CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution
CEVA, Inc. announced a significant expansion of its collaboration with Autotalks at CES 2023. Autotalks has licensed CEVA's Communication Processor and Digital Signal Controller for its third-generation V2X chipsets, TEKTON3 and SECTON3. These chips, which have already received series production approval from a major automotive OEM, are set for market introduction in 2026. ABI Research projects that V2X-enabled vehicles will exceed 61 million by 2030, indicating strong growth. CEVA's DSPs enable enhanced V2X capabilities crucial for safety and autonomous driving.
- Collaboration with Autotalks strengthens CEVA's position in the V2X market.
- TEKTON3 and SECTON3 chipsets awarded for series production, indicating strong demand.
- Projected growth of V2X vehicles to 61 million by 2030 highlights market potential.
- None.
Autotalks' latest CEVA-powered V2X chips - TEKTON3 and SECTON3 – already awarded series production by major automotive OEM
LAS VEGAS, Jan. 5, 2023 /PRNewswire/ -- Consumer Electronics Show – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, announced today that Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions, has licensed and deployed the CEVA-XC4500 Communication Processor and CEVA-BX1 Digital Signal Controller in its 3rd generation V2X chipsets, TEKTON3 and SECTON3. This latest collaboration follows on from Autotalks 2nd generation chips, SECTON and CRATON2, which are also powered by CEVA DSPs.
ABI Research forecasts that the number of registered vehicles with V2X will surpass 61 million by 2030, growing at a CAGR of
Amos Freund, Autotalks VP R&D, commented: "Autotalks is pleased to expand its collaboration with CEVA and continue to provide the world's best V2X hardware and software with our TEKTON3 and SECTON3 chips. CEVA's DSPs play a crucial role in the ability to concurrently support DSRC and C-V2X technologies, including the latest 5G NR-V2X standard. We are excited to see these chips deployed in passenger vehicles in the coming years, helping protect drivers, two-wheelers, and pedestrians."
Guy Keshet, Vice President and General Manager of the Mobile Broadband Business Unit at CEVA, stated: "Autotalks is widely recognized as a pioneer in V2X chipsets, constantly pushing the technology forward to achieve mass market adoption. We are proud to work closely with them to provide our best-in-class DSPs for two generations of their V2X technology. We look forward to safer roads in the future, thanks in part to Autotalks lifesaving V2X solutions."
Autotalks (www.auto-talks.com), a V2X chipset market pioneer and leader, helps reduce collisions on roadways and improve mobility with its automotive qualified chipsets. The company's chipsets offer the most advanced, truly secure and highest performing global V2X communication solution. Autotalks' advanced technology, to be mass deployed in the coming years, complements the information coming from other sensors, specifically in non-line-of-sight scenarios, rough weather, or poor lighting conditions. It significantly improves overall road safety, effectively coordinating vehicles, self-driving cars, motorcyclists, and pedestrians.
CEVA is the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions for a smarter, safer, connected world. We provide Digital Signal Processors, AI engines, wireless platforms, cryptography cores and complementary software for sensor fusion, image enhancement, computer vision, voice input and artificial intelligence. These technologies are offered in combination with our Intrinsix IP integration services, helping our customers address their most complex and time-critical integrated circuit design projects. Leveraging our technologies and chip design skills, many of the world's leading semiconductors, system companies and OEMs create power-efficient, intelligent, secure and connected devices for a range of end markets, including mobile, consumer, automotive, robotics, industrial, aerospace & defense and IoT.
Our DSP-based solutions include platforms for 5G baseband processing in mobile, IoT and infrastructure, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low-power always-on/sensing applications for multiple IoT markets. For sensor fusion, our Hillcrest Labs sensor processing technologies provide a broad range of sensor fusion software and inertial measurement unit ("IMU") solutions for markets including hearables, wearables, AR/VR, PC, robotics, remote controls and IoT. For wireless IoT, our platforms for Bluetooth (low energy and dual mode), Wi-Fi 4/5/6 (802.11n/ac/ax), Ultra-wideband (UWB), NB-IoT and GNSS are the most broadly licensed connectivity platforms in the industry.
Visit us at www.ceva-dsp.com and follow us on Twitter, YouTube, Facebook, LinkedIn and Instagram.
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SOURCE CEVA, Inc.
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