-service, ASIC design, orbital cloud infrastructure and quantum‑resilient identity and cybersecurity services.