Camtek Receives a $20M Order from a Tier-1 OSAT

Rhea-AI Summary

Camtek (NASDAQ: CAMT) has secured a $20 million order from a tier-1 Outsourced Semiconductor Assembly and Test (OSAT) company. This multiple-systems order is for the inspection and metrology of Advanced Packaging applications, set for delivery in the second half of 2024. CEO Rafi Amit highlighted that this order reinforces Camtek's leadership in inspection and metrology tools and supports expected growth in the latter half of the year. Recent orders for Chiplets and High Bandwidth Memory (HBM) applications further bolster Camtek's business momentum.

Positive

• Camtek received a $20 million order from a tier-1 OSAT for Advanced Packaging applications.
• The systems are scheduled for delivery in the second half of 2024.
• This order supports Camtek's expected growth in the second half of 2024.
• Recent orders for Chiplets and HBM applications indicate continuous business momentum.

Negative

• None.

Insights

Financial Analyst

Camtek's announcement of a $20 million order from a tier-1 OSAT is a positive indicator of the company's financial health and market position. This substantial order highlights Camtek's growing footprint in the semiconductor inspection and metrology market, particularly in the Advanced Packaging segment. Advanced Packaging is a technology that enhances the performance of semiconductors by integrating multiple chips in a single package, often using techniques like Chiplets and High Bandwidth Memory (HBM).

From a financial perspective, this new order represents a significant revenue boost, likely to be reflected in the second half of 2024 financials. This aligns with the company's ongoing business momentum and supports their projections for continued growth. Notably, Camtek's ability to secure orders from tier-1 clients suggests strong competitive positioning and customer trust in their technology.

Short-term, investors might see an uptick in stock price due to positive market sentiment. Long-term, consistent orders like this could enhance revenue stability and potentially improve profit margins, assuming the cost of production remains stable. However, investors should be aware of the cyclical nature of the semiconductor market, which can lead to fluctuations in demand.

Tech Expert

Camtek's receipt of a $20 million order for inspection and metrology systems from a tier-1 OSAT is a testament to the technological advancements and reliability of their solutions in the realm of Advanced Packaging. The role of inspection and metrology in semiconductor manufacturing cannot be overstated, as it ensures the quality and performance of the final products. Advanced Packaging technologies like Chiplets and HBM are becoming increasingly critical in high-performance computing and AI applications, driving demand for sophisticated inspection tools.

From a technological standpoint, securing this order indicates that Camtek's solutions are well-regarded in terms of precision, speed and reliability. This can position them as a preferred partner for leading semiconductor manufacturers. Moreover, the continuous business momentum mentioned by CEO Rafi Amit, including orders for Chiplets and HBM applications, suggests that Camtek is at the forefront of meeting emerging industry trends and demands.

For retail investors, understanding the significance of these technologies can provide insight into why such orders are vital for Camtek's growth and why they can be considered a bellwether for the company's future success. The increasing complexity of semiconductor devices underscores the importance of robust inspection and metrology systems, making this a strategic area for investment and development.

MIGDAL HAEMEK, Israel, July 9, 2024 /PRNewswire/ -- Camtek Ltd. (NASDAQ: CAMT) (TASE: CAMT), today announced that it has received a new multiple-systems' order for a total of $20 million from a tier-1 Outsourced Semiconductor Assembly & Test (OSAT), for the inspection and metrology of Advanced Packaging applications. The systems are expected to be delivered in the second half of 2024.

Rafi Amit, CEO of Camtek commented, "This significant order from a tier-1 OSAT underscores our leadership in providing inspection and metrology tools for various Advanced Packaging applications. This order, together with continuous business momentum including orders we recently received for Chiplets and HBM applications, supports our expectations for continued growth in the second half of 2024."

For more information about Camtek Ltd. and its advanced inspection and metrology solutions, please visit www.camtek.com.

ABOUT CAMTEK LTD.

Camtek is a developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry. Camtek's systems inspect IC and measure IC features on wafers throughout the production process of semiconductor devices, covering the front and mid-end and up to the beginning of assembly (Post Dicing). Camtek's systems inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industry's leading global IDMs, OSATs, and foundries.

With manufacturing facilities in Israel and Germany, and eight offices around the world, Camtek provides state of the art solutions in line with customers' requirements.

This press release is available at www.camtek.com 

This press release contains statements that may constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based on Camtek's current beliefs, expectations and assumptions about its business and industry, all of which may change.  Forward-looking statements can be identified by the use of words including "believe," "anticipate," "should," "intend," "plan," "will," "may," "expect," "estimate," "project," "positioned," "strategy," and similar expressions that are intended to identify forward-looking statements, including our expectations and statements relating to the compound semiconductors market and our position in this market and the anticipated timing of delivery of the systems. These forward-looking statements involve known and unknown risks and uncertainties that may cause the actual results, performance or achievements of Camtek to be materially different from any future results, performance or achievements expressed or implied by such forward-looking statements. Factors that may cause our actual results to differ materially from those contained in the forward-looking statements include, but are not limited to, the effects of the evolving nature of the war situation in Israel, and the related evolving regional conflicts; the continued demand  and future contribution of HBM and Chiplet applications and devices to the Company business resulting from, among other things, the field of AI surging worldwide across companies, industries and nations; formal or informal imposition by countries of new or revised export and/or import and doing-business regulations or sanctions, including but not limited to changes in U.S. trade policies, changes or uncertainty related to the U.S. government entity list and changes in the ability to sell products incorporating U.S originated technology, which can be made without prior notice, and our ability to effectively address such global trade issues and changes; and those other factors discussed in our Annual Report on Form 20-F as published on March 21, 2024 as well as other documents that may be subsequently filed by Camtek from time to time with the Securities and Exchange Commission. We caution you not to place undue reliance on forward-looking statements, which speak only as of the date hereof. Camtek does not assume any obligation to update any forward-looking statements in order to reflect events or circumstances that may arise after the date of this release unless required by law.

While we believe that we have a reasonable basis for each forward-looking statement contained in this press release, we caution you that these statements are based on a combination of facts and factors currently known by us and our projections of the future, about which we cannot be certain. In addition, any forward-looking statements represent Camtek's views only as of the date of this press release and should not be relied upon as representing its views as of any subsequent date. Camtek does not assume any obligation to update any forward-looking statements unless required by law.

CAMTEK LTD.		INTERNATIONAL INVESTOR RELATIONS
Moshe Eisenberg, CFO		EK Global Investor Relations
Tel: +972 4 604 8308		Ehud Helft
Mobile: +972 54 900 7100		Tel: (US) 1 212 378 8040
moshee@camtek.com		camtek@ekgir.com

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SOURCE Camtek Ltd.

FAQ

What is the value of the recent order Camtek received?

Camtek received a $20 million order.

When will Camtek deliver the systems for the new order?

The systems are expected to be delivered in the second half of 2024.

Which company placed the $20 million order with Camtek?

A tier-1 Outsourced Semiconductor Assembly and Test (OSAT) company placed the order.

What will the $20 million order from Camtek be used for?

The order is for the inspection and metrology of Advanced Packaging applications.

What recent developments support Camtek's expected growth in 2024?

The $20 million order and recent orders for Chiplets and High Bandwidth Memory (HBM) applications support Camtek's expected growth.