Broadcom Debuts Industry’s First 5nm ASIC for Data Center and Cloud Infrastructure

Rhea-AI Summary

Broadcom Inc. (NASDAQ: AVGO) has announced the sampling of its 5nm ASIC device designed for data center and cloud infrastructure.

Utilizing TSMC’s N5 process, this 625 mm² device features state-of-the-art technology like PCIe Gen5, 112-Gbps SerDes, and HBM2e memory. The 5nm platform demonstrates a substantial increase in computational capacity (2x) and memory bandwidth (2x to 4x) compared to previous generations, while also reducing power consumption by up to 30%. The launch targets advancements in AI, HPC, and 5G wireless infrastructure.

Positive

• First-to-market 5nm ASIC enhances Broadcom's position in embedded SoC leadership.
• 2x increase in on-die computation for training and inference applications.
• 2x to 4x increase in memory bandwidth with HBM2e and HBM3 PHY.
• 30% reduction in power for given work function.
• Cost-effective with advanced packaging solutions.

Negative

• None.

5nm technology platform accelerates silicon innovation across artificial intelligence, high performance computing and 5G wireless infrastructure markets

SAN JOSE, Calif., Nov. 30, 2020 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced sampling of its 5nm ASIC device for data center and cloud infrastructure. Built on TSMC’s N5 process and measuring 625 mm², this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC CoWoS^® interposer technology. In addition, Broadcom has multiple ASIC devices in development targeting artificial intelligence (AI), high performance computing (HPC) and 5G wireless infrastructure applications.

5nm Technology Portfolio Highlights

• High speed multi-protocol 112-Gbps, 64-Gbps and 32-Gbps SerDes cores
• HBM2e and HBM3 protocol solution
• High bandwidth Die2Die PHY for multi-die SoC and silicon disaggregation
• High performance and high-density standard cell libraries and memory compilers
• Advanced packaging solutions including multi-chip-modules and 2.5D stacking
  

Benefits of 5nm ASIC Platform vs. Previous Generation

• 2x increase in on-die computation for training and inference applications
• 2x to 4x increase in memory bandwidth with HBM2e and HBM3 PHY
• 2x higher bandwidth serial links with 112-Gbps SerDes
• Up to 30% reduction in power per given work function
• System size and cost reduction with advanced packaging solutions
  

“Broadcom’s pioneering ASIC leverages both N5, the industry’s most advanced silicon technology, and our high-performance CoWoS integration solution to address the demanding requirements of next-generation cloud and data center applications,” said Dr. Kevin Zhang, senior vice president of business development at TSMC. “We’re excited to see the new applications Broadcom’s ASIC platform will enable, and look forward to continued partnership to empower end customers and their innovations.”

“This first-to-market 5nm ASIC extends Broadcom’s embedded SoC leadership and paves the way for new innovations across AI, HPC, 5G and hyperscale infrastructure applications,” said Frank Ostojic, senior vice president and general manager of the ASIC Product Division at Broadcom. “Our innovative IP, proven design methodology and partnership with TSMC continue to provide leadership solutions with power, performance and time to market advantage for our customers.”

About Broadcom
Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product portfolio serves critical markets including data center, networking, enterprise software, broadband, wireless, storage and industrial. Our solutions include data center networking and storage, enterprise, mainframe and cyber security software focused on automation, monitoring and security, smartphone components, telecoms and factory automation. For more information, go to www.broadcom.com.

Broadcom, the pulse logo, and Connecting everything are among the trademarks of Broadcom.  The term "Broadcom" refers to Broadcom Inc., and/or its subsidiaries. Other trademarks are the property of their respective owners.

Press Contact:
Khanh Lam
Corporate Communications
press.relations@broadcom.com
Telephone: +1 408 433 8649

FAQ

What is the significance of Broadcom's 5nm ASIC device?

Broadcom's 5nm ASIC device is significant as it improves computational capabilities and bandwidth, targeting advanced applications in AI, HPC, and 5G.

When was Broadcom's 5nm ASIC device announced?

Broadcom's 5nm ASIC device was announced on November 30, 2020.

What technologies does the 5nm ASIC device feature?

The 5nm ASIC device features PCIe Gen5 protocol, 112-Gbps SerDes, and HBM2e memory operating at 3.6 Gbps.

How does the 5nm platform compare to previous generations?

The 5nm platform offers a 2x increase in on-die computation and memory bandwidth, alongside a 30% reduction in power consumption.

What markets does Broadcom target with its 5nm technology?

Broadcom targets markets in artificial intelligence, high-performance computing, and 5G wireless infrastructure with its 5nm technology.