Broadcom Delivers On AI Infrastructure Vision with Industry-Leading Solutions at 2024 OCP Global Summit
Broadcom Inc. (NASDAQ: AVGO) announced its continued momentum in enabling AI infrastructure through open standards, scalability, and power-efficient solutions at the 2024 Open Compute Project (OCP) Global Summit. The company will showcase advancements in Ethernet, PCIe, and optical networking products designed for AI applications.
Key innovations to be featured include the Tomahawk 5 and Jericho3-AI Ethernet switches, Trident4-X11 Ethernet switch, Tomahawk 5 - Bailly CPO Ethernet switch, 400G PCIe Gen 5.0 Ethernet adapters, PCIe Gen 5.0 switches, PCI Express Gen5/Gen6 retimers, and Sian2 DSPs for AI clusters.
Broadcom will also participate in various talks and panel sessions, covering topics such as hardware management, cooling solutions for high-density AI clusters, optical power consumption reduction, and PCIe Gen 6 support in OCP NIC 3.0.
Broadcom Inc. (NASDAQ: AVGO) ha annunciato il suo continuo slancio nel rendere possibile l'infrastruttura AI attraverso standard aperti, scalabilità e soluzioni a basso consumo energetico durante il 2024 Open Compute Project (OCP) Global Summit. L'azienda presenterà i progressi nei prodotti di rete Ethernet, PCIe e di networking ottico progettati per applicazioni AI.
Tra le principali innovazioni in mostra ci saranno gli switch Ethernet Tomahawk 5 e Jericho3-AI, lo switch Ethernet Trident4-X11, lo switch Ethernet CPO Tomahawk 5 - Bailly, adattatori Ethernet PCIe Gen 5.0 a 400G, switch PCIe Gen 5.0, ritimer PCI Express Gen5/Gen6, e Sian2 DSPs per cluster AI.
Broadcom parteciperà anche a diverse conferenze e sessioni di panel, trattando argomenti quali la gestione dell'hardware, soluzioni di raffreddamento per cluster AI ad alta densità, riduzione del consumo energetico ottico e supporto per PCIe Gen 6 in OCP NIC 3.0.
Broadcom Inc. (NASDAQ: AVGO) anunció su continuo impulso para habilitar la infraestructura de IA a través de estándares abiertos, escalabilidad y soluciones de bajo consumo energético en la cumbre global del Open Compute Project (OCP) 2024. La empresa mostrará avances en productos de red Ethernet, PCIe y de red óptica diseñados para aplicaciones de IA.
Las innovaciones clave que se presentarán incluyen los interruptores Ethernet Tomahawk 5 y Jericho3-AI, el interruptor Ethernet Trident4-X11, el interruptor Ethernet CPO Tomahawk 5 - Bailly, adaptadores Ethernet PCIe Gen 5.0 de 400G, interruptores PCIe Gen 5.0, retimers PCI Express Gen5/Gen6, y Sian2 DSPs para clústeres de IA.
Broadcom también participará en varias charlas y sesiones de panel, cubriendo temas como gestión de hardware, soluciones de refrigeración para clústeres de IA de alta densidad, reducción del consumo de energía óptica y soporte para PCIe Gen 6 en OCP NIC 3.0.
Broadcom Inc. (NASDAQ: AVGO)는 2024 Open Compute Project (OCP) 글로벌 정상 회담에서 개방형 표준, 확장성, 전력 효율적인 솔루션을 통해 AI 인프라를 가능하게 하는 지속적인 추진력을 발표했습니다. 이 회사는 AI 애플리케이션을 위해 설계된 Ethernet, PCIe, 그리고 광 네트워킹 제품에서의 발전을 선보일 예정입니다.
주요 혁신으로는 Tomahawk 5 및 Jericho3-AI 이더넷 스위치, Trident4-X11 이더넷 스위치, Tomahawk 5 - Bailly CPO 이더넷 스위치, 400G PCIe Gen 5.0 이더넷 어댑터, PCIe Gen 5.0 스위치, PCI Express Gen5/Gen6 리타이머 및 AI 클러스터용 Sian2 DSPs가 포함됩니다.
Broadcom은 또한 하드웨어 관리, 고밀도 AI 클러스터를 위한 냉각 솔루션, 광 전력 소비 감소, OCP NIC 3.0의 PCIe Gen 6 지원과 같은 주제를 다룬 다양한 강연 및 패널 세션에 참석할 것입니다.
Broadcom Inc. (NASDAQ: AVGO) a annoncé son élan continu pour permettre l'infrastructure AI grâce à des normes ouvertes, à l'évolutivité et à des solutions économes en énergie lors du sommet mondial du projet Open Compute (OCP) 2024. L'entreprise présentera ses avancées dans les produits de mise en réseau Ethernet, PCIe et de réseau optique conçus pour les applications d'IA.
Les innovations clés qui seront mises en avant incluent les commutateurs Ethernet Tomahawk 5 et Jericho3-AI, le commutateur Ethernet Trident4-X11, le commutateur Ethernet CPO Tomahawk 5 - Bailly, des adaptateurs Ethernet PCIe Gen 5.0 à 400G, des commutateurs PCIe Gen 5.0, des retimers PCI Express Gen5/Gen6, et des Sian2 DSPs pour clusters IA.
Broadcom participera également à diverses conférences et sessions de panel, abordant des sujets tels que la gestion du matériel, les solutions de refroidissement pour les clusters AI à haute densité, la réduction de la consommation d'énergie optique et le support de PCIe Gen 6 dans OCP NIC 3.0.
Broadcom Inc. (NASDAQ: AVGO) gab auf dem 2024 Open Compute Project (OCP) Global Summit bekannt, dass das Unternehmen weiterhin in der Bereitstellung von AI-Infrastruktur durch offene Standards, Skalierbarkeit und energieeffiziente Lösungen Fortschritte macht. Das Unternehmen wird Fortschritte in Ethernet, PCIe und optischen Netzwerkprodukten präsentieren, die für AI-Anwendungen entwickelt wurden.
Zu den wichtigsten Innovationen, die vorgestellt werden, gehören die Tomahawk 5 und Jericho3-AI Ethernet-Switches, der Trident4-X11 Ethernet-Switch, der Tomahawk 5 - Bailly CPO Ethernet-Switch, 400G PCIe Gen 5.0 Ethernet-Adapter, PCIe Gen 5.0 Switches, PCI Express Gen5/Gen6 Retimer und Sian2 DSPs für AI-Cluster.
Broadcom wird auch an verschiedenen Vorträgen und Podiumsdiskussionen teilnehmen, die Themen wie Hardwareverwaltung, Kühlungslösungen für hochdichte AI-Cluster, Reduzierung des optischen Stromverbrauchs und Unterstützung von PCIe Gen 6 im OCP NIC 3.0 behandeln.
- Showcasing cutting-edge AI infrastructure solutions at the 2024 OCP Global Summit
- Introducing power-efficient and high-performance connectivity solutions for expanding AI clusters
- Presenting innovations in Ethernet switches, PCIe technologies, and optical networking products tailored for AI applications
- Participating in key talks and technical panels to share expertise on AI infrastructure solutions
- None.
Open Ecosystem, Scalability, and Power Efficiency are Key to Equipping Partners with State-of-the-Art AI Technology
PALO ALTO, Calif., Oct. 08, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced that momentum continues to build in support of its vision of enabling AI infrastructure through a combination of open standards, scalability, and power efficient solutions. Broadcom will highlight advancements across the areas via a series of presentations, product demonstrations, and other forums at the 2024 Open Compute Project (OCP) Global Summit. The 2024 Summit takes place in San Jose, Calif. from Oct. 15-17. Highlights regarding Broadcom’s participation in this year’s Global Summit can be found here.
“AI is at an inflection point in our industry that will change our lives and the way we work,” said Charlie Kawwas, Ph. D., president, Semiconductor Solutions Group, Broadcom. “At Broadcom, we are on the front lines of this historic moment, pushing boundaries and pioneering breakthroughs in networking and connectivity to enable open, scalable and power efficient AI infrastructure. We are excited to showcase our products at the OCP Global Summit in collaboration with our partners who share our vision for enabling AI.”
As AI clusters expand to a million nodes, managing energy consumption becomes crucial, necessitating power-efficient and high-performance connectivity solutions. Further, open standards like Ethernet and PCIe play a vital role offering interoperable and time-to-market solutions for the rapidly growing AI infrastructure market.
At this year’s summit, Broadcom will showcase several innovations that power its comprehensive portfolio of Ethernet, Ethernet NIC Adapters, Co-Packaged Optics (CPO), PCIe switches and retimers, and Sian2 optical networking products. Broadcom’s AI architects and engineers will also deliver key talks and technical panels covering topics across our broad AI infrastructure solutions. The final agenda will be available here.
At the summit several cutting-edge AI solutions will be featured including:
- Ethernet networking switches like the Tomahawk 5 and Jericho3-AI designed to accelerate AI/ML workloads.
- The Trident4-X11 Ethernet switch engineered to create the front-end fabric that interfaces with the back-end AI fabric.
- Tomahawk 5 - Bailly, the world's leading 51.2 Tbps CPO Ethernet switch, which combines advanced silicon photonics CPO technology with Broadcom's Tomahawk 5 switch chip, setting a new benchmark for power efficiency and performance in AI infrastructure.
- High-performance, low-power 400G PCIe Gen 5.0 Ethernet adapters, developed as open, standards-based solutions to address connectivity challenges as XPU bandwidth increases and AI data center clusters expand.
- PCIe Gen 5.0 switches, which are the open, standards-based fabric of choice for AI connectivity; drawing half the power of alternatives, with industry leading SerDes, telemetry and diagnostics.
- The industry's first PCI Express Gen5/Gen6 retimers, offering ultra-low power solutions to enhance efficiency and scalability in AI infrastructure.
- Sian and Sian2 DSPs, supporting 200G/lane pluggable modules for connecting next-generation AI clusters.
Broadcom’s talks and panel events are designed to give the audience a peek into the technology behind our vision to enable AI infrastructure. Key talks and technical panel sessions at this year’s summit include:
- An Overview of Work Streams of Hardware Management Projects, Hemal Shah, distinguished engineer and architect, Broadcom and Jeff Autor, distinguished technologist, Hewlett Packard Enterprise, Weds, Oct. 16, 8:00am – 8:20am, Concourse Level - 210CG.
- Best Practices for Liquid & Air Cooling of a 51.2Tbps Switch for High-Density AI Clusters, Henry Wu, technical director, Broadcom, and Fangbo Zhu, senior thermal export, Alibaba, Weds, Oct. 16, 8:00am - 8:20am, Lower Level - LL20A.
- Standards Update: Reducing Optical Power Consumption, Karl Muth, hardware engineer, Broadcom and Nathan Tracy, member of the board, TE Connectivity, Weds, Oct. 16, 8:40am - 9:00am, Concourse Level 220 - C.
- Orchestration Needs with SONiC for AI Clusters, Kamini Santhanagopalan, product marketing engineer, Broadcom and Dan Hanson, director AI networking product management, Supermicro, Weds, Oct. 16, 10:40am -11:00am, Concourse Level - 220B.
- Introducing the SPDM Authorization Specification, Brett Henning, firmware engineer, Broadcom, Raghu Krishnamurthy, principal security architect, NVIDIA, and Scott Phuong, principal software engineer, Microsoft, Weds, Oct. 16, 1:30pm - 1:50pm, Concourse Level - 220C.
- OCP NIC 3.0: PCIe Gen 6 Support with Next Generation SI and Thermal Test Fixtures, Hemal Shah, distinguished engineer and architect, Broadcom, and Jason Rock, distinguished member of technical staff, and Jon Lewis, distinguished engineer, Dell, Weds, Oct. 16, 1:50pm - 2:10pm, Concourse Level - 210CG.
- Link Delay Measurement with P2P TC, Bhaskar Chinni, principal product line manager, and Amit Oren, distinguished engineer, architect and technology, Broadcom, Thurs, Oct. 17, 10:45am - 11:00am, Lower Level - LL20A.
About Broadcom
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops, and supplies a broad range of semiconductor, enterprise software and security solutions. Broadcom's category-leading product portfolio serves critical markets including cloud, data center, networking, broadband, wireless, storage, industrial, and enterprise software. Our solutions include service provider and enterprise networking and storage, mobile device and broadband connectivity, mainframe, cybersecurity, and private and hybrid cloud infrastructure. Broadcom is a Delaware corporation headquartered in Palo Alto, CA. For more information, go to www.broadcom.com.
Broadcom, the pulse logo, and Connecting Everything are among the trademarks of Broadcom. The term "Broadcom" refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners.
Press Contact:
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press.relations@broadcom.com
Telephone: +1 310 498 5254
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