CEVA Announces its Most Powerful and Efficient DSP Architecture to Date, Addressing the Massive Compute Requirements of 5G-Advanced and Beyond
CEVA has announced the launch of its 5th generation DSP architecture, the CEVA-XC20, at the Mobile World Congress in Barcelona on February 23, 2023. This new architecture introduces a novel vector multi-threaded compute technology offering up to 2.5X efficiency improvements over its predecessor, targeting demanding 5G-Advanced baseband compute applications including smartphones and cellular infrastructure. The CEVA-XC20 enables enhanced power efficiency and smaller chip designs, supporting sustainable technology goals. The first core, CEVA-XC22, will be available for licensing in the second quarter of 2023, enhancing the performance for essential 5G use cases.
- Launch of CEVA-XC20 architecture enhances CEVA's position in the DSP market.
- CEVA-XC20 offers up to 2.5X efficiency improvement for 5G applications.
- Focus on power efficiency supports environmental sustainability initiatives.
- First core, CEVA-XC22, will be available for licensing in Q2 2023.
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- New CEVA-XC20 extends CEVA's industry leadership in Digital Signal Processors, employing a novel vector multi-threaded compute technology that increases power and area efficiency by up to 2.5X versus predecessor
- Highly scalable architecture targets intense baseband compute use cases for 5G-Advanced eMBB devices, smartphones and cellular RAN equipment
Extending the company's leadership in DSPs, the new CEVA-XC20 is based on a groundbreaking vector multi-threaded massive compute technology that is designed to address next-generation 5G-Advanced workloads across a broad spectrum of use cases, including smartphones, high-end Enhanced Mobile Broadband (eMBB) devices (e.g. Fixed Wireless Access and Industrial Terminals) and a range of cellular infrastructure devices (e.g. base stations, virtualized DU accelerators, and beamforming compute in Massive MIMO radios). SoC and ASIC designers incorporating the CEVA-XC20 architecture can avail of its industry-leading power efficiency to design greener processors that are smaller and lower power, that in turn have a direct positive impact on the environment and society.
The CEVA-XC20 architecture was designed in consultation with CEVA's leading Tier 1 OEM customers, with the common aim of improving mobile network performance and power efficiency. The CEVA-XC20 solves the performance challenges posed by next-generation compute-intense 5G-Advanced by employing a novel Dynamic Vector Threading (DVT) scheme, which supports true hardware multi-threading, which up until now was only found in general purpose CPU architectures. DVT enables optimal sharing of vector resources between different execution units, resulting in an unprecedented vector utilization efficiency boost. This technique achieves optimal utilization of the VLIW architecture and improves core efficiency for common 5G execution kernels, as well as significantly enhancing use cases involving multi-component carriers and multi-execution tasks. This enables increasing the length of the vector processing units, usually consuming the bulk of the area in vector DSPs, while maintaining and even improving the execution efficiency relative to previous generations.
The first core based on the CEVA-XC20 architecture is the CEVA-XC22 DSP, supporting two execution threads using the groundbreaking DVT scheme. The CEVA-XC22 offers a 2.5X improvement in efficiency (performance per watt and area) for essential 5G use cases and computation kernels versus its predecessor. The CEVA-XC22 will also be integrated within CEVA's holistic baseband platforms, PentaG-RAN for cellular infrastructure and PentaG2-Max for high performance mobile devices, wherein it will power CEVA's heterogeneous compute platforms, including both DSPs and compute engine accelerators.
Availability
The CEVA-XC22 DSP will be available for general licensing in the second quarter of this year. CEVA-XC22 customers can also benefit from ASIC/SoC co-creation services by CEVA's
About
CEVA is the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions for a smarter, safer, connected world. We provide Digital Signal Processors, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence. These technologies are offered in combination with our Intrinsix IP integration services, helping our customers address their most complex and time-critical integrated circuit design projects. Leveraging our technologies and chip design skills, many of the world's leading semiconductors, system companies and OEMs create power-efficient, intelligent, secure and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial, aerospace & defense and IoT.
Our DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low-power always-on/sensing applications for multiple IoT markets. For motion sensing solutions, our
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