Cadence and Intel Foundry Collaborate on Systems Foundry Enablement for the AI Era

Rhea-AI Summary

Cadence Design Systems has announced significant achievements in its partnership with Intel Foundry. The collaboration includes advancements in 3D-IC enablement, EDA flows, and IP development for Intel's 18A process nodes.

Key milestones include the availability of a complete EMIB 2.5D advanced packaging flow, enhancements to digital and custom/analog flows, and a comprehensive IP portfolio and PDKs across multiple nodes. Cadence’s AI-driven flows for Intel 18A technology enable efficient design and rapid time-to-market for complex AI-enabling semiconductors. The collaboration leverages Intel’s EMIB technology and advanced silicon capabilities to meet performance, power, and area (PPA) goals.

Cadence’s solutions include the Integrity 3D-IC Platform, Allegro X APD, Sigrity, Clarity 3D Solver, Pegasus Verification System, Virtuoso Studio, Cerebrus Intelligent Chip Explorer, Genus Synthesis Solution, Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Solution, Voltus IC Power Integrity Solution, and Liberate Characterization. The partnership aims to deliver next-generation system innovations and support the development of high-performance computing and AI/ML applications.

Positive

• Significant advancements in 3D-IC enablement and EDA flows for Intel 18A process.
• Availability of a complete EMIB 2.5D advanced packaging flow.
• Comprehensive IP portfolio supporting a range of high-performance computing and AI/ML applications.
• AI-driven full-flow solutions certified and optimized for Intel 18A technology.
• Enhanced design efficiency and time-to-market for complex semiconductors.

Negative

• None.

Insights

Tech Expert

Cadence Design Systems and Intel Foundry's collaboration focuses on several advanced technologies that are pivotal for the semiconductor industry, particularly in the AI and high-performance computing space. The introduction of the Embedded Multi-die Interconnect Bridge (EMIB) 2.5D packaging flow is significant. This technology allows for efficient integration of multiple dies within a single package, leading to improved performance and power efficiency. For an investor, this means Cadence is pushing the envelope in terms of cutting-edge packaging technologies, which could enhance their competitive edge in the AI and HPC markets.

The utilization of AI-driven tools in the design process, such as the Cadence Cerebrus Intelligent Chip Explorer, highlights Cadence's commitment to leveraging AI for higher design productivity and optimization. This is crucial, as it can substantially reduce time-to-market for new semiconductor products. The seamless integration and optimization for Intel 18A technology, featuring the RibbonFET gate-all-around transistors and PowerVia backside power delivery, indicate that both companies are at the forefront of semiconductor process innovation.

These advancements not only strengthen Cadence's product lineup but also position them as a valuable partner for other semiconductor firms looking to innovate rapidly. Given the increasing demand for high-performance and efficient AI chips, Cadence's updated product offerings and enhanced collaboration with Intel Foundry are likely to have a positive impact on their market position and revenue potential in the near term.

Financial Analyst

The strategic milestones announced by Cadence and Intel Foundry are likely to have a positive financial impact on Cadence Design Systems. The introduction of new EDA flows, IP development and advanced packaging technologies can drive new revenue streams, especially from clients in the AI and high-performance computing sectors. These sectors are currently experiencing high growth and Cadence’s innovative solutions could attract a significant portion of that market.

Cadence's ability to offer a comprehensive portfolio across multiple Intel process nodes, particularly the advanced 18A node, positions it favorably against competitors. This could lead to increased long-term earnings stability. Furthermore, the use of AI-driven tools for design and optimization can enhance operational efficiencies and lower developmental costs, potentially improving margins.

For retail investors, the key takeaway is that Cadence’s enhanced partnership with Intel Foundry could translate into improved financial performance. This collaboration aligns with broader industry trends towards AI and high-performance computing, suggesting sustained demand for Cadence’s offerings. However, it is essential to monitor how these technological advancements translate into tangible financial results in upcoming quarterly earnings reports.

SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the achievement of several key milestones in its ongoing strategic partnership with Intel Foundry. Furthering the companies’ collaboration on 3D-IC enablement, EDA flows and IP development across multiple Intel process nodes, beginning with Intel 18A Cadence announced the availability of a complete Embedded Multi-die Interconnect Bridge (EMIB) 2.5D advanced packaging flow, enhancements to the Intel 18A digital and custom/analog flows, a wide-ranging IP portfolio and the corresponding process design kits (PDKs) across various process nodes.

Key milestones of the ongoing Cadence-Intel Foundry collaboration include:

• EMIB Reference Flow: The complete AI-driven Cadence^® flow, with Integrity^™ 3D-IC Platform integrating Allegro^® X Advanced Package Designer (APD), Sigrity^™ technologies, Clarity^™ 3D Solver, Pegasus^™ Verification System, and Virtuoso^® Studio, constitutes Intel’s advanced packaging reference flow that leverages its EMIB technology and is optimized to work seamlessly with Intel 18A technology. The advanced EMIB 2.5D reference flow enables customers to successfully complete full-flow heterogeneous designs, seamlessly transitioning from system-level planning, physical optimization and analysis to DRC-aware implementation and physical signoff, with unmatched productivity and time to market.
• Digital Full-Flow for Intel 18A: The complete AI-driven Cadence RTL-to-GDS flow has been certified and optimized for Intel 18A technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery, enabling customers to meet their challenging PPA targets. The full flow includes the AI-driven Cadence Cerebrus^™ Intelligent Chip Explorer, Genus^™ Synthesis Solution, Innovus^™ Implementation System, Quantus^™ Extraction Solution, Quantus Field Solver, Tempus^™ Timing Solution, Pegasus Verification System, Liberate^™ Characterization, and Voltus^™ IC Power Integrity Solution.
• Custom/Analog Flow for Intel 18A: Cadence’s AI-based Virtuoso Studio, Spectre^® Simulation Platform, Voltus-XFi Custom Power Integrity Solution and EMX Planar 3D Solver have all been certified for Intel 18A. Virtuoso Studio is integrated with the Innovus Implementation System, enabling a complete implementation methodology for mixed-signal designs. Virtuoso Studio supports the features required to complete complex analog/mixed signal designs such as automatic device and standard cell place-and-route (P&R), assisted device editing capabilities, integrated EM-IR checks, integrated signoff-quality parasitic extraction and integrated signoff-quality physical verification, delivering efficient design and layout implementation on the Intel 18A process.
• Design IP for Intel 18A: Cadence’s leading-edge implementations of trailblazing standards for advanced high-performance computing (HPC) and artificial intelligence and machine learning (AI/ML) applications enable joint customers to achieve scalable, high-performance designs that accelerate time to market in Intel Foundry’s most advanced silicon technologies and 3D-IC packaging capabilities. Cadence Design IP for Intel 18A technology includes the enterprise-class PCI Express^® (PCIe^®) 6.0 and Compute Express Link (CXL), multi-standard PHY for LPDDR5X/5 8533Mbps to enable a diverse set of memory applications, Universal Chiplet Interconnect Express^™ (UCIe^™) to boost multi-die system in package integration and 112G extended long-reach SerDes for superior bit error rate (BER) performance.

“Our close collaboration with Intel Foundry on 3D-IC enablement, EDA flows and IP is yielding significant results for mutual customers developing complex AI-enabling semiconductors and electronic systems,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group at Cadence. “The availability of the complete EMIB 2.5D advanced packaging flow and other key milestones demonstrate the strength of our partnership and our commitment to delivering next-generation system innovations.”

“The challenges of system-level exploration and optimization require co-design and co-optimization from RTL through package, board and system,” said Suk Lee, VP & GM, Ecosystem Technology Office, Intel Foundry. “We rely on Cadence as one of the key ecosystem partners to deliver best-in-class AI-powered EDA solutions and IP technology in pursuit of our goal to be a systems foundry for the AI era.”

About Cadence

Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For 10 years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.

© 2024 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. PCI Express and PCIe are registered trademarks or trademarks of PCI-SIG. Universal Chiplet Interconnect Express and UCIe are registered trademarks or trademarks of the UCIe Consortium. All other trademarks are the property of their respective owners.

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Source: Cadence Design Systems, Inc.

FAQ

What is the significance of Cadence and Intel Foundry's collaboration on 3D-IC enablement?

The collaboration aims to advance 3D-IC enablement, EDA flows, and IP development to support complex AI-enabling semiconductors and improve design efficiency.

What are the key milestones in Cadence's partnership with Intel Foundry for Intel 18A technology?

Key milestones include a complete EMIB 2.5D advanced packaging flow, enhancements to digital and custom/analog flows, and a comprehensive IP portfolio and process design kits across multiple nodes.

How does Cadence's AI-driven full-flow solutions benefit Intel 18A technology?

Cadence's AI-driven full-flow solutions, certified and optimized for Intel 18A, improve design efficiency and time-to-market, supporting the development of high-performance computing and AI/ML applications.

What technologies are included in Cadence's solutions for Intel 18A?

Cadence’s solutions include Integrity 3D-IC Platform, Allegro X APD, Sigrity, Clarity 3D Solver, Pegasus Verification System, Virtuoso Studio, Cerebrus Intelligent Chip Explorer, Genus Synthesis Solution, Innovus Implementation System, Quantus Extraction Solution, Tempus Timing Solution, Voltus IC Power Integrity Solution, and Liberate Characterization.

What are the benefits of the EMIB 2.5D advanced packaging flow introduced by Cadence?

The EMIB 2.5D advanced packaging flow enables full-flow heterogeneous designs, enhancing productivity and time-to-market for complex semiconductors by integrating system-level planning, physical optimization, and analysis.