Alpha and Omega Semiconductor Expands Surface Mount Package Offering with New LFPAK 5x6 Package for High Performance and High-Reliability Requirements
Alpha and Omega Semiconductor (AOS) has launched a new LFPAK 5x6 package for power MOSFETs, designed for high-current applications in industrial, server power, solar, and telecommunication sectors. The package offers improved reliability and performance with features like gull-wing leads for better board-level reliability and optical inspection, and a larger copper clip for enhanced electrical and thermal performance.
The new LFPAK product line is available in 40V, 60V, and 100V options, combining AOS's advanced shielded gate MOSFET Technology (AlphaSGT™) with the robust package design. This combination enables optimized solutions for high-reliability requirements in harsh environments. The products are immediately available with a 14-16 week lead time, priced between $0.78 to $2.1 per unit in 1,000-piece quantities.
Alpha e Omega Semiconductor (AOS) ha lanciato un nuovo pacchetto LFPAK 5x6 per MOSFET di potenza, progettato per applicazioni ad alta corrente nei settori industriale, dei server, dell'energia solare e delle telecomunicazioni. Il pacchetto offre maggiore affidabilità e prestazioni con caratteristiche come terminali a forma di ala di gabbiano per una migliore affidabilità a livello di scheda e ispezione ottica, e un clip di rame più grande per migliorarne le prestazioni elettriche e termiche.
La nuova linea di prodotti LFPAK è disponibile con opzioni di 40V, 60V e 100V, combinando la tecnologia MOSFET a gate schermato avanzata di AOS (AlphaSGT™) con un design robusto del pacchetto. Questa combinazione consente soluzioni ottimizzate per i requisiti di alta affidabilità in ambienti difficili. I prodotti sono disponibili immediatamente con un tempo di consegna di 14-16 settimane, a un prezzo compreso tra $0,78 e $2,10 per unità in quantità da 1.000 pezzi.
Alpha y Omega Semiconductor (AOS) ha lanzado un nuevo paquete LFPAK 5x6 para MOSFET de potencia, diseñado para aplicaciones de alta corriente en los sectores industrial, de servidores, solar y de telecomunicaciones. El paquete ofrece mayor fiabilidad y rendimiento con características como terminales en forma de ala de gaviota para una mejor fiabilidad a nivel de placa e inspección óptica, y un clip de cobre más grande para mejorar el rendimiento eléctrico y térmico.
La nueva línea de productos LFPAK está disponible en opciones de 40V, 60V y 100V, combinando la avanzada tecnología MOSFET de puerta protegida de AOS (AlphaSGT™) con un diseño robusto del paquete. Esta combinación permite soluciones optimizadas para requisitos de alta fiabilidad en entornos difíciles. Los productos están disponibles inmediatamente con un tiempo de entrega de 14 a 16 semanas, con precios que oscilan entre $0,78 y $2,10 por unidad en cantidades de 1.000 piezas.
알파와 오메가 반도체(AOS)는 전력 MOSFET용 LFPAK 5x6 패키지를 새롭게 출시했습니다. 이 패키지는 산업, 서버 전력, 태양광, 통신 분야에서 고전류 응용프로그램에 맞게 설계되었습니다. 이 패키지는 향상된 신뢰성과 성능을 제공하며, 보드 수준의 신뢰성을 높이고 광학 검사를 위한 술 형 리드와 전기적 및 열적 성능 향상을 위한 더 큰 구리 클립과 같은 기능을 포함합니다.
새로운 LFPAK 제품 라인은 40V, 60V 및 100V 옵션으로 제공되며, AOS의 혁신적인 차폐 게이트 MOSFET 기술(AlphaSGT™)과 견고한 패키지 디자인을 결합합니다. 이 조합은 열악한 환경에서 높은 신뢰성 요구사항을 위한 최적화된 솔루션을 가능하게 합니다. 제품은 즉시 사용 가능하며, 14-16주 배송 기간이 있으며, 1,000개 단위에서 $0.78에서 $2.1 사이의 가격으로 제공됩니다.
Alpha et Omega Semiconductor (AOS) a lancé un nouveau boîtier LFPAK 5x6 pour MOSFET de puissance, conçu pour des applications à fort courant dans les secteurs industriel, des serveurs, de l'énergie solaire et des télécommunications. Le boîtier offre une fiabilité et des performances accrues avec des caractéristiques telles que des pattes en forme d'aile de mouette pour une meilleure fiabilité au niveau de la carte et une inspection optique, ainsi qu'un clip en cuivre plus grand pour améliorer les performances électriques et thermiques.
La nouvelle gamme de produits LFPAK est disponible en options de 40V, 60V et 100V, alliant la technologie avancée des MOSFET à grille blindée d'AOS (AlphaSGT™) à un design de boîtier robuste. Cette combinaison permet d'optimiser les solutions pour des exigences de haute fiabilité dans des environnements difficiles. Les produits sont immédiatement disponibles avec un délai de livraison de 14 à 16 semaines, à un prix compris entre 0,78 $ et 2,10 $ par unité pour des commandes de 1 000 pièces.
Alpha und Omega Semiconductor (AOS) hat ein neues LFPAK 5x6 Gehäuse für Leistungsmosfets auf den Markt gebracht, das für Hochstromanwendungen in den Bereichen Industrie, Serverstrom, Solarenergie und Telekommunikation entwickelt wurde. Das Gehäuse bietet verbesserte Zuverlässigkeit und Leistung mit Funktionen wie Gull-Wing-Anschlüssen für eine bessere Bordzuverlässigkeit und optische Inspektion sowie einem größeren Kupferclip für verbesserte elektrische und thermische Leistung.
Die neue LFPAK-Produktlinie ist in 40V, 60V und 100V Optionen erhältlich, die die fortschrittliche geschützte Gate-MOSFET-Technologie von AOS (AlphaSGT™) mit einem robusten Gehäusedesign kombiniert. Diese Kombination ermöglicht optimierte Lösungen für Anforderungen an hohe Zuverlässigkeit in rauen Umgebungen. Die Produkte sind sofort verfügbar mit einer Lieferzeit von 14-16 Wochen und einem Preis zwischen $0,78 und $2,10 pro Einheit bei 1.000 Stück.
- Introduction of new LFPAK 5x6 package expands AOS's product offering
- Improved board-level reliability and performance due to gull-wing leads and larger copper clip
- Wide voltage range availability (40V, 60V, and 100V) increases application versatility
- Immediate product availability with 14-16 week lead time
- None.
Insights
AOS's new LFPAK 5x6 package represents a significant advancement in power MOSFET technology. The gull-wing leads and larger copper clip are key innovations that address critical issues in high-reliability applications. These features enhance board-level reliability, thermal management and electrical performance.
The improved current handling and reduced on-resistance are particularly noteworthy for industrial and server power applications, where efficiency is paramount. The
AOS's expansion into the LFPAK 5x6 package market is a strategic move to capitalize on the growing demand for robust power solutions in critical sectors. The focus on industrial, server power, solar and telecommunication applications aligns with current market trends towards increased electrification and data processing.
With a 14-16 week lead time, AOS is positioning itself to meet immediate market needs. The diverse voltage range (40V, 60V, 100V) caters to a broad spectrum of applications, potentially increasing AOS's market share. This product line extension could drive revenue growth, especially if AOS can leverage its reputation for reliability to win designs in these high-value sectors.
New AOS LFPAK 5x6 package provides the ruggedness needed for high-current applications in industrial, server power, solar, and telecommunication applications
New AOS LFPAK 5x6 package provides the ruggedness needed for high-current applications in industrial, server power, solar, and telecommunication applications (Graphic: Business Wire)
AOS’s LFPAK packaging enables higher board-level reliability due to key packaging features such as gull-wing leads, which offer a ruggedized solution for board-level environmental stresses. The gull-wing leads also enable optical inspection during PCB manufacturing. Another feature enhancement is the LFPAK’s larger copper clip, which improves electrical and thermal performance. Advantages of the large clip include improved current handling capabilities, reduced on-resistance, and better heat dispersion compared to wire bonding. A large clip also has low parasitic inductance, enabling lower spike voltage in switching applications. All these features significantly improve the robustness of the MOSFET, and utilizing AOS’s advanced shielded gate MOSFET Technology (AlphaSGT™) enables designers to find an optimized solution to achieve high reliability under the harshest environmental conditions.
“Designers have long trusted AOS power semiconductors in their applications, and LFPAK 5x6 will expand solution capability,” said Peter H. Wilson, Marketing Sr. Director of the MOSFET product line at AOS.
Technical Highlights |
|||||
Part Number |
VDS (V) |
VGS (±V) |
ID @ 25°C (A) |
RDS(ON) max (mΩ) at VGS=10V |
Tj max (°C) |
40 |
20 |
352 |
1.5 |
175 |
|
40 |
20 |
374 |
1.5 |
175 |
|
40 |
20 |
200 |
2.6 |
175 |
|
60 |
20 |
294 |
2 |
175 |
|
100 |
20 |
187 |
4.7 |
175 |
|
Pricing and Availability
The LFPAK 5x6 family is immediately available in production quantities with a lead time of 14-16 weeks. The unit price for 1,000 pieces for AOLF66412, AOLF66413, AOLF66417, AOLF66610, and AOLF66910 are respectively
About AOS
Alpha and Omega Semiconductor Limited, or AOS, is a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, including a wide portfolio of Power MOSFET, SiC, IGBT, IPM, TVS, HV Gate Drivers, Power IC, and Digital Power products. AOS has developed extensive intellectual property and technical knowledge that encompasses the latest advancements in the power semiconductor industry, which enables us to introduce innovative products to address the increasingly complex power requirements of advanced electronics. AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high-performance power management solutions. AOS’ portfolio of products targets high-volume applications, including portable computers, flat-panel TVs, LED lighting, smartphones, battery packs, consumer and industrial motor controls, automotive electronics, and power supplies for TVs, computers, servers, and telecommunications equipment. For more information, please visit www.aosmd.com.
Forward-Looking Statements
This press release contains forward-looking statements that are based on current expectations, estimates, forecasts, and projections of future performance based on management’s judgment, beliefs, current trends, and anticipated product performance. These forward-looking statements include, without limitation, references to the efficiency and capability of new products and the potential to expand into new markets. Forward-looking statements involve risks and uncertainties that may cause actual results to differ materially from those contained in the forward-looking statements. These factors include but are not limited to, the actual product performance in volume production, the quality and reliability of the product, our ability to achieve design wins, the general business and economic conditions, the state of the semiconductor industry, and other risks as described in the Company’s annual report and other filings with the
View source version on businesswire.com: https://www.businesswire.com/news/home/20240821591590/en/
Mina Galvan
408.789.3233
mina.galvan@aosmd.com
Source: Alpha and Omega Semiconductor Limited
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