Ceva Unveils Latest High-Performance, High-Efficiency Communication DSPs for Advanced 5G and 6G Applications
CEVA (NASDAQ: CEVA) has unveiled two new high-performance baseband vector DSPs for advanced 5G and 6G-ready applications. The new processors build upon the successful CEVA-XC20 architecture, which is already in design with two Tier-1 infrastructure OEMs.
The CEVA-XC21 DSP, targeting low-power and cost-sensitive applications, delivers up to 1.8X performance improvements while requiring 48% less area compared to its predecessor. The CEVA-XC23 DSP, designed for high-end applications, achieves 2.4X improvements in performance and 2.3X efficiency gains.
Both DSPs feature AI support, dual threading capabilities, and enhanced 5G ISA for accelerated channel processing. The CEVA-XC21 offers 256b SIMD vector size with single/dual thread options, while the CEVA-XC23 provides 512b SIMD vector size with dual thread design. The new DSPs will be available for general licensing by the end of Q1.
CEVA (NASDAQ: CEVA) ha presentato due nuovi DSP vectoriali baseband ad alte prestazioni per applicazioni avanzate pronte per 5G e 6G. I nuovi processori si basano sull'architettura CEVA-XC20, già in fase di progettazione con due OEM di infrastruttura di livello 1.
Il DSP CEVA-XC21, mirato ad applicazioni a basso consumo e sensibili ai costi, offre miglioramenti delle prestazioni fino a 1.8X, richiedendo il 48% di area in meno rispetto al suo predecessore. Il DSP CEVA-XC23, progettato per applicazioni di fascia alta, raggiunge miglioramenti delle prestazioni di 2.4X e guadagni di efficienza di 2.3X.
Entrambi i DSP presentano supporto per l'IA, capacità di threading duale e un ISA 5G migliorato per un'elaborazione accelerata dei canali. Il CEVA-XC21 offre una dimensione vettoriale SIMD di 256b con opzioni di thread singolo/duale, mentre il CEVA-XC23 fornisce una dimensione vettoriale SIMD di 512b con design a thread duale. I nuovi DSP saranno disponibili per licenza generale entro la fine del primo trimestre.
CEVA (NASDAQ: CEVA) ha presentado dos nuevos DSP vectoriales de banda base de alto rendimiento para aplicaciones avanzadas listas para 5G y 6G. Los nuevos procesadores se basan en la arquitectura CEVA-XC20, que ya está en diseño con dos OEM de infraestructura de nivel 1.
El DSP CEVA-XC21, dirigido a aplicaciones de bajo consumo y sensibles al costo, ofrece mejoras de rendimiento de hasta 1.8X, requiriendo un 48% menos de área en comparación con su predecesor. El DSP CEVA-XC23, diseñado para aplicaciones de alta gama, logra mejoras de rendimiento de 2.4X y ganancias de eficiencia de 2.3X.
Ambos DSP cuentan con soporte de IA, capacidades de hilo dual y un ISA 5G mejorado para un procesamiento de canales acelerado. El CEVA-XC21 ofrece un tamaño de vector SIMD de 256b con opciones de hilo único/dual, mientras que el CEVA-XC23 proporciona un tamaño de vector SIMD de 512b con diseño de hilo dual. Los nuevos DSP estarán disponibles para licencia general a finales del primer trimestre.
CEVA (NASDAQ: CEVA)는 고성능 베이스밴드 벡터 DSP 두 가지를 발표하여 5G 및 6G 준비 애플리케이션을 지원합니다. 새로운 프로세서는 이미 두 개의 Tier-1 인프라 OEM과 설계 중인 성공적인 CEVA-XC20 아키텍처를 기반으로 합니다.
CEVA-XC21 DSP는 저전력 및 비용 민감한 애플리케이션을 목표로 하며, 이전 모델에 비해 최대 1.8배 성능 향상을 제공하고 48% 적은 면적을 요구합니다. CEVA-XC23 DSP는 고급 애플리케이션을 위해 설계되었으며, 성능에서 2.4배 향상과 2.3배의 효율성 향상을 달성합니다.
두 DSP 모두 AI 지원, 듀얼 스레딩 기능 및 가속화된 채널 처리를 위한 향상된 5G ISA를 특징으로 합니다. CEVA-XC21은 단일/듀얼 스레드 옵션이 있는 256b SIMD 벡터 크기를 제공하며, CEVA-XC23은 듀얼 스레드 설계를 갖춘 512b SIMD 벡터 크기를 제공합니다. 새로운 DSP는 1분기 말까지 일반 라이센스를 위해 제공될 예정입니다.
CEVA (NASDAQ: CEVA) a dévoilé deux nouveaux DSP vectoriels de baseband haute performance pour des applications prêtes pour le 5G et 6G. Les nouveaux processeurs s'appuient sur l'architecture CEVA-XC20, qui est déjà en cours de conception avec deux OEM d'infrastructure de premier plan.
Le DSP CEVA-XC21, ciblant des applications à faible consommation et sensibles aux coûts, offre jusqu'à 1,8 fois d'amélioration des performances tout en nécessitant 48 % de surface en moins par rapport à son prédécesseur. Le DSP CEVA-XC23, conçu pour des applications haut de gamme, atteint des améliorations de performances de 2,4 fois et des gains d'efficacité de 2,3 fois.
Les deux DSP disposent d'un support IA, de capacités de double fil et d'un ISA 5G amélioré pour un traitement des canaux accéléré. Le CEVA-XC21 offre une taille de vecteur SIMD de 256b avec des options de fil unique/dual, tandis que le CEVA-XC23 propose une taille de vecteur SIMD de 512b avec un design à double fil. Les nouveaux DSP seront disponibles pour une licence générale d'ici la fin du premier trimestre.
CEVA (NASDAQ: CEVA) hat zwei neue hochleistungsfähige Basisband-Vektor-DSPs für fortschrittliche 5G- und 6G-Anwendungen vorgestellt. Die neuen Prozessoren basieren auf der erfolgreichen CEVA-XC20-Architektur, die bereits mit zwei Tier-1-Infrastruktur-OEMs in der Entwicklung ist.
Der CEVA-XC21 DSP, der auf energieeffiziente und kostensensible Anwendungen abzielt, bietet bis zu 1,8-fache Leistungssteigerungen und benötigt 48% weniger Fläche im Vergleich zu seinem Vorgänger. Der CEVA-XC23 DSP, der für hochwertige Anwendungen konzipiert ist, erzielt 2,4-fache Leistungsverbesserungen und 2,3-fache Effizienzgewinne.
Beide DSPs verfügen über KI-Unterstützung, Dual-Threading-Funktionen und ein verbessertes 5G-ISA für beschleunigte Kanalverarbeitung. Der CEVA-XC21 bietet eine SIMD-Vektorgröße von 256b mit Einzel-/Dual-Thread-Optionen, während der CEVA-XC23 eine SIMD-Vektorgröße von 512b mit Dual-Thread-Design bereitstellt. Die neuen DSPs werden bis Ende des ersten Quartals allgemein lizenziert verfügbar sein.
- New DSPs achieve significant performance improvements: 2.4X for XC23 and 1.8X for XC21
- 48% area reduction in XC21 model enables cost savings
- AI support future-proofs designs for evolving wireless standards
- Already secured two Tier-1 infrastructure OEM design wins
- Products not yet available for general licensing
Insights
Ceva's new XC21 and XC23 digital signal processors represent a significant technological advancement that strengthens the company's competitive position in the critical 5G and emerging 6G semiconductor IP market. These processors deliver substantial performance gains (up to 2.4X) and efficiency improvements (up to 2.3X) while reducing silicon area requirements by up to
The strategic importance of these launches extends beyond the technical specifications. By securing design wins with two Tier-1 infrastructure OEMs before the official product launch, Ceva demonstrates strong market validation and suggests meaningful licensing revenue potential in the near term. The semiconductor IP licensing model typically generates high-margin revenue through upfront license fees followed by ongoing royalties based on customer shipment volumes.
The inclusion of AI capabilities in both DSPs aligns perfectly with the industry's shift toward intelligent wireless networks. This feature allows network operators to dynamically optimize spectrum usage and power consumption—critical advantages as 5G networks mature and 6G development accelerates. The dual-thread architecture with Dynamic Vector Threading enables more efficient resource utilization, addressing the growing computational demands of advanced wireless protocols.
From a competitive standpoint, Ceva is strengthening its specialized position against broader IP providers like Arm and Synopsys. The backward compatibility with existing Ceva-XC products creates significant switching costs for current customers, protecting Ceva's market share while the performance improvements provide compelling reasons for new customer acquisition.
With the projected Q1 2025 availability for licensing, Ceva is well-positioned to capture design wins throughout 2025-2026, with potential royalty revenue streams extending years beyond as these designs reach production.
- New DSPs offer scalable architecture and dual thread design with support for AI, addressing growing demand for smarter, more efficient wireless infrastructure
- High-performance Ceva-XC23 DSP delivers 2.4X improvements in performance and area efficiency for more intensive applications
- Ceva-XC21 targets cost-sensitive applications delivering up to 1.8X performance and efficiency improvements and requiring up to
The Ceva-XC21 5G IoT DSP is designed for low-power, cost- and size-optimized cellular IoT modems, NTN VSAT terminals, eMBB and uRLLC applications. As the successor to the widely-adopted Ceva-XC4500 DSP, the Ceva-XC21 offers a size reduction of up to
The Ceva-XC23 DSP targets regenerative NTN satellite payloads, high-end user equipment (UEs) and infrastructure baseband processing, including baseband units (BBUs), distributed units (DUs) and radio units (RUs). It provides high-performance capabilities for 5G-advanced and pre-6G applications with performance boost of up to 2.4 times and a 2.3X efficiency improvement compared to the Ceva-XC4500.
"Our latest vector DSPs represent a significant leap forward in performance and efficiency for advanced 5G and 6G applications. Building on the success of our industry-leading Ceva-XC4500, which has powered hundreds of millions of devices, these new DSPs offer a robust, future-proof platform to develop highly efficient next-generation modems and infrastructure ASICs. With AI support and programmability, these DSPs not only improve modem performance but also enable advanced AI and ML workloads, ensuring optimal network performance and efficiency towards 6G," said Guy Keshet, vice president and general manager, Mobile Broadband Business Unit at Ceva.
The Ceva-XC21 and Ceva-XC23 DSPs are built on top of the scalable, multi-thread Ceva-XC20 architecture, offering optimized cost-power-performance for their respective end markets.
Key features include:
- Ceva-XC21: 256b SIMD vector size, single/dual thread options, and 64/32 16x16-bit MAC options
- Ceva-XC23: 512b SIMD vector size, dual thread design, and 128 16x16-bit MACs for demanding applications
Both DSPs feature:
- 5th generation Ceva-XC Communication Vector DSP Architecture
- AI support for 8-bit neural networks
- Dual threading with Dynamic Vector Threading (DVT)
- Enhanced 5G ISA for accelerated 5G channel processing
The Ceva-XC21 and Ceva-XC23 DSPs ensure seamless migration for existing Ceva-XC customers, with code compatibility with other Ceva-XC20 products and ISA compatibility with the popular Ceva-XC4500.
For more information, visit https://www.ceva-ip.com/product/ceva-xc21/ and https://www.ceva-ip.com/product/ceva-xc23/.
Availability:
The Ceva-XC21 and Ceva-XC23 will be available for general licensing by the end of the first quarter.
About Ceva, Inc.
At Ceva, we are passionate about bringing new levels of innovation to the smart edge. Our wireless communications, sensing and Edge AI technologies are at the heart of some of today's most advanced smart edge products. From wireless connectivity IPs (Bluetooth, Wi-Fi, UWB and 5G platform IP), to scalable Edge AI NPU IPs and sensor fusion solutions, we have the broadest portfolio of IP to connect, sense and infer data more reliably and efficiently. We deliver differentiated solutions that combine outstanding performance at ultra-low power within a very small silicon footprint. Our goal is simple – to deliver the silicon and software IP to enable a smarter, safer, and more interconnected world. This philosophy is in practice today, with Ceva powering more than 19 billion of the world's most innovative smart edge products from AI-infused smartwatches, IoT devices and wearables to autonomous vehicles and 5G mobile networks.
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Visit us at www.ceva-ip.com and follow us on LinkedIn, X, YouTube, Facebook, and Instagram.
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SOURCE Ceva, Inc.
FAQ
What performance improvements does the new CEVA-XC23 DSP offer for 5G applications?
How much area reduction does the CEVA-XC21 DSP achieve compared to its predecessor?
What are the key technical specifications of CEVA's new 5G/6G DSPs?
When will CEVA's new XC21 and XC23 DSPs be available for licensing?
Which companies are currently designing with CEVA's XC20 architecture?
