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CyberOptics to Launch Next-Generation WaferSense® & ReticleSense® Auto Teaching Systems™ during SEMICON West
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CyberOptics Corporation (NASDAQ: CYBE) will showcase its next-generation WaferSense® Auto Teaching System™ (ATS2) and ReticleSense® Auto Teaching System™ (ATSR) at SEMICON West 2022, happening from July 12–14, 2022 in San Francisco.
The new multi-camera sensors enhance wafer and reticle calibration, improving efficiency and tool uptime in semiconductor fabs. CEO Subodh Kulkarni emphasized the sensors' accuracy, precision, and versatility as critical for better yields. The company will also demonstrate various WaferSense® sensors for multiple metrics.
Positive
Launch of next-generation WaferSense® ATS2 and ReticleSense® ATSR systems.
Sensors recognized for their efficiency in wafer hand-off teaching.
Improvements in accuracy and precision, enhancing semiconductor fab operations.
Negative
None.
MINNEAPOLIS--(BUSINESS WIRE)--
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON West 2022 HYBRID, scheduled to take place July 12–14, 2022 at the Moscone Center in San Francisco and online 24/7. The company will launch its next-generation WaferSense® Auto Teaching System™ (ATS2) and new ReticleSense® Auto Teaching System™ (ATSR) in Booth #1241.
CyberSpectrum software illustrating the teach application with ATSR. (Photo: Business Wire)
ATS2 and ATSR are multi camera sensors used with CyberSpectrum™ software to teach accurate wafer and reticle hand-off calibration for proper alignment and set-up of semiconductor tools. The sensors "see" inside to capture three dimensional off-set data (x, y and z) in real-time to quickly teach wafer and reticle transfer positions - all without opening the tools. Process and equipment engineers can conduct repeatable and reproducible setups and maintenance checks, speed trouble-shooting and eliminate technician-to-technician variation.
“Semiconductor fabs worldwide are using our teaching sensors that are recognized as the most efficient and effective wireless devices for wafer hand-off teaching,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “We have advanced the technology to enable even better performance, with the combination of accuracy, precision and versatility that fabs rely on to significantly improve their yields and tool uptime.”
CyberOptics also will demonstrate WaferSense® sensors for leveling, vibration, gapping, relative humidity, resistance and airborne particles.
CyberOptics Corporation (www.cyberoptics.com) is a leading global developer and manufacturer of high-precision 3D sensing technology solutions. CyberOptics’ sensors are used for inspection and metrology in the SMT and semiconductor capital equipment markets to significantly improve yields and productivity. By leveraging its leading-edge technologies, the Company has strategically established itself as a global leader in high precision 3D sensors, allowing CyberOptics to further increase its penetration of key vertical markets. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through its facilities in North America, Asia and Europe.
Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: a possible world-wide recession or depression resulting from the economic consequences of the COVID-19 pandemic; the negative effect on our revenue and operating results of the COVID-19 crisis on our customers and suppliers and the global supply chain; market conditions in the global SMT and semiconductor capital equipment industries; trade relations between the United States and China and other countries; the timing of orders and shipments of our products, particularly our 3D MRS SQ3000 Multi-Function systems and MX systems for memory module inspection; increasing price competition and price pressure on our product sales, particularly our inspection and metrology systems; the level of orders from our OEM customers; the availability of parts required to meet customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; rapid changes in technology in the electronics and semiconductor markets; product introductions and pricing by our competitors; the success of our 3D technology initiatives; the market acceptance of our SQ3000 Multi-Function systems and products for semiconductor inspection and metrology; costly and time consuming litigation with third parties related to intellectual property infringement; the negative impact on our customers and suppliers due to past and future terrorist threats and attacks and any acts of war; the impact of the MX3000 orders on our consolidated gross margin percentage in any future period; risks related to cancellation or renegotiation of orders we have received; and other factors set forth in the Company’s filings with the Securities and Exchange Commission.
