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GlobalFoundries (GFS) is a leading semiconductor foundry providing advanced manufacturing solutions for automotive, IoT, and aerospace industries. This page aggregates official news and press releases to help stakeholders track strategic developments.
Access real-time updates on earnings reports, process technology breakthroughs, and supply chain initiatives. Our curated collection includes announcements about factory expansions, R&D partnerships, and market-specific innovations across GF's global facilities.
Key coverage areas include quarterly financial results, new customer collaborations, and advancements in silicon photonics or advanced packaging. Bookmark this page for streamlined access to operational milestones and regulatory filings.
Check back regularly for verified updates directly from GlobalFoundries and trusted financial analysts. This resource eliminates fragmented searching by centralizing critical information for investment research and industry analysis.
GlobalFoundries (NASDAQ: GFS) announced a planned €1.1 billion investment to expand its Dresden manufacturing site under project SPRINT. The plan targets a production capacity of more than 1 million wafers per year by end of 2028 and aims to make Dresden the largest site of its kind in Europe. The program is expected to receive support from the German federal government and the State of Saxony and requires EU approval later this year. The expansion will add end-to-end European processes for semiconductor security and focus on low-power, embedded secure memory, wireless connectivity, automotive, IoT, defense and physical AI applications. GF has invested >€10 billion in Dresden since 2009.
GlobalFoundries (NASDAQ: GFS) announced that, effective immediately on Oct 27, 2025, John Hollister is leaving as Chief Financial Officer for personal reasons and Sam Franklin will serve as Interim CFO while a search for a permanent CFO is conducted.
Management said the company expects third-quarter 2025 results to be within or above previously announced guidance ranges. GF will host its Q3 2025 earnings conference call on Nov 12, 2025 at 8:30 a.m. ET.
GlobalFoundries (NASDAQ: GFS) will host a conference call and webcast to review its third quarter 2025 financial results on Wednesday, November 12, 2025 at 8:30 a.m. ET. The call follows the company’s results release and will be open to the financial community and investors by registration.
Participants can register to join the conference call and access a live webcast on GlobalFoundries’ Investor Relations site at https://investors.gf.com. The company said results and the webcast recording will be posted on its investor site. For investor inquiries, contact ir@gf.com.
GlobalFoundries describes itself as a global semiconductor manufacturer serving automotive, smart mobile, IoT, and communications markets with manufacturing sites across the U.S., Europe, and Asia.
GlobalFoundries (NASDAQ: GFS) announced a strategic collaboration with Corning to develop detachable fiber connector solutions for GF's silicon photonics platform. The partnership focuses on integrating Corning's GlassBridge™ solution, a glass-waveguide based edge-coupler, with GF's platform to address growing AI datacenter demands for high-bandwidth, power-efficient optical connectivity.
The collaboration combines Corning's expertise in glass, optical fiber, and connectivity technologies with GF's high-volume manufacturing capabilities in silicon photonics. The partnership aims to enable scalable, high-density optical packaging solutions for AI datacenters. Demonstrations of the technology will be showcased at the ECOC Exhibition in Copenhagen and GF Technology Summit in Munich.
GlobalFoundries (Nasdaq: GFS) has announced a strategic partnership with Egis Technology to develop direct time-of-flight (dToF) sensors on GF's 55nm platform. The collaboration, revealed at GF's Technology Summit in Shanghai, introduces a first-generation FSI SPAD device featuring superior Dark Count Rate and Near-Infrared Photon Detection capabilities.
The new solution enables the development of highly integrated, low-power sensors for smart mobile, IoT, and automotive applications. Key features include high-voltage bias, VCSEL driver, MCU, and ranging core on a single chip. Applications span from laser-assisted auto focus in mobile devices to presence detection in smart buildings and collision avoidance in robots.
The 55nm SPAD technology is now available for mass production at GF's Singapore facility, with process design kit and GlobalShuttle multi-project wafer program access for prototyping.
GlobalFoundries (Nasdaq: GFS) has achieved a significant milestone as its Singapore 300mm fab has been inducted into the World Economic Forum's Global Lighthouse Network (GLN) of advanced manufacturers. The recognition highlights GF's successful deployment of Fourth Industrial Revolution (4IR) technologies and digital transformation initiatives.
Since 2020, GF has implemented over 60 smart manufacturing solutions utilizing AI, machine learning, IoT, and advanced analytics. The company is focusing on digital innovation across its global operations in the U.S., Europe, and Asia, while developing strategic partnerships with academia, solution providers, and government agencies to build a robust digital talent pipeline.
GlobalFoundries (NASDAQ: GFS) and Synopsys (NASDAQ: SNPS) have announced a groundbreaking educational collaboration launching a 'chip design to tapeout' program for universities worldwide. The initiative, piloting at 40 universities this fall, combines Synopsys' electronic design automation (EDA) tools with GlobalFoundries' manufacturing capabilities through their GlobalShuttle Multi-Project Wafer Program.
The program aims to provide students and researchers with hands-on experience in chip design and manufacturing, significantly reducing cost barriers for academic institutions. Synopsys will provide professional-grade EDA tools, training, and design collateral through their Cloud design platform, while GlobalFoundries will handle chip manufacturing.
This initiative is part of GF's University Partnership Program, which currently engages with over 80 universities, 110 professors, and 600 students in various technological fields including radio frequency, radar, quantum computing, and silicon photonics.
MIPS, a GlobalFoundries (NYSE: GFS) company, has appointed Michael Zirngibl as Vice President of Business Development for EMEA. This strategic hire aims to accelerate the company's expansion across Europe, Middle East, and Africa, with a focus on automotive, industrial, and communications infrastructure markets.
Zirngibl brings over 23 years of semiconductor industry experience and will support MIPS' mission in advancing physical AI platforms. The appointment aligns with MIPS' strategy to deliver processor IP at foundry scale, particularly through their Atlas Portfolio of RISC-V IP.
Both Zirngibl and CEO Sameer Wasson will attend the RISC-V Automotive Day in Munich on September 9, 2025, where Wasson will discuss AI adoption challenges in automotive platforms.
GlobalFoundries (Nasdaq: GFS) has announced the production release of its 130nm complementary Bi-CMOS (CBIC) platform, marking a significant advancement in silicon germanium (SiGe) technology. The platform delivers exceptional performance with NPN transistors exceeding 400 GHz ft/fmax and PNP transistors surpassing 200 GHz.
Developed at GF's Burlington, Vermont facility, 130CBIC is designed for multiple key markets including smartphones, wireless infrastructure, optical networking, satellite communications, and industrial IoT. The technology enables low-noise amplifiers for reduced battery consumption in smartphones and supports high-speed analog and optical networking in datacenters. The platform also facilitates advanced mmWave industrial radar applications exceeding 100GHz.
GlobalFoundries (Nasdaq: GFS) has announced the availability of its 22FDX+ with Resistive RAM (RRAM) technology, enhancing its embedded non-volatile memory solutions portfolio. This technology combines with the 22FDX® platform to provide secure, low-latency, high-density embedded memory for wireless microcontrollers and AI IoT applications.
The new RRAM technology features low power read/write capabilities, high endurance, and excellent retention. When integrated with GF's enhanced 22FDX platform, it delivers improved data retention, reliability, security, and power efficiency. The technology is particularly suitable for AI-enabled IoT devices like sensors, wearables, and industrial systems.
A macro preliminary design kit is now available through GF Connect portal, with volume production scheduled for 2026.
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