Shaping Our Future with AI: DuPont Reveals Next-Generation Solutions at 2024 TPCA Show
DuPont (NYSE:DD) will showcase advanced circuit materials at the 2024 TPCA Show in Taipei from October 23-25. Located at Booth #K409, DuPont will present solutions for fine line applications, advanced packaging, signal integrity, and thermal management. A session titled "Shaping Our Future with AI by Next-Gen Substrate and Packaging" will be held at the IMPACT Conference, featuring speakers from industry leaders like Taiwan Semiconductor Manufacturing Company and Samsung Electronics. Key innovations include bump plating technology for HBM and 2.5D/3D packaging and a novel seed layer method for glass substrates using a polymer-based adhesion promoter. These advancements aim to enhance AI functionalities by improving data computation and transfer speed and reliability. DuPont's participation emphasizes themes of fine line technology, advanced packaging, and signal integrity & thermal management, important for AI applications.
DuPont (NYSE:DD) presenterà materiali circuitali avanzati alla 2024 TPCA Show di Taipei dal 23 al 25 ottobre. Situata allo Stand #K409, DuPont mostrerà soluzioni per applicazioni a linee sottili, imballaggio avanzato, integrità del segnale e gestione termica. Una sessione intitolata "Plasmare il nostro futuro con l'IA attraverso substrati e imballaggi di nuova generazione" si terrà alla Conferenza IMPACT, con relatori di leader del settore come Taiwan Semiconductor Manufacturing Company e Samsung Electronics. Le innovazioni chiave includono la tecnologia di placcatura dei bump per HBM e imballaggi 2.5D/3D e un nuovo metodo per strato seed per substrati di vetro utilizzando un promotore di adesione a base polimerica. Questi progressi mirano a migliorare le funzionalità dell'IA, aumentando la velocità e l'affidabilità del calcolo e del trasferimento dati. La partecipazione di DuPont enfatizza temi di tecnologia a linee sottili, imballaggio avanzato e integrità del segnale e gestione termica, importanti per le applicazioni di IA.
DuPont (NYSE:DD) presentará materiales de circuito avanzados en la 2024 TPCA Show en Taipei del 23 al 25 de octubre. Ubicado en el Stand #K409, DuPont presentará soluciones para aplicaciones de líneas finas, empaques avanzados, integridad de señal y gestión térmica. Una sesión titulada "Modelando Nuestro Futuro con IA a través de Substratos y Empaques de Nueva Generación" se llevará a cabo en la Conferencia IMPACT, con ponentes de líderes de la industria como Taiwan Semiconductor Manufacturing Company y Samsung Electronics. Las innovaciones clave incluyen la tecnología de niquelado de bump para HBM y empaques 2.5D/3D y un novedoso método de capa semilla para sustratos de vidrio utilizando un promotor de adhesión a base de polímeros. Estos avances tienen como objetivo mejorar las funcionalidades de IA al aumentar la velocidad y fiabilidad en el cálculo y la transferencia de datos. La participación de DuPont enfatiza temas de tecnología de línea fina, empaque avanzado e integridad de señal y gestión térmica, importantes para aplicaciones de IA.
듀폰 (NYSE:DD)는 10월 23일부터 25일까지 타이페이에서 열리는 2024 TPCA 쇼에서 첨단 회로 재료를 선보일 예정입니다. 부스 번호 #K409에 위치한 듀폰은 미세 회로 응용, 첨단 패키징, 신호 무결성 및 열 관리를 위한 솔루션을 제시할 것입니다. 차세대 기판 및 패케징에 의한 AI로 우리의 미래를 형성하기라는 제목의 세션이 IMPACT 컨퍼런스에서 열릴 예정이며, 대만 반도체 제조 회사 및 삼성전자와 같은 업계 선두주자의 연사가 참석합니다. 주요 혁신 사항으로는 HBM 및 2.5D/3D 패키징을 위한 범프 도금 기술과 폴리머 기반 접착 촉진제를 사용한 유리 기판용 새로운 씨드 레이어 방법이 있습니다. 이러한 발전은 데이터 계산 및 전송 속도와 신뢰성을 개선하여 AI 기능을 향상시키는 것을 목표로 하고 있습니다. 듀폰의 참여는 AI 응용 프로그램에 중요한 미세 회로 기술, 첨단 패키징 및 신호 무결성 및 열 관리의 주제를 강조합니다.
DuPont (NYSE:DD) présentera des matériaux de circuit avancés lors du 2024 TPCA Show à Taipei du 23 au 25 octobre. Situé au Stand #K409, DuPont démontrera des solutions pour des applications à lignes fines, des emballages avancés, l'intégrité des signaux et la gestion thermique. Une session intitulée "Façonner notre avenir avec l'IA grâce à des substrats et des emballages de nouvelle génération" se tiendra lors de la conférence IMPACT, avec des intervenants de leaders industriels tels que Taiwan Semiconductor Manufacturing Company et Samsung Electronics. Les innovations clés incluent la technologie de plaquage de bump pour HBM et des emballages 2.5D/3D, ainsi qu'une nouvelle méthode de couche semence pour des substrats en verre utilisant un promoteur d'adhésion basé sur des polymères. Ces avancées visent à améliorer les fonctionnalités de l'IA en optimisant la vitesse et la fiabilité du calcul et du transfert de données. La participation de DuPont souligne des thèmes tels que la technologie à lignes fines, l'emballage avancé, ainsi que l'intégrité des signaux et la gestion thermique, essentiels pour les applications d'IA.
DuPont (NYSE:DD) wird auf der 2024 TPCA Show in Taipeh vom 23. bis 25. Oktober fortschrittliche Schaltungsmaterialien präsentieren. Am Stand #K409 wird DuPont Lösungen für feine Linienanwendungen, fortschrittliche Verpackungen, Signalintegrität und thermisches Management vorstellen. Eine Sitzung mit dem Titel "Unsere Zukunft mit KI durch nächste Generation von Substraten und Verpackungen gestalten" findet auf der IMPACT-Konferenz statt, mit Rednern von Branchenführern wie der Taiwan Semiconductor Manufacturing Company und Samsung Electronics. Zu den wichtigsten Innovationen gehören die Stanztechnologie für Bumps für HBM sowie 2,5D/3D-Verpackungen und ein neuartiges Seed-Layer-Verfahren für Glassubstrate mit einem polymerbasierten Haftvermittler. Diese Fortschritte zielen darauf ab, die KI-Funktionen durch Verbesserung der Datenberechnung und -übertragungsgeschwindigkeit und -zuverlässigkeit zu optimieren. Die Teilnahme von DuPont betont Themen wie feine Linientechnologie, fortschrittliche Verpackung sowie Signalintegrität und thermisches Management, die für KI-Anwendungen wichtig sind.
- DuPont will showcase its advanced circuit materials at the 2024 TPCA Show, potentially increasing visibility and market interest.
- Introduction of next-generation bump plating technology for HBM and 2.5D/3D packaging to meet the demand for smaller micro-bumps and increased I/O density.
- Novel seed layer method for glass substrates, enhancing via coverage and copper adhesion, potentially improving high-performance electronics.
- None.
Insights
DuPont's presentation at the TPCA Show highlights significant advancements in circuit materials and packaging solutions important for AI and high-performance computing. The company's focus on fine line applications, advanced packaging, signal integrity and thermal management addresses key challenges in the semiconductor industry.
The new Solderon™ BP TS7100SA solder for bump plating is particularly noteworthy. It enables smaller micro-bumps for HBM and 2.5D/3D packaging, which is essential for increasing I/O density in AI chips. This technology could potentially improve the performance and efficiency of AI hardware.
DuPont's novel seed layer method for glass substrates is another breakthrough. By enhancing via coverage and copper adhesion, it opens up new possibilities for using glass in advanced packaging. This could lead to more compact and efficient designs in high-performance electronics.
While these innovations are promising for DuPont's position in the AI and semiconductor markets, their actual impact on the company's financials remains to be seen. Investors should monitor how these technologies translate into market share and revenue growth in the coming quarters.
DuPont is proud to collaborate with industry leaders for the session titled "Shaping Our Future with AI by Next-Gen Substrate and Packaging" at the IMPACT Conference. This session will focus on advanced packaging and integrated circuit material solutions for artificial intelligence. Discussions will encompass topics such as characteristics of organic substrates, the evolution of advanced packaging materials, and the challenges and opportunities facing integrated circuit substrates in the age of artificial intelligence. Insights will be shared by speakers from Taiwan Semiconductor Manufacturing Company, Samsung Electronics, Leading Interconnect Semiconductor Technology, and DuPont Interconnect Solutions business.
"Our new technology solutions highlight DuPont's commitment to innovation and collaboration with industry leaders in technologies that enable AI. As a powerhouse in advanced interconnect and thermal management solutions, we are dedicated to enhancing data computation and enabling data transfer speed and reliability, both of which are critical for AI functionalities. DuPont's session at the IMPACT Conference will showcase our innovations in advanced packaging, such as bump plating technology for HBM and 2.5D/3D packaging and seed layer formation on glass substrates, further pushing the boundaries of AI technology," said Yuan Yuan Zhou, Global Business Director, Advanced Circuit & Packaging, DuPont.
The next-generation bump plating technologies, particularly DuPont™ Solderon™ BP TS7100SA solder, are designed to meet the growing demand for smaller micro-bumps for HBM and 2.5D/3D packaging and increased I/O density while ensuring coplanarity, consistency, and reliability in fine-pitch and mixed-pitch packages. Its exceptional control over silver composition and void-free integration facilitates efficient lead-free soldering in high-performance electronic devices.
Additionally, DuPont will unveil a novel seed layer method for glass substrates in advanced packaging that overcomes the limitations in via coverage and adhesion present in conventional techniques. By utilizing a polymer-based adhesion promoter, this innovative electroless copper process achieves complete via coverage and strong copper adhesion under low-temperature, production-friendly conditions. This advancement significantly enhances the viability of glass substrates for high-performance electronics in advanced packaging applications.
DuPont's participation in the TPCA Show highlights three pivotal themes: fine line technology, advanced packaging, and signal integrity & thermal management. Fine line patterns accelerate the integration of intricate circuits into compact spaces, enhancing overall efficiency and performance. Advanced packaging technologies optimize space utilization and support high-density interconnections, which are crucial for AI applications that require rapid data processing. Furthermore, maintaining signal integrity and implementing effective thermal management are essential for ensuring reliable functionality in high-performance computing environments.
At the show, DuPont experts will be present at the company's booth to share their extensive knowledge and insights on technological advancements and industry trends. Attendees will have the opportunity to explore DuPont's comprehensive solutions for AI applications.
About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.
DuPont™, the DuPont Oval Logo, and all trademarks and service marks denoted with ™, SM or ® are owned by affiliates of DuPont de Nemours, Inc. unless otherwise noted.
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SOURCE DuPont
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