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Fabric.AI (Nasdaq:FABC) has engaged executive search firm Egon Zehnder to identify a senior project management executive. The role is expected to coordinate engineering, product, partnership, and commercialization workstreams supporting the Neural I/o™ optical interconnect program and broader AI infrastructure roadmap, including collaboration with Kopin and NDAs with two major semiconductor companies.
Fabric.AI (Nasdaq:FABC) plans to demonstrate its Neural I/o™ MicroLED-based optical interconnect platform by late 2026. Neural I/o, developed with Kopin, targets AI data-center bottlenecks in data movement between GPUs, accelerators, memory, and servers.
The company has signed two NDAs with leading chipmakers and reports about $30 million in cash, which it believes will fund operations through the planned Neural I/o demonstration milestone.
Fabric.AI (Nasdaq: FABC) appointed Bill Maffucci as Head of Development for the jointly developed Neural I/o™ MicroLED optical interconnect chip program with Kopin. The program targets ultra-high-bandwidth, low-power interconnects for AI factories and the companies have signed NDAs with two major chipmakers.
The move follows Kopin's engineering reorganization and positions Neural I/o to address interconnect limits of copper and laser-based optics.
Fabric.AI (Nasdaq: FABC) will begin trading under the new ticker FABC on April 29, 2026, reflecting its completed transformation from StableX Technologies and strategic pivot from digital assets to AI-focused semiconductor technologies.
The company announced a strategic partnership with Kopin to develop MicroLED-based optical interconnects for AI data centers, described as its first major product initiative and tied to a market opportunity the company estimates at well over $100 billion. No action is required from stockholders; the CUSIP remains unchanged.