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Camtek Receives Orders for Over $50 Million for its New Product Line: Hawk

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Camtek has secured orders exceeding $50 million for its new Hawk product line, scheduled for delivery throughout 2025. The Hawk, which will be officially launched at Semicon Korea in February 2025, is built on a revolutionary platform designed for high-end Advanced Packaging technologies. It features inspection and 3D measurement capabilities for wafers with 500 million micro bumps and Hybrid Bonding technology. The new product line addresses demanding applications including High Bandwidth Memory (HBM), Chiplet, and Hybrid Bonding, offering enhanced capabilities beyond the existing Eagle product line and expanding Camtek's total addressable market.

Camtek ha ottenuto ordini superiori a 50 milioni di dollari per la sua nuova linea di prodotti Hawk, prevista per la consegna nel corso del 2025. L'Hawk, che sarà lanciato ufficialmente al Semicon Korea a febbraio 2025, è costruito su una piattaforma rivoluzionaria progettata per tecnologie di imballaggio avanzato di alta gamma. Presenta capacità di ispezione e misurazione 3D per wafer con 500 milioni di micro bump e tecnologia di Hybrid Bonding. La nuova linea di prodotti si occupa di applicazioni esigenti tra cui la Memoria ad Alta Larghezza di Banda (HBM), Chiplet e Hybrid Bonding, offrendo capacità migliorate rispetto alla linea di prodotti Eagle esistente e ampliando il mercato potenziale totale di Camtek.

Camtek ha asegurado pedidos por más de 50 millones de dólares para su nueva línea de productos Hawk, programada para entrega a lo largo de 2025. El Hawk, que será lanzado oficialmente en Semicon Korea en febrero de 2025, está construido sobre una plataforma revolucionaria diseñada para tecnologías de embalaje avanzado de alta gama. Presenta capacidades de inspección y medición 3D para obleas con 500 millones de micro protuberancias y tecnología de Hybrid Bonding. La nueva línea de productos atiende aplicaciones exigentes que incluyen Memoria de Alta Ancho de Banda (HBM), Chiplet y Hybrid Bonding, ofreciendo capacidades mejoradas más allá de la línea de productos Eagle existente y ampliando el mercado total adresable de Camtek.

Camtek는 2025년 전반에 걸쳐 배송될 Hawk 제품 라인에 대해 5천만 달러 이상의 주문을 확보했습니다. Hawk는 2025년 2월 Semicon Korea에서 공식 출시될 예정이며, 고급 첨단 포장 기술을 위해 설계된 혁신적인 플랫폼 위에 구축되었습니다. 5억 개의 마이크로 범프가 장착된 웨이퍼에 대한 검사 및 3D 측정 기능을 갖추고 있으며, 하이브리드 본딩 기술을 적용하고 있습니다. 이 새로운 제품 라인은 고대역폭 메모리(HBM), 칩렛 및 하이브리드 본딩을 포함한 까다로운 애플리케이션을 다루며, 기존의 Eagle 제품 라인보다 향상된 기능을 제공하고 Camtek의 총 주소 가능 시장을 확장하고 있습니다.

Camtek a sécurisé des commandes dépassant 50 millions de dollars pour sa nouvelle gamme de produits Hawk, prévue pour livraison tout au long de l'année 2025. Le Hawk, qui sera officiellement lancé au Semicon Korea en février 2025, est construit sur une plateforme révolutionnaire conçue pour des technologies d'emballage avancées haut de gamme. Il dispose de capacités d'inspection et de mesure 3D pour des wafers avec 500 millions de micro-projections et de la technologie de Hybrid Bonding. La nouvelle ligne de produits vise des applications exigeantes, y compris la mémoire à large bande passante (HBM), les Chiplets et le Hybrid Bonding, offrant des capacités améliorées par rapport à l'ancienne ligne de produits Eagle, et élargissant le marché total adressable de Camtek.

Camtek hat Aufträge im Wert von über 50 Millionen Dollar für seine neue Hawk-Produktlinie gesichert, die im Laufe von 2025 ausgeliefert werden soll. Der Hawk, der im Februar 2025 offiziell auf der Semicon Korea vorgestellt wird, basiert auf einer revolutionären Plattform, die für hochwertige Technologien im Bereich Advanced Packaging entwickelt wurde. Er verfügt über Inspektions- und 3D-Messfunktionen für Wafer mit 500 Millionen Mikro-Vorsprünge und Hybrid Bonding Technologie. Die neue Produktlinie behandelt anspruchsvolle Anwendungen, darunter Hochbandbreiten-Speicher (HBM), Chiplet und Hybrid Bonding, und bietet verbesserte Fähigkeiten im Vergleich zur bestehenden Eagle-Produktlinie, wodurch sich der total addressable market von Camtek erweitert.

Positive
  • Secured over $50 million in initial orders for new Hawk product line
  • Expansion of total addressable market (TAM) with new technology capabilities
  • Strong initial customer reception before official product launch
  • Advanced technological features addressing high-end market segments
Negative
  • None.

Insights

The Hawk platform represents a significant technological leap in semiconductor inspection, particularly for advanced packaging applications. The $50 million in pre-launch orders signals strong market validation and potential revenue growth. The timing aligns perfectly with the increasing demand for High Bandwidth Memory and Chiplet technologies, driven by AI and high-performance computing needs.

The platform's ability to inspect wafers with 500 million micro bumps and support for Hybrid Bonding technology positions Camtek to capture a larger share of the high-end inspection market. This expands their total addressable market significantly, particularly in the premium segment where margins are typically higher. The combination of the new Hawk platform with the existing Eagle systems creates a comprehensive product portfolio that should strengthen Camtek's competitive position in the semiconductor inspection space.

This product launch carries substantial financial implications. The $50 million in initial orders, with more in the pipeline, provides strong revenue visibility for 2025. Given Camtek's current market cap of $3.26 billion, this single product line could contribute significantly to future growth. The expansion into previously unserved markets through enhanced capabilities suggests potential for margin expansion and market share gains.

The timing of deliveries throughout 2025 indicates a steady revenue stream, while the pre-launch orders demonstrate strong customer relationships and market confidence. The combination of the new Hawk platform with existing Eagle systems creates multiple revenue streams, potentially reducing business cyclicality and strengthening the company's market position.

The Hawk will be officially launched at Semicon Korea in February 2025

MIGDAL HAEMEK, Israel, Nov. 27, 2024 /PRNewswire/ -- Camtek Ltd. (NASDAQ: CAMT) (TASE: CAMT), today announced that it has received over $50 million in initial orders from several customers for its new Hawk product, with additional orders in the pipeline. These orders will be delivered throughout 2025.

Camtek Logo

The Hawk, based on a groundbreaking new platform, addresses high-end Advanced Packaging technologies including capabilities for inspection and 3D measurements of wafers with 500 million micro bumps and Hybrid Bonding technology. Offering significantly enhanced capabilities beyond the Eagle product line, the Hawk expands Camtek's total addressable market (TAM).

The Hawk product line addresses the industry's most demanding applications, including High Bandwidth Memory (HBM), Chiplet and Hybrid Bonding as well as use-cases previously unserved by Camtek. With unmatched throughput and precision, the Hawk platform is engineered to meet current and future industry roadmaps, setting a new benchmark for inspection and metrology.

The Hawk will be officially launched in February 2025 at Semicon Korea.

Rafi Amit, Camtek's CEO, commented: "Our new Hawk product line is an important addition to Camtek's portfolio and we are very pleased with the strong initial customer reception, as reflected by the over $50 million in orders received even before the official launch. These orders for the Hawk highlight the strong demand in the market for these solutions and reflect our customer's confidence in Camtek's products."

Continued Mr. Amit: "Together with the new, recently unveiled, Eagle G5 model, and the thousands of Eagle systems already installed at customer sites, we continue to address the variety of applications of our customers around the world. We remain committed to supporting our customers as we continue to deliver cutting-edge solutions."

For more information about Camtek Ltd. and its advanced inspection and metrology solutions, please visit www.camtek.com.

ABOUT CAMTEK LTD.

Camtek is a developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry. Camtek's systems inspect IC and measure IC features on wafers throughout the production process of semiconductor devices, covering the front and mid-end and up to the beginning of assembly (Post Dicing). Camtek's systems inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industry's leading global IDMs, OSATs, and foundries.

With manufacturing facilities in Israel and Germany, and eight offices around the world, Camtek provides state of the art solutions in line with customers' requirements.

This press release is available at www.camtek.com.

This press release contains statements that may constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based on Camtek's current beliefs, expectations and assumptions about its business and industry, all of which may change. Forward-looking statements can be identified by the use of words including "believe," "anticipate," "should," "intend," "plan," "will," "may," "expect," "estimate," "project," "positioned," "strategy," and similar expressions that are intended to identify forward-looking statements, including our expectations and statements relating to the compound semiconductors market and our position in this market and the anticipated timing of delivery of the systems. These forward-looking statements involve known and unknown risks and uncertainties that may cause the actual results, performance or achievements of Camtek to be materially different from any future results, performance or achievements expressed or implied by such forward-looking statements. Factors that may cause our actual results to differ materially from those contained in the forward-looking statements include, but are not limited to, the effects of the evolving nature of the war situation in Israel, and the related evolving regional conflicts; the continued demand and future contribution of HBM and Chiplet applications and devices to the Company business resulting from, among other things, the field of AI surging worldwide across companies, industries and nations; formal or informal imposition by countries of new or revised export and/or import and doing-business regulations or sanctions, including but not limited to changes in U.S. trade policies, changes or uncertainty related to the U.S. government entity list and changes in the ability to sell products incorporating U.S originated technology, which can be made without prior notice, and our ability to effectively address such global trade issues and changes; ; and those other factors discussed in our Annual Report on Form 20-F as published on March 21, 2024 as well as other documents filed by the Company with the SEC as well as other documents that may be subsequently filed by Camtek from time to time with the Securities and Exchange Commission. We caution you not to place undue reliance on forward-looking statements, which speak only as of the date hereof. Camtek does not assume any obligation to update any forward-looking statements in order to reflect events or circumstances that may arise after the date of this release unless required by law.

While we believe that we have a reasonable basis for each forward-looking statement contained in this press release, we caution you that these statements are based on a combination of facts and factors currently known by us and our projections of the future, about which we cannot be certain. In addition, any forward-looking statements represent Camtek's views only as of the date of this press release and should not be relied upon as representing its views as of any subsequent date. Camtek does not assume any obligation to update any forward-looking statements unless required by law.

Logo: https://mma.prnewswire.com/media/1534463/Camtek_logo.jpg

CAMTEK LTD.
Moshe Eisenberg, CFO
Tel: +972 4 604 8308
Mobile: +972 54 900 7100
moshee@camtek.com 

INTERNATIONAL INVESTOR RELATIONS
EK Global Investor Relations
Ehud Helft
Tel: (US) 1 212 378 8040
camtek@ekgir.com

Cision View original content:https://www.prnewswire.com/news-releases/camtek-receives-orders-for-over-50-million-for-its-new-product-line-hawk-302317423.html

SOURCE Camtek Ltd.

FAQ

What is the value of initial orders received for Camtek's (CAMT) new Hawk product line?

Camtek has received initial orders exceeding $50 million for its new Hawk product line.

When will Camtek (CAMT) officially launch the Hawk product line?

The Hawk product line will be officially launched in February 2025 at Semicon Korea.

What are the main applications of Camtek's (CAMT) new Hawk system?

The Hawk system addresses high-end Advanced Packaging technologies, including High Bandwidth Memory (HBM), Chiplet, Hybrid Bonding, and inspection and 3D measurements of wafers with 500 million micro bumps.

When will Camtek (CAMT) deliver the new Hawk orders?

The orders for the Hawk product line will be delivered throughout 2025.

Camtek Ltd

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Migdal Haemek