Broadcom Extends 200G/lane DSP PHY Leadership for Next-Generation AI Infrastructure
Broadcom (NASDAQ: AVGO) has expanded its 200G/lane DSP PHY portfolio with two new products: Sian3 and Sian2M, designed for AI/ML cluster connectivity. The Sian3, a 3nm PAM4 DSP PHY, delivers over 20% power reduction for 1.6T optical modules, while Sian2M specializes in short-reach MMF links with integrated VCSEL drivers.
These innovations address increasing bandwidth demands in AI infrastructure, with Sian3 enabling sub-13W 800G and sub-23W 1.6T transceivers. Broadcom's technology builds on its successful deployment of over 50 million channels of 100G VCSELs in AI networks. The company is currently sampling both products to early access customers, with Sian3 production scheduled to ramp up in Q3 2025.
According to LightCounting, 1.6T optical transceivers are expected to consume more than $1 billion worth of PAM4 DSPs by 2028.
Broadcom (NASDAQ: AVGO) ha ampliato il suo portafoglio di DSP PHY a 200G/lane con due nuovi prodotti: Sian3 e Sian2M, progettati per la connettività dei cluster AI/ML. Il Sian3, un DSP PHY PAM4 a 3nm, offre oltre il 20% di riduzione del consumo energetico per i moduli ottici da 1.6T, mentre Sian2M è specializzato in collegamenti MMF a breve distanza con driver VCSEL integrati.
Queste innovazioni rispondono alle crescenti esigenze di larghezza di banda nelle infrastrutture AI, con Sian3 che consente transceiver da 800G a meno di 13W e transceiver da 1.6T a meno di 23W. La tecnologia di Broadcom si basa sul suo successo nel dispiegamento di oltre 50 milioni di canali di VCSEL a 100G nelle reti AI. L'azienda sta attualmente campionando entrambi i prodotti ai clienti in accesso anticipato, con la produzione di Sian3 programmata per aumentare nel terzo trimestre del 2025.
Secondo LightCounting, si prevede che i transceiver ottici da 1.6T consumeranno più di 1 miliardo di dollari di DSP PAM4 entro il 2028.
Broadcom (NASDAQ: AVGO) ha ampliado su cartera de DSP PHY de 200G/lane con dos nuevos productos: Sian3 y Sian2M, diseñados para la conectividad de clústeres AI/ML. El Sian3, un DSP PHY PAM4 de 3nm, ofrece más del 20% de reducción de potencia para módulos ópticos de 1.6T, mientras que Sian2M se especializa en enlaces MMF de corto alcance con controladores VCSEL integrados.
Estas innovaciones abordan las crecientes demandas de ancho de banda en la infraestructura de IA, con Sian3 permitiendo transceptores de 800G por debajo de 13W y transceptores de 1.6T por debajo de 23W. La tecnología de Broadcom se basa en su exitosa implementación de más de 50 millones de canales de VCSEL de 100G en redes de IA. La empresa actualmente está muestreando ambos productos a clientes de acceso anticipado, con la producción de Sian3 programada para aumentar en el tercer trimestre de 2025.
Según LightCounting, se espera que los transceptores ópticos de 1.6T consuman más de 1 mil millones de dólares en DSP PAM4 para 2028.
Broadcom (NASDAQ: AVGO)는 AI/ML 클러스터 연결을 위해 설계된 두 가지 새로운 제품인 Sian3 및 Sian2M으로 200G/lane DSP PHY 포트폴리오를 확장했습니다. Sian3는 3nm PAM4 DSP PHY로, 1.6T 광 모듈에 대해 20% 이상의 전력 절감을 제공합니다. 한편, Sian2M은 통합 VCSEL 드라이버와 함께 짧은 거리 MMF 링크에 특화되어 있습니다.
이러한 혁신은 AI 인프라에서 증가하는 대역폭 요구를 해결하며, Sian3는 800G에서 13W 미만과 1.6T에서 23W 미만의 트랜시버를 가능하게 합니다. Broadcom의 기술은 AI 네트워크에서 100G VCSEL의 5천만 개 이상의 채널을 성공적으로 배포한 데 기반하고 있습니다. 현재 회사는 조기 액세스 고객에게 두 제품을 샘플링하고 있으며, Sian3의 생산은 2025년 3분기에 증가할 예정입니다.
LightCounting에 따르면, 1.6T 광 트랜시버는 2028년까지 10억 달러 이상의 PAM4 DSP를 소비할 것으로 예상됩니다.
Broadcom (NASDAQ: AVGO) a élargi son portefeuille de DSP PHY à 200G/lane avec deux nouveaux produits : Sian3 et Sian2M, conçus pour la connectivité des clusters AI/ML. Le Sian3, un DSP PHY PAM4 de 3 nm, offre plus de 20 % de réduction de puissance pour les modules optiques de 1,6T, tandis que Sian2M est spécialisé dans les liaisons MMF à courte portée avec des pilotes VCSEL intégrés.
Ces innovations répondent aux demandes croissantes de bande passante dans l'infrastructure AI, Sian3 permettant des transceivers de 800G à moins de 13W et des transceivers de 1,6T à moins de 23W. La technologie de Broadcom repose sur son déploiement réussi de plus de 50 millions de canaux de VCSEL à 100G dans les réseaux AI. L'entreprise échantillonne actuellement les deux produits pour des clients en accès anticipé, la production de Sian3 devant augmenter au troisième trimestre 2025.
Selon LightCounting, les transceivers optiques de 1,6T devraient consommer plus d'un milliard de dollars de DSP PAM4 d'ici 2028.
Broadcom (NASDAQ: AVGO) hat sein Portfolio an 200G/lane DSP PHY mit zwei neuen Produkten erweitert: Sian3 und Sian2M, die für die Konnektivität von AI/ML-Clustern entwickelt wurden. Der Sian3, ein 3nm PAM4 DSP PHY, bietet eine Einsparung von über 20% beim Stromverbrauch für 1,6T optische Module, während Sian2M sich auf Kurzstrecken-MMF-Verbindungen mit integrierten VCSEL-Treibern spezialisiert.
Diese Innovationen reagieren auf die steigenden Bandbreitenanforderungen in der AI-Infrastruktur, wobei Sian3 800G-Transceiver mit weniger als 13W und 1,6T-Transceiver mit weniger als 23W ermöglicht. Die Technologie von Broadcom basiert auf der erfolgreichen Bereitstellung von über 50 Millionen Kanälen von 100G VCSELs in AI-Netzwerken. Das Unternehmen bietet derzeit beiden Produkte für Frühzugangskunden an, wobei die Produktion von Sian3 im dritten Quartal 2025 hochgefahren werden soll.
Laut LightCounting wird erwartet, dass 1,6T optische Transceiver bis 2028 mehr als 1 Milliarde Dollar an PAM4 DSPs verbrauchen werden.
- 20% power reduction achievement in 1.6T optical modules with Sian3
- Strong market position with over 50M channels of 100G VCSELs deployed
- Projected $1B+ market opportunity in PAM4 DSPs by 2028
- 200G EML already shipping in volume production
- Production ramp-up not starting until Q3 2025
- Currently to sampling phase with early access customers
Insights
Broadcom's expansion of its 200G/lane DSP PHY portfolio showcases a strategic positioning in the rapidly growing AI connectivity market. The introduction of Sian3 and Sian2M addresses a critical bottleneck in AI infrastructure scaling – power consumption in optical interconnects.
The 3nm Sian3 achieving
Broadcom's vertical integration approach – developing both the DSP chips and optical components (200G/lane lasers, VCSELs) – enables optimization across the entire solution stack. This integration creates barriers to entry while accelerating time-to-market for module developers.
The market opportunity is substantial, with LightCounting projecting 1.6T optical transceivers consuming
With production ramping in Q3 2025, this represents a near-term catalyst supporting Broadcom's continued momentum in AI-driven semiconductor applications.
Sian3: State-of-the-art 3nm DSP PHY delivers industry’s lowest power consumption with enhanced performance for 800G and 1.6T optical transceivers over SMF
Sian2M: Industry’s first 200G/lane DSP with integrated VCSEL drivers enables low-power short-reach MMF links in AI clusters
PALO ALTO, Calif., March 25, 2025 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the expansion of its industry-leading 200G/lane DSP PHY portfolio with the introduction of Sian3 and Sian2M, purpose-built for the demanding connectivity requirements of AI/ML clusters. These innovations address the critical need for optimized power across both single-mode fiber (SMF) and short-reach multi-mode fiber (MMF) links in 800G and 1.6T optical transceiver applications.
The rapid growth of AI workloads is driving demand for increased bandwidth and interconnect density in AI clusters. Optical interconnect power is a major factor limiting cluster scalability. Broadcom's new Sian3 and Sian2M DSPs, along with its comprehensive portfolio of 200G/lane lasers, provide unprecedented levels of power efficiency and cost optimization for next-generation AI infrastructure.
Sian3, a state-of-the-art 3nm 200G/lane PAM4 DSP PHY, delivers the industry's lowest power consumption for 800G and 1.6T optical transceivers utilizing SMF. Sian3 builds upon the success of Broadcom’s Sian2 DSP, enabling over
Sian2M offers a specialized, optimized solution for 800G and 1.6T short-reach MMF links within AI clusters. By integrating VCSEL drivers and leveraging Broadcom's market-proven 200G VCSEL technology, Sian2M unlocks new levels of performance and efficiency for short-reach connectivity. This technology builds on Broadcom's established track record in optical interconnects, having successfully deployed over 50 million channels of 100G VCSELs in AI networks.
Broadcom's Sian3 and Sian2M DSP PHYs, developed in conjunction with its portfolio of 200G/lane EML and CWL lasers and its market-proven VCSELs, empower module developers to rapidly address the growing demand for 200G optics in AI. Broadcom's 200G EML and PD are already shipping in volume, delivering the quality, reliability, and performance required for AI optical interconnects.
“Broadcom's Sian family of DSP PHYs is foundational to the low-power, high-bandwidth optical connectivity needed for AI/ML clusters,” said Vijay Janapaty, vice president and general manager of the Physical Layer Products Division at Broadcom. “Our new 3nm Sian3 delivers over
“According to our recent report Markets for PAM4 and Coherent DSPs, AI-infrastructure build outs are driving massive growth in PAM4 DSP shipments,” said Bob Wheeler, Analyst at Large, LightCounting. “By 2028, we expect 1.6T optical transceivers will consume more than
Solution Highlights
Sian3 DSP
- Low power 3nm 200G/lane DSP for sub-13W 800G and sub-23W 1.6T transceivers
- 1.6T retimer PHY (BCM83628) and 800G gearbox PHY (BCM83820) options available
- Supports 212.5-Gb/s and 226.875-Gb/s data rates for InfiniBand and Ethernet
- Multiple FEC options, including Bypass, Segmented, and Concatenated FEC
- IEEE 802.3dj D1.3 compliant
- Integrated low-swing and high-swing laser drivers for SiP and EML modules
- Sub-75ns roundtrip latency for AI/ML
- Client-side SERDES supporting long-reach (LR) applications
- Crossbar support on client and line side
Sian2M DSP
- Low power 5nm 200G/lane DSP for sub-25W 1.6T SR8 transceivers
- 800G retimer PHY (BCM85834) supporting both 800G and 1.6T pluggable modules
- Multiple FEC options, including Bypass and Segmented FEC
- Integrated VCSEL driver
- Crossbar support
200G/lane Lasers
- Industry’s first 200G VCSEL, supporting the planned IEEE 802.3dj standards
- Broadcom VCSEL technology with >5 trillion field device hours and <1 FIT failure rate
- 200G EML in production, with millions of units shipped
"As the demand for high-speed, energy-efficient connectivity continues to rise, integrating Broadcom’s Sian3 and Sian2M into our transceivers allows us to deliver industry-leading performance with significant cost and power savings,” said Richard Huang, CEO, Eoptolink Technology. “By combining these advanced DSPs with our own engineering expertise, we are driving innovation across the ecosystem—enabling scalable, high-density optical connectivity that meets the evolving demands of next-generation AI infrastructure while lowering total cost of ownership.”
Availability
Broadcom is sampling Sian3 (BCM83628 and BCM83820) and Sian2M (BCM85834) to early access customers and partners, with Sian3 production ramping in Q3 2025. Contact your local Broadcom sales representative for samples and pricing.
About Broadcom
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops, and supplies a broad range of semiconductor, enterprise software and security solutions. Broadcom's category-leading product portfolio serves critical markets including cloud, data center, networking, broadband, wireless, storage, industrial, and enterprise software. Our solutions include service provider and enterprise networking and storage, mobile device and broadband connectivity, mainframe, cybersecurity, and private and hybrid cloud infrastructure. Broadcom is a Delaware corporation headquartered in Palo Alto, CA. For more information, go to www.broadcom.com.
Broadcom, the pulse logo, and Connecting everything are among the trademarks of Broadcom. The term "Broadcom" refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners.
Press Contact:
Khanh Lam
Global Communications
press.relations@broadcom.com
Telephone: +1 408 433 8649
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