Alpha and Omega Semiconductor Announces Innovatively Designed Double-Sided Cooling DFN 5x6 Package
- AOS has introduced the AONA66916, a 100V MOSFET with industry-leading thermal performance.
- The new top-exposed DFN 5 x 6 package achieves a low thermal resistance of 0.5°C / W, enabling cooler and more reliable designs.
- The AONA66916 shares the same footprint as AOS' standard DFN 5 x 6 package, eliminating the need for PCB layout modifications.
- The device is immediately available in production quantities with a unit price of $1.85.
- None.
Insights
The introduction of the AONA66916 Power MOSFET by Alpha and Omega Semiconductor Limited (AOS) represents a significant advancement in the field of power semiconductor devices. By achieving a low thermal resistance of 0.5°C/W, the AONA66916 facilitates more efficient heat dissipation, which is crucial for improving the reliability and performance of high-power electronics. This is particularly relevant in telecommunications and industrial applications where devices are subjected to harsh operating conditions.
The use of AOS' 100V AlphaSGT™ technology, which provides an excellent figure of merit (FOM) for hard switching applications, indicates that the AONA66916 is optimized for both low conduction losses and switching losses. This balance is essential for applications that require high efficiency and power density. The maximum RDS(on) rating of 3.4mOhms and the 175°C junction temperature rating further underscore the device's capability to handle high current loads while maintaining operational integrity.
From a market perspective, the release of the AONA66916 Power MOSFET can be seen as a strategic move by AOS to strengthen its position in the power semiconductor market. The innovative top-exposed DFN 5 x 6 package design addresses a critical need for better thermal management in electronic designs. This could potentially lead to increased demand for AOS products among design engineers looking to enhance system reliability and efficiency without altering existing PCB layouts.
Moreover, the pricing strategy for the AONA66916, with a unit price of $1.85 for 1,000 pieces, appears competitive and may influence the procurement decisions of manufacturers and design houses. The lead time of 14-16 weeks, while standard for the industry, will require careful inventory management from customers to ensure timely integration into their designs.
On the supply chain front, the availability of the AONA66916 in production quantities with a lead time of 14-16 weeks could pose challenges if demand exceeds current projections. While the lead time falls within typical industry ranges, any disruptions in the supply chain could impact production schedules for customers. Companies considering the AONA66916 for their designs will need to factor in these lead times and potential supply chain volatility when planning their product development cycles.
Additionally, the ability of AOS to maintain consistent quality and supply will be vital for building customer trust and securing long-term adoption of the AONA66916. It's important for AOS to have robust risk management strategies in place to mitigate any potential supply chain disruptions that could affect the availability of this new device.
The AONA66916 Power MOSFET in AOS’ new top-exposed DFN 5 x 6 achieves industry leading thermal performance to enable cooler, more reliable designs
The AONA66916 Power MOSFET in AOS’ new top-exposed DFN 5 x 6 achieves industry leading thermal performance to enable cooler, more reliable designs (Graphic: Business Wire)
Typically, when using the standard DFN 5x6 package, the bottom contact is the main contributor for cooling, and most of the heat generated by the Power MOSFETs will be transferred to the PCB. This increases the PCB thermal management design considerations to meet system requirements. AOS’ new top and bottom cooling DFN 5x6 package is designed to achieve the highest heat transfer between the exposed top contact and heat sink due to its large surface contact area construction. This allows the device to achieve a low thermal resistance (Rthc-top max) of 0.5°C / W with results being transferred to the PCB board, enabling significant thermal performance improvements. The top exposed DFN 5x6 package of the AONA66916 shares the same 5mm x 6mm footprint as AOS’ standard DFN 5x6 package, eliminating the need to modify existing PCB layouts.
Another benefit of the AONA66916 is that it utilizes AOS’ 100V AlphaSGT™ technology, providing excellent FOM for balanced performance in hard switching applications. AONA66916 has a maximum RDS(on) rating of 3.4mOhms and has a 175°C junction temperature rating.
“Cooling the power MOSFET in high power design can be challenging, and AOS has successfully addressed this essential issue with our advanced top exposed package design. It not only enables better thermal transfer from its top side exposed contact to heat sink due to large exposed surface area, our new package delivers a much cooler device that contributes to a more efficient and robust final design,” said Peter H. Wilson, Marketing Sr. Director of the MOSFET product line at AOS.
Technical Highlights
Part Number |
VDS
|
VGS
|
RDS(ON) Max
|
Rthjc – max
|
Junction Temp
|
Continuous Drain
|
|
Top |
bottom |
@25°C |
|||||
AONA66916 |
100 |
20 |
3.4 |
0.5 |
0.55 |
175 |
197 |
Pricing and Availability
The AONA66916 is immediately available in production quantities with a lead time of 14-16 weeks. The unit price for 1,000 pieces is
About AOS
Alpha and Omega Semiconductor Limited, or AOS, is a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, including a wide portfolio of Power MOSFET, SiC, IGBT, IPM, TVS, Gate Drivers, Power IC, and Digital Power products. AOS has developed extensive intellectual property and technical knowledge that encompasses the latest advancements in the power semiconductor industry, which enables us to introduce innovative products to address the increasingly complex power requirements of advanced electronics. AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high-performance power management solutions. AOS’ portfolio of products targets high-volume applications, including portable computers, flat-panel TVs, LED lighting, smartphones, battery packs, consumer and industrial motor controls, automotive electronics, and power supplies for TVs, computers, servers, and telecommunications equipment. For more information, please visit www.aosmd.com.
Forward-Looking Statements
This press release contains forward-looking statements that are based on current expectations, estimates, forecasts, and projections of future performance based on management’s judgment, beliefs, current trends, and anticipated product performance. These forward-looking statements include, without limitation, references to the efficiency and capability of new products and the potential to expand into new markets. Forward-looking statements involve risks and uncertainties that may cause actual results to differ materially from those contained in the forward-looking statements. These factors include but are not limited to, the actual product performance in volume production, the quality and reliability of the product, our ability to achieve design wins, the general business and economic conditions, the state of the semiconductor industry, and other risks as described in the Company’s annual report and other filings with the
View source version on businesswire.com: https://www.businesswire.com/news/home/20240124903450/en/
Media Contact: Mina Galvan
Tel: 408.789.3233
Email: mina.galvan@aosmd.com
Source: Alpha and Omega Semiconductor Limited
FAQ
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