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GlobalFoundries Inc. (GFS) is a prominent player in the semiconductor industry, recognized as the world's first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has rapidly scaled to become one of the largest foundries globally, serving over 250 customers. With operations in Singapore, Germany, and the United States, GlobalFoundries offers unmatched flexibility and security through its manufacturing centers across three continents. The company's 300mm and 200mm fabrication facilities provide a comprehensive range of process technologies, from mainstream to the leading edge.
Headquartered in Malta, New York, GlobalFoundries was originally the manufacturing wing of Advanced Micro Devices (AMD) before becoming an independent entity in 2009. The company merged with Chartered Semiconductor Manufacturing in the same year and acquired IBM's chipmaking business in 2015. Currently, GlobalFoundries employs approximately 12,000 people and continues to be a cornerstone in the semiconductor supply chain, particularly for mature process technologies.
GlobalFoundries focuses on several key markets including smartphones, PCs, Internet of Things (IoT), data centers, automotive, industrial, and more. The company was privately held by Mubadala Investment, the sovereign wealth fund of the United Arab Emirates, until its public offering in 2021. This unique mix of design, development, and fabrication services ensures that GlobalFoundries remains a trusted technology source for its worldwide clientele.
Among its recent achievements, GlobalFoundries received $1.5 billion in planned direct funding from the U.S. Department of Commerce as part of the U.S. CHIPS and Science Act. This investment aims to enhance the company's manufacturing capacity to produce essential chips for automotive, IoT, aerospace, defense, and other critical markets. Additionally, GlobalFoundries has announced its plans to invest over $12 billion in its U.S. sites over the next decade, backed by public-private partnerships and support from federal and state governments.
The company has also committed to workforce development, collaborating with various educational institutions and community colleges to create a diverse talent pipeline. This includes a new student loan repayment program and partnerships with universities to cultivate future semiconductor professionals.
In terms of sustainability, GlobalFoundries is committed to sustainable operations and has integrated its expansion plans with its sustainability goals. This commitment is evident in its design and construction initiatives, ensuring that all expansions and modernizations align with environmentally sustainable practices.
For more information about GlobalFoundries, visit their official website at www.globalfoundries.com.
GlobalFoundries (GFS) and the Massachusetts Institute of Technology (MIT) have announced a new master research agreement to advance semiconductor technologies, with a focus on AI applications. The collaboration will be led by MIT's Microsystems Technology Laboratories (MTL) and GF Labs.
The initial research will concentrate on GF's silicon photonics technology, which integrates RF SOI, CMOS, and optical features on a single chip for datacenter power efficiency, and the 22FDX® platform for ultra-low power consumption in edge devices.
The agreement builds upon existing partnerships, including GF's participation in MTL's Microsystems Industrial Group and MIT's involvement in GF's University Partnership Program. The collaboration also extends to workforce development initiatives through the Northeast Microelectronics Coalition.
GlobalFoundries (GFS) reported Q4 2024 financial results with revenue of $1.830 billion and a net loss of $729 million, largely due to a $935 million impairment charge on legacy assets in Malta, NY. The company posted Non-IFRS net income of $256 million and diluted EPS loss of $1.32 ($0.46 Non-IFRS).
For full-year 2024, GFS recorded revenue of $6.750 billion, representing a 9% decline from 2023, with a net loss of $262 million compared to net income of $1.018 billion in 2023. The company generated over $1 billion in Non-IFRS adjusted free cash flow and maintained strong liquidity with $4.2 billion in cash and marketable securities.
Looking ahead to Q1 2025, GFS guides revenue between $1.550-$1.600 billion with expected gross margin of 22.1% (IFRS) and diluted EPS between $0.14-$0.26.
GlobalFoundries (GFS) has announced key leadership changes effective April 28, 2025. Dr. Thomas Caulfield will transition to Executive Chairman, succeeding Ahmed Yahia who is stepping down after over a decade. Tim Breen, currently COO, has been appointed as CEO, while Niels Anderskouv will become President and COO.
Under Caulfield's leadership since 2018, GF repositioned its technology portfolio, achieved sustainable profitability, and completed one of the largest semiconductor IPOs in history in 2021. Breen, who joined GF in 2018, has overseen global operations and held various senior executive roles. Anderskouv, who joined as Chief Business Officer in 2023, brings over 25 years of semiconductor industry experience.
The transition aims to accelerate GF's next growth phase, leveraging its differentiated technology portfolio and global manufacturing footprint.
GlobalFoundries (GFS) announced plans to establish a New York Advanced Packaging and Photonics Center for advanced packaging and testing of U.S.-made chips. The center, supported by investments from New York State and the U.S. Department of Commerce, will be located within GF's New York manufacturing facility.
The facility will focus on silicon photonics and 3D/heterogeneously integrated chips for AI, automotive, aerospace, defense, and communications applications. GF's total investment is expected to be $575 million, plus $186 million in R&D over 10+ years. The project will receive up to $20 million from New York state and $75 million from the U.S. Department of Commerce.
The center aims to create approximately 100 new full-time jobs in New York over the next five years and will provide end-to-end U.S.-based solutions for chips made at GF's New York facility, addressing the current concentration of advanced packaging in Asia.
GlobalFoundries (NASDAQ: GFS) has announced it will host a conference call on Tuesday, February 11, 2025, at 8:30 a.m. ET to discuss its fourth quarter and full-year 2024 financial results. The company, a leading manufacturer of essential semiconductors, will make the financial results and conference call webcast available on its Investor Relations website.
Interested parties can join the conference call by registering through the provided link. GF specializes in producing power-efficient, high-performance semiconductors for various growth markets including automotive, smart mobile devices, IoT, and communications infrastructure, with manufacturing facilities across the U.S., Europe, and Asia.
GlobalFoundries (GFS) and IBM have announced a settlement resolving all ongoing litigation matters between the companies, including breach of contract, trade secrets, and intellectual property claims. The confidential settlement, announced on January 2, 2025, marks the end of their legal disputes and opens possibilities for future collaboration in areas of mutual interest.
Both companies' CEOs expressed satisfaction with the outcome, with GF's CEO Dr. Thomas Caulfield highlighting the opportunity to build upon their long-standing partnership to strengthen the semiconductor industry. IBM's CEO Arvind Krishna noted that resolving these disputes will allow both organizations to focus on future innovations beneficial to their companies and customers.
GlobalFoundries (GFS) has secured an additional $9.5 million in federal funding from the U.S. government to advance its gallium nitride (GaN) semiconductor manufacturing in Essex Junction, Vermont. This funding supports GF's progress toward large-scale production of GaN chips, which are important for high-performance and energy-efficient RF and high-power control applications in automobiles, datacenters, IoT, aerospace, and defense sectors.
The funding, awarded by the U.S. Department of Defense's Trusted Access Program Office (TAPO), will be used for new tools, equipment, and prototyping capabilities. Since 2020, GF has received over $80 million in total U.S. government funding for GaN development. The company recently expanded its GaN capabilities by acquiring Tagore Technology's GaN Power portfolio and establishing the GF Kolkata Power Center in India.
GlobalFoundries (GFS) has secured up to $1.5 billion in funding from the CHIPS and Science Act, along with $550 million from New York State. The funding will support three major projects: expanding the Malta, NY fab, modernizing the Essex Junction, VT facility for GaN semiconductor production, and constructing a new state-of-art fab in Malta. These projects represent over $13 billion of investment across 10+ years, expected to triple Malta's capacity and create nearly 1,000 direct manufacturing jobs and 9,000 construction jobs. The expansion aims to strengthen U.S. semiconductor manufacturing for automotive, IoT, datacenter, and aerospace applications.
GlobalFoundries (GFS) reported Q3 2024 financial results with revenue of $1.739 billion, showing a 6% year-over-year decline but a 7% sequential increase. The company achieved a gross margin of 23.8% and net income of $178 million. Key metrics include operating margin of 10.6% and cash position of $4.3 billion. GF announced new collaborations with NXP Semiconductors utilizing their 22FDX® technology platform and a strategic agreement with Finwave Semiconductor for GaN technology development. The company maintains strong cash flow generation, projecting a threefold increase in year-over-year Non-IFRS adjusted free cash flow by end of 2024.
GlobalFoundries (GFS) and NXP Semiconductors announced a collaboration to develop next-generation solutions using GF's 22FDX platform. The partnership focuses on automotive, IoT, and smart mobile devices, with manufacturing in Dresden and Malta, New York. The 22FDX technology offers up to 50% higher performance and 70% less power consumption compared to other planar CMOS technologies. The platform integrates digital, analog, RF, power management, and non-volatile memory onto a single die, optimizing performance through dynamic voltage adjustment. Qualified for Automotive Grade 1 and 2 applications, it ensures reliability in extreme conditions up to 150°C junction temperature.
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