Ceva Unveils Ceva-Waves Links200 - A Breakthrough Multi-Protocol Wireless Connectivity Platform IP Featuring Next generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4
Ceva has unveiled the Ceva-Waves Links200, a groundbreaking multi-protocol wireless connectivity platform IP that supports next-generation Bluetooth High Data Throughput (HDT) and IEEE 802.15.4 technologies. The platform features a new Ceva-developed radio designed for TSMC's 12nm process, delivering data rates up to 7.5 Mbps - more than double traditional Bluetooth speeds.
The Links200 combines Bluetooth HDT with IEEE 802.15.4 support for Zigbee, Thread, and Matter protocols, enabling concurrent multi-link communication. The solution targets hearables, wearables, and wireless consumer electronics, supporting lossless, multi-channel, low-latency audio streaming for devices like TWS earbuds, headsets, and car audio systems.
Key features include full Bluetooth dual mode support, comprehensive integration of RF, modem, controller, and software stacks, advanced audio support, and compatibility with Ceva's sensing and inference IPs.
Ceva ha svelato il Ceva-Waves Links200, una piattaforma innovativa di connettività wireless multi-protocollo che supporta le tecnologie di Bluetooth High Data Throughput (HDT) e IEEE 802.15.4 di nuova generazione. Questa piattaforma è dotata di un nuovo radio sviluppato da Ceva, progettato per il processo a 12nm di TSMC, che offre velocità di trasmissione dati fino a 7,5 Mbps, più del doppio rispetto alle tradizionali velocità Bluetooth.
Il Links200 combina Bluetooth HDT con il supporto per IEEE 802.15.4 per i protocolli Zigbee, Thread e Matter, consentendo una comunicazione multi-link simultanea. Questa soluzione è rivolta a dispositivi audio, indossabili e elettronica di consumo wireless, supportando lo streaming audio multi-canale, a bassa latenza e senza perdita per dispositivi come auricolari TWS, cuffie e sistemi audio per auto.
Le caratteristiche principali includono il pieno supporto per il dual mode Bluetooth, un'integrazione completa di RF, modem, controller e stack software, supporto audio avanzato e compatibilità con gli IP di sensing e inferenza di Ceva.
Ceva ha presentado el Ceva-Waves Links200, una plataforma innovadora de conectividad inalámbrica multiprotocolo que admite las tecnologías de Bluetooth High Data Throughput (HDT) y IEEE 802.15.4 de próxima generación. La plataforma cuenta con una nueva radio desarrollada por Ceva, diseñada para el proceso de 12nm de TSMC, que ofrece tasas de datos de hasta 7.5 Mbps, más del doble de las velocidades tradicionales de Bluetooth.
El Links200 combina Bluetooth HDT con soporte para IEEE 802.15.4 en los protocolos Zigbee, Thread y Matter, permitiendo la comunicación simultánea de múltiples enlaces. La solución está dirigida a dispositivos de audio, wearables y electrónica de consumo inalámbrica, y soporta transmisión de audio multicanal, de baja latencia y sin pérdidas para dispositivos como auriculares TWS, cascos y sistemas de audio para automóviles.
Las características clave incluyen soporte completo para el modo dual de Bluetooth, integración completa de RF, módem, controlador y pilas de software, soporte de audio avanzado y compatibilidad con los IPs de detección e inferencia de Ceva.
Ceva가 Ceva-Waves Links200을 발표했습니다. 이는 Bluetooth High Data Throughput (HDT) 및 IEEE 802.15.4 기술을 지원하는 혁신적인 다중 프로토콜 무선 연결 플랫폼 IP입니다. 이 플랫폼은 TSMC의 12nm 프로세스를 위해 설계된 새로운 Ceva 개발 라디오를 특징으로 하며, 데이터 전송 속도가 최대 7.5Mbps에 달해 전통적인 Bluetooth 속도의 두 배 이상을 제공합니다.
Links200은 Bluetooth HDT를 Zigbee, Thread 및 Matter 프로토콜에 대한 IEEE 802.15.4 지원과 결합하여 동시 다중 링크 통신을 가능하게 합니다. 이 솔루션은 TWS 이어폰, 헤드셋 및 자동차 오디오 시스템과 같은 장치를 위한 무손실, 다채널, 저지연 오디오 스트리밍을 지원하여 오디오 및 웨어러블, 무선 소비자 전자 제품을 목표로 하고 있습니다.
주요 기능으로는 완전한 Bluetooth 듀얼 모드 지원, RF, 모뎀, 컨트롤러 및 소프트웨어 스택의 포괄적인 통합, 고급 오디오 지원 및 Ceva의 감지 및 추론 IP와의 호환성이 포함됩니다.
Ceva a dévoilé le Ceva-Waves Links200, une plateforme révolutionnaire de connectivité sans fil multi-protocole qui prend en charge les technologies de Bluetooth High Data Throughput (HDT) et IEEE 802.15.4 de nouvelle génération. La plateforme est dotée d'une nouvelle radio développée par Ceva, conçue pour le processus de 12 nm de TSMC, offrant des débits de données allant jusqu'à 7,5 Mbps, soit plus du double des vitesses Bluetooth traditionnelles.
Le Links200 combine le Bluetooth HDT avec le support de l'IEEE 802.15.4 pour les protocoles Zigbee, Thread et Matter, permettant une communication multi-lien simultanée. La solution cible les dispositifs audio, les wearables et l'électronique grand public sans fil, en prenant en charge le streaming audio multicanal sans perte et à faible latence pour des appareils tels que des écouteurs TWS, des casques et des systèmes audio de voiture.
Les caractéristiques clés incluent un support complet du mode double Bluetooth, une intégration complète des RF, modem, contrôleur et piles logicielles, un support audio avancé et une compatibilité avec les IP de détection et d'inférence de Ceva.
Ceva hat die Ceva-Waves Links200 vorgestellt, eine bahnbrechende Multi-Protokoll-Wireless-Konnektivitätsplattform IP, die die Technologien von Bluetooth High Data Throughput (HDT) und IEEE 802.15.4 der nächsten Generation unterstützt. Die Plattform verfügt über ein neu entwickeltes Radio von Ceva, das für den 12-Nanometer-Prozess von TSMC ausgelegt ist und Datenraten von bis zu 7,5 Mbps liefert – mehr als die doppelte Geschwindigkeit herkömmlicher Bluetooth-Verbindungen.
Der Links200 kombiniert Bluetooth HDT mit der Unterstützung von IEEE 802.15.4 für Zigbee, Thread und Matter-Protokolle, was eine gleichzeitige Multi-Link-Kommunikation ermöglicht. Die Lösung richtet sich an Audio-Geräte, tragbare Technologien und kabellose Verbraucherelektronik und unterstützt verlustfreies, mehrkanaliges, latenzfreies Audio-Streaming für Geräte wie TWS-Ohrhörer, Headsets und Audio-Systeme im Auto.
Zu den wichtigsten Merkmalen gehören die vollständige Unterstützung des Bluetooth-Duallistenmodus, eine umfassende Integration von RF, Modem, Controller und Software-Stacks, erweiterte Audiounterstützung sowie die Kompatibilität mit Cevas Sensor- und Inferenz-IP.
- Doubles Bluetooth speed capabilities to 7.5 Mbps through HDT technology
- Multi-protocol support enables broader market applications
- Advanced 12nm process implementation for improved power efficiency
- Turnkey solution reduces time-to-market and development risks
- None.
Insights
The Links200 platform represents a significant technological leap in wireless connectivity IP. The implementation on TSMC's 12nm process, combined with the new High Data Throughput (HDT) capability delivering 7.5 Mbps, positions CEVA strongly in the premium wireless connectivity IP market. This advancement directly addresses the growing demand for high-bandwidth, low-latency wireless solutions in consumer electronics.
The platform's multi-protocol support and integration capabilities with Wi-Fi and UWB create substantial cross-selling opportunities across CEVA's IP portfolio. From a semiconductor perspective, the 12nm process node selection offers an optimal balance between power efficiency and performance, particularly important for battery-operated devices like TWS earbuds and smartwatches.
The timing of Links200's launch aligns perfectly with the explosive growth in IoT devices requiring sophisticated wireless connectivity. The integration of Bluetooth HDT with IEEE 802.15.4 protocols (Thread/Zigbee/Matter) creates a compelling value proposition for OEMs developing next-generation smart home and consumer electronics products. The platform's support for multi-channel audio streaming at 7.5 Mbps opens new revenue opportunities in premium audio markets.
The 'drop-in' turnkey solution approach significantly reduces development complexities and time-to-market for SoC manufacturers, potentially accelerating CEVA's IP licensing revenue growth. The seamless integration with CEVA's AI processors (NeuPro-Nano NPUs) positions the company advantageously in the rapidly growing AI-at-the-edge market segment.
Turnkey integrated hardware and software platform IP combines fully featured Bluetooth dual mode with next generation High Data Throughput, alongside IEEE 802.15.4 for Thread/Zigbee/Matter, and includes Ceva's state-of-the-art radio implemented on TSMC 12nm technology
Addressing the rising market demand for faster, more efficient Bluetooth connectivity, particularly for low-power audio and latency-sensitive IoT applications, the breakthrough High Data Throughput mode more than doubles the speed of traditional Bluetooth, delivering a data rate of up to 7.5 Mbps. For this higher speed, Links200 employs innovative HDT modulation schemes in conjunction with Ceva's state-of-the-art radio on TSMC's 12nm FinFET process to satisfy the stringent performance demands in a low power solution. This leap forward in Bluetooth enables lossless, multi-channel, low-latency audio streaming for a broad range of devices, including TWS earbuds, headsets, smartwatches, smart speakers, TV wireless speakers, gaming peripherals, and car audio systems. For example, 5.1 or 7.1 surround sound systems will be able to provide superior home entertainment audio experiences, thanks to the high-quality, multi-channel support enabled by Bluetooth HDT.
As part of the expanding multi-protocol Ceva-Waves Links family, Links200 seamlessly combines Bluetooth HDT with IEEE 802.15.4 support for Zigbee, Thread, and Matter, enabling concurrent multi-link communication through advanced coexistence schemes. The Ceva-Waves Links family offers further integration possibilities with Wi-Fi and Ultra-Wideband (UWB) to expand the scalability and flexibility of the industry's most comprehensive wireless portfolio. Strengthening Ceva's overall leadership in smart edge AI SoCs, Links200 can be further augmented with Ceva-NeuPro-Nano NPUs, leveraging the advanced 12nm process for efficient premium compute intelligence.
"The introduction of the Ceva-Waves Links200 multi-protocol platform with integrated RF technology underscores our commitment to breaking new ground in wireless connectivity and providing our customers with scalability and design efficiency to develop differentiated products that meet a range of market requirements," said Tal Shalev, vice president and general manager of the Wireless IoT business unit at Ceva. "Developing Smart Edge SoCs is increasingly complex and expensive. By providing a 'drop-in' turnkey solution to support and combine multiple and the latest wireless protocols, our Links200 gives our customers the flexibility to customize their solutions and focus on innovation."
Key Features of the Ceva-Waves Links200:
- Full Bluetooth dual mode (Classic and LE) support, including next generation High Data Throughput up to 7.5Mbps for lossless multichannel low latency audio streaming.
- IEEE 802.15.4 support, for Zigbee, Thread and Matter
- Comprehensive Integration: Includes RF, modem, controller, software stacks, and profiles.
- Advanced Audio Support: Supports Classic Audio, LE Audio, and Auracast Broadcast Audio.
- Accurate and Secure Ranging: Supports Bluetooth Channel Sounding for precise and secure ranging.
- Optimized Process: Utilizes TSMC 12nm FFC+ process, ideal for advanced smart audio and Smart Edge AI SoCs.
- Superior Performance: Fully featured with best-in-class power consumption, die size, and performance, with state-of-the-art RF architecture requiring minimal external components for low bill of materials.
- Ease of Integration: Designed for fast time to market.
- Customizable for further product differentiation, via tight integration with Ceva's sensing and inference IPs, including Ceva-NeuPro-Nano NPU, and Ceva-RealSpace Spatial Audio.
For more information, visit https://www.ceva-ip.com/product/ceva-waves-links/
About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of innovation to the smart edge. Our wireless communications, sensing and Edge AI technologies are at the heart of some of today's most advanced smart edge products. From Bluetooth, Wi-Fi, UWB and 5G platform IP for ubiquitous, robust communications, to scalable Edge AI NPU IPs, sensor fusion processors and embedded application software that make devices smarter, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 17 billion of the world's most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks.
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View original content:SOURCE Ceva, Inc.
FAQ
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