Broadcom Advances Optical Connectivity for AI Infrastructure with Industry-Leading Solutions at OFC 2025
Broadcom (NASDAQ: AVGO) has announced an expansion of its optical interconnect solutions portfolio for AI infrastructure at OFC 2025. The company showcased innovative technologies targeting 200T optical interconnect solutions, including:
- XPU-CPO: First 6.4-Tbps optics attach for AI accelerators
- Sian3: 3nm 200G/lane DSP for 800G and 1.6T optical transceivers
- Sian2M: First 200G/lane DSP with integrated VCSEL drivers
- 400G EML technology for next-gen AI interconnects
- PCIe Gen6 over Optics for AI scale-up fabric
These advancements aim to address increasing AI workload demands through higher bandwidth, lower latency, and improved power efficiency in optical interconnects. Broadcom is collaborating with over 15 partners and presenting multiple technical sessions at the conference in San Francisco.
Broadcom (NASDAQ: AVGO) ha annunciato un'espansione del suo portafoglio di soluzioni di interconnessione ottica per infrastrutture AI all'OFC 2025. L'azienda ha presentato tecnologie innovative mirate a soluzioni di interconnessione ottica da 200T, tra cui:
- XPU-CPO: Prima ottica da 6,4 Tbps per acceleratori AI
- Sian3: DSP da 3nm 200G/lane per trasceiver ottici da 800G e 1,6T
- Sian2M: Primo DSP da 200G/lane con driver VCSEL integrati
- Tecnologia EML da 400G per interconnessioni AI di nuova generazione
- PCIe Gen6 su ottica per tessuti di scalabilità AI
Questi progressi mirano a soddisfare le crescenti richieste di carico di lavoro AI attraverso una maggiore larghezza di banda, una latenza ridotta e un miglioramento dell'efficienza energetica nelle interconnessioni ottiche. Broadcom sta collaborando con oltre 15 partner e presentando diverse sessioni tecniche alla conferenza di San Francisco.
Broadcom (NASDAQ: AVGO) ha anunciado una expansión de su cartera de soluciones de interconexión óptica para infraestructura de IA en el OFC 2025. La empresa mostró tecnologías innovadoras dirigidas a soluciones de interconexión óptica de 200T, que incluyen:
- XPU-CPO: Primera óptica de 6.4 Tbps para aceleradores de IA
- Sian3: DSP de 3nm 200G/lane para transceptores ópticos de 800G y 1.6T
- Sian2M: Primer DSP de 200G/lane con controladores VCSEL integrados
- Tecnología EML de 400G para interconexiones de IA de nueva generación
- PCIe Gen6 sobre Ópticas para tejido de escalado de IA
Estos avances tienen como objetivo abordar las crecientes demandas de carga de trabajo de IA a través de un mayor ancho de banda, menor latencia y mejor eficiencia energética en las interconexiones ópticas. Broadcom está colaborando con más de 15 socios y presentando múltiples sesiones técnicas en la conferencia en San Francisco.
Broadcom (NASDAQ: AVGO)는 OFC 2025에서 AI 인프라를 위한 광 연결 솔루션 포트폴리오의 확장을 발표했습니다. 이 회사는 200T 광 연결 솔루션을 목표로 하는 혁신적인 기술을 선보였습니다. 포함된 내용은:
- XPU-CPO: AI 가속기를 위한 최초의 6.4 Tbps 광학 연결
- Sian3: 3nm 200G/lane DSP로 800G 및 1.6T 광 트랜시버 지원
- Sian2M: 통합 VCSEL 드라이버를 갖춘 최초의 200G/lane DSP
- 차세대 AI 연결을 위한 400G EML 기술
- AI 확장을 위한 PCIe Gen6 오버 옵틱스
이러한 발전은 광 연결에서 더 높은 대역폭, 낮은 지연 시간 및 개선된 전력 효율성을 통해 증가하는 AI 작업 부하 수요를 해결하는 것을 목표로 합니다. Broadcom은 15개 이상의 파트너와 협력하고 샌프란시스코에서 열리는 회의에서 여러 기술 세션을 발표하고 있습니다.
Broadcom (NASDAQ: AVGO) a annoncé une expansion de son portefeuille de solutions d'interconnexion optique pour l'infrastructure AI lors de l'OFC 2025. L'entreprise a présenté des technologies innovantes visant des solutions d'interconnexion optique de 200T, y compris :
- XPU-CPO : Première optique de 6,4 Tbps pour les accélérateurs AI
- Sian3 : DSP 3nm 200G/lane pour transceivers optiques de 800G et 1,6T
- Sian2M : Premier DSP 200G/lane avec pilotes VCSEL intégrés
- Technologie EML 400G pour les interconnexions AI de nouvelle génération
- PCIe Gen6 sur optique pour l'évolutivité AI
Ces avancées visent à répondre aux demandes croissantes de charge de travail AI grâce à une bande passante plus élevée, une latence réduite et une meilleure efficacité énergétique dans les interconnexions optiques. Broadcom collabore avec plus de 15 partenaires et présente plusieurs sessions techniques lors de la conférence à San Francisco.
Broadcom (NASDAQ: AVGO) hat auf der OFC 2025 eine Erweiterung seines Portfolios an optischen Interconnect-Lösungen für KI-Infrastrukturen angekündigt. Das Unternehmen stellte innovative Technologien vor, die auf 200T optische Interconnect-Lösungen abzielen, darunter:
- XPU-CPO: Erste 6,4-Tbps-Optik für KI-Beschleuniger
- Sian3: 3nm 200G/lane DSP für 800G und 1,6T optische Transceiver
- Sian2M: Erster 200G/lane DSP mit integrierten VCSEL-Treibern
- 400G EML-Technologie für nächste Generation von KI-Interconnects
- PCIe Gen6 über Optik für KI-Skalierungsgewebe
Diese Fortschritte zielen darauf ab, die steigenden Anforderungen an KI-Arbeitslasten durch höhere Bandbreite, geringere Latenz und verbesserte Energieeffizienz in optischen Interconnects zu bewältigen. Broadcom arbeitet mit über 15 Partnern zusammen und präsentiert auf der Konferenz in San Francisco mehrere technische Sitzungen.
- First-to-market advantage with multiple industry-first technologies in AI optical interconnects
- Comprehensive portfolio addressing growing AI infrastructure demands
- Strong partnership ecosystem with 15+ collaborating companies
- Advanced 3nm technology deployment in Sian3 DSP
- None.
Insights
Broadcom's showcase at OFC 2025 demonstrates significant strategic positioning in the booming AI infrastructure market with multiple industry-first optical interconnect solutions. The company is addressing critical AI connectivity bottlenecks with innovations that enable higher bandwidth, lower latency, and improved power efficiency - all essential requirements as AI workloads continue to grow exponentially.
The unveiling of XPU-CPO (6.4-Tbps optics attach for AI accelerators) and Sian3 (3nm 200G/lane DSP) represents meaningful technical leadership in crucial AI infrastructure components. These innovations effectively tackle the connectivity challenges that currently limit AI cluster scaling, particularly in power consumption and signal integrity at high data rates.
Notably, Broadcom is targeting the complete AI connectivity ecosystem with solutions for both front-end and back-end networks through its 200G/lane laser technologies and PCIe Gen6 optical connectivity innovations. The company's collaboration with 15+ industry partners indicates strong ecosystem acceptance and potential for widespread adoption.
While the financial impact timeline remains undefined, these developments strengthen Broadcom's competitive positioning in the rapidly growing optical connectivity segment of AI infrastructure. The company's emphasis on both performance and power efficiency directly addresses the most pressing constraints in hyperscale AI deployments, potentially capturing significant share as the market expands toward 200T optical interconnect solutions.
Broadcom showcases optical interconnect solutions for next generation AI clusters; Highlights path to 200T
PALO ALTO, Calif., March 31, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the expansion of its portfolio of optical interconnect solutions to enable AI infrastructure. These innovative technologies, including advancements in co-packaged optics (CPO), 200G/lane DSP and SerDes, 400G optics, and PCIe Gen6 over optics, will be showcased at the 2025 Optical Fiber Communications Conference and Exhibition (OFC). Broadcom’s demonstrations highlight the company’s roadmap towards 200T optical interconnect solutions.
AI workloads are rapidly increasing, driving the need for higher bandwidth, lower latency, and more power-efficient optical interconnects. Broadcom is meeting these evolving demands with a comprehensive portfolio of innovative solutions designed to support the growth and scalability of AI clusters. These solutions include low-power, high-bandwidth DSP, SerDes and CPO for reduced power consumption and improved signal integrity, and PCIe Gen6 over optics for enhanced connectivity between AI accelerators and other system components.
At OFC, Broadcom is showcasing a wide range of novel technologies underscoring our commitment to developing cutting-edge solutions for AI infrastructure:
- XPU-CPO: Industry’s first 6.4-Tbps optics attach for custom AI accelerator (XPU) enabling high bandwidth, long reach scale-up fabric connectivity for AI servers.
- Sian3: State-of-the-art 3nm 200G/lane DSP delivering industry’s lowest power consumption with enhanced performance for 800G and 1.6T optical transceivers over SMF.
- Sian2M: Industry’s first 200G/lane DSP with integrated VCSEL drivers enabling low power, short reach MMF links in AI clusters.
- 200G/lane Lasers: Leading-edge 200G VCSEL, EML and CWL technologies facilitating high speed interconnects for front-end and back-end networks of large-scale AI clusters.
- 400G EML: Industry’s first demonstration of 400G EML technology for next-generation AI optical interconnects.
- PCIe Gen6 over Optics: Industry’s first demonstration of PCIe Gen6 optical connectivity for AI scale-up fabric using Broadcom’s market-proven 100G VCSEL and photodetector.
- LPO / BCM957608 NIC: Industry-leading 400G PCIe Ethernet NIC connecting with LPO module to enable scalable AI networks with high performance and efficiency.
- Co-Packaged & Near-Packaged Copper: State-of-the-art 200G/lane copper link solutions enabling cost-effective, high-bandwidth connectivity in emerging AI architectures.
- 7m+ AEC for 800G: Industry’s first 800G AEC retimer solution extending DAC cable reach beyond 7 meters.
“OFC’s 50th anniversary provides the opportunity to recognize the industry’s many achievements, including Broadcom’s industry-first contributions to this field,” said Charlie Kawwas, Ph. D., President, Semiconductor Solutions Group, Broadcom. “A year ago, Broadcom committed to pushing technical boundaries to pioneer new open, scalable and power-efficient technologies to enable AI infrastructure. Our portfolio of optical interconnect solutions, highlighted at OFC 2025, paves the way to 200T by addressing the performance, power, and scalability challenges of AI clusters.”
In addition, Broadcom is collaborating with more than 15 partners to demonstrate a wide array of its industry-leading solutions across the show floor. Throughout the conference, Broadcom is speaking on the technical challenges and advancements in optical networking and communications. Key talks and technical panel sessions this year include:
- High Power and Multi-Wavelength Laser Light Sources: How Can They Address the Needs of AI/ML Interconnect?, Sunday, March 30, 1:00pm – 3:30pm, Room 215.
- How Do Co-Packaged Optics Become Manufacturable?, Sunday, March 30, 4:00pm – 6:30pm, Rooms 203-204.
- Short and Sweet: How Do We Cost-Optimize a 10-Meter Link for Scaling Up Machine Learning Clusters?, Sunday, March 30, 4:00pm – 6:30pm, Rooms 211-212.
- Towards 400G/λ IM-DD: How to Pick up the Next Factor of 2?, Sunday March 30, 4:00pm – 6:30pm, Rooms 213-214.
- The Evolution from Copper to Optical – Where is the line?, Monday, March 31, 1:00pm – 2:00pm, Optica Executive Forum.
- Optimized Interconnect for AI Scale-Out and Scale-Up, Tuesday April 1, 12:15pm – 12:45pm, Expo Theater III.
- Modular Structures with EML Thin Film LN and Ring-Based, Tuesday, April 1, 2:00pm – 4:00pm, Room 301.
The 2025 conference takes place in San Francisco from March 30 to April 3. To learn more about these technical speaking sessions, joint partner demonstrations, technology showcases, key Broadcom news, and other activities at OFC, please visit here.
About Broadcom
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops, and supplies a broad range of semiconductor, enterprise software and security solutions. Broadcom's category-leading product portfolio serves critical markets including cloud, data center, networking, broadband, wireless, storage, industrial, and enterprise software. Our solutions include service provider and enterprise networking and storage, mobile device and broadband connectivity, mainframe, cybersecurity, and private and hybrid cloud infrastructure. Broadcom is a Delaware corporation headquartered in Palo Alto, CA. For more information, go to www.broadcom.com.
Broadcom, the pulse logo, and Connecting Everything are among the trademarks of Broadcom. The term "Broadcom" refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners.
Press Contact:
Khanh Lam
Global Communications
press.relations@broadcom.com
Telephone: +1 408 433 8649
