Alpha and Omega Semiconductor Announces Expanded Surface Mount and Module Package Options for its 1200V αSiC MOSFETs
Alpha and Omega Semiconductor (AOS) has expanded its package portfolio for 650V to 1200V αSiC MOSFETs. This includes new surface mount and module package options suitable for applications like xEV charging, solar inverters, and industrial power supplies. Key products include the AOBB040V120X2Q in a D2PAK-7L package, the AOGT020V120X2 in a GTPAK™ package with topside cooling, and the AOH010V120AM2 in a baseplate-less AlphaModule™. These advancements offer increased system optimization and efficiency. The products will be showcased at PCIM Europe 2024 from June 11-13 in Nuremberg, Germany.
- Expansion of package options for 650V to 1200V αSiC MOSFETs.
- Introduction of the AOBB040V120X2Q in a D2PAK-7L surface mount package.
- AEC-Q101 qualification for the new products.
- Enhanced design flexibility and system optimization.
- Higher power density and efficient cooling with new packages.
- GTPAK™ package offers topside cooling for better thermal management.
- AlphaModule™ simplifies mechanical and electrical design.
- Products suitable for applications in xEV charging, solar inverters, and industrial power supplies.
- Potential challenges in integrating new package options into existing systems.
- No specific pricing details provided in the press release.
Insights
Alpha and Omega Semiconductor's announcement of new package options for their second-generation αSiC MOSFETs is particularly relevant for technological advancements in fields like electric vehicles (EVs), renewable energy and industrial power supplies. SiC (Silicon Carbide) MOSFETs are known for their ability to handle higher voltages and temperatures compared to traditional silicon-based devices. This leads to more efficient power conversion and smaller, lighter power systems.
The introduction of the D2PAK-7L surface mount package for the AOBB040V120X2Q MOSFET allows designers to replace bulkier through-hole packages. The low inductance feature enhances the switching efficiency, which is critical for on-board chargers (OBCs) in EVs. Similarly, the GTPAK™ surface mount package with topside cooling is a significant development for applications such as solar inverters where thermal management is crucial.
Lastly, the AlphaModule™ high power baseplate-less module family simplifies both mechanical and electrical design by integrating multiple discrete devices into a single module. This is particularly relevant for residential solar inverters and fast DC charging stations. The ability to scale power levels by using multiple modules in parallel addresses a key need in high-power applications.
These innovations underline AOS's commitment to advancing power efficiency and density, making their products highly attractive for engineers looking to optimize their designs for performance and cost-efficiency.
From a market perspective, the expansion of Alpha and Omega Semiconductor's package options for their αSiC MOSFETs indicates a strategic move to tap into the growing demand in sectors such as electric vehicles, solar power and industrial applications. SiC technology is at the forefront of power electronics due to its superior performance characteristics, including higher efficiency and thermal conductivity.
This product expansion aligns well with the ongoing trends in the renewable energy market, where there is a push for more efficient and higher-density power solutions. The ability to offer a variety of packages provides AOS with a competitive edge, as it allows customers greater flexibility in design and application. This is especially important as industries increasingly seek tailored solutions to meet specific performance and regulatory requirements.
Moreover, the announcement's timing, ahead of the PCIM Europe 2024 conference, suggests AOS is keen to showcase its innovations to a global audience, potentially driving higher engagement and interest from industry players. This could lead to an increase in market share and revenue growth, as more companies adopt SiC-based solutions for their power needs.
In summary, AOS is well-positioned to benefit from the growing demand for advanced semiconductor solutions and the strategic expansion of their package options is likely to bolster their market position in the coming years.
Surface Mount and Module Package Options for its 1200V αSiC MOSFETs (Graphic: Business Wire)
The first new surface mount package is available for the AOBB040V120X2Q, AOS’ new 1200V/40mOhm αSiC MOSFET in a standard D2PAK-7L surface mount package. This AEC-Q101 qualified product is designed to replace traditional through-hole packages. It is ideal for applications such as on-board chargers (OBCs) where efficient cooling can be provided by vias and backside PCB heatsinks, simplifying the assembly flow and maximizing the power density. In addition, the low inductance package combined with the fast driver source-sense connection positions these AOS αSiC MOSFETs as one of the most efficient power-switching solutions in the market.
For additional design flexibility, AOS is releasing its GTPAK™ surface mount package with topside cooling features. In designs where a topside-mounted heatsink is viable, the direct heat path from the GTPAK minimizes the thermal resistance. It enables higher power dissipation for more effective PCB routing. The first AOS product in GTPAK is the AOGT020V120X2. This 1200V/20mOhm αSiC MOSFET is an ideal solution to meet the requirements of high-efficiency solar inverter and industrial power supply applications.
Finally, AOS announced the AOH010V120AM2 as the first product in its new AlphaModule™ high power baseplate-less module family. This 1200V/10mOhm half-bridge αSiC module features press-fit pins and an integrated thermistor. It is in a standard footprint module that enables the replacement of multiple discrete devices into a single compact form factor while simplifying both the mechanical and electrical design by providing a clear separation of electrical and cooling paths. Single modules are suitable for residential solar inverters, or several modules in parallel will allow scaling to power levels necessary to drive the needs of fast DC charging stations.
“With the continued growth in EVs, energy infrastructure, and renewable energy, we continue to see increased interest in our αSiC MOSFETs. The expansion of our product portfolio to include these new advanced package options gives our customers the design flexibility they need to take advantage of our superior αSiC performance and continue the trend of pushing power systems to higher density and efficiency,” said David Sheridan, Vice President of SiC products at AOS.
Pricing and Availability
Please contact your local sales representative for sample availability and pricing.
Where: PCIM Europe 2024, Nuremberg,
When: June 11 to 13, 2024
Location: Alpha and Omega Semiconductor, Booth# 9-519
About AOS
Alpha and Omega Semiconductor Limited, or AOS, is a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs and modules, including a wide portfolio of Power MOSFET, SiC, IGBT, IPM, TVS, HV Gate Drivers, Power IC, and Digital Power products. AOS has developed extensive intellectual property and technical knowledge that encompasses the latest advancements in the power semiconductor industry, which enables us to introduce innovative products to address the increasingly complex power requirements of advanced electronics. AOS differentiates itself by integrating its Discrete and IC semiconductor process technology, product design, and advanced packaging know-how to develop high- performance power management solutions. AOS’ portfolio of products targets high-volume applications, including portable computers, flat-panel TVs, LED lighting, smartphones, battery packs, consumer and industrial motor controls, automotive electronics, and power supplies for TVs, computers, servers, and telecommunications equipment. For more information, please visit www.aosmd.com.
Forward-Looking Statements
This press release contains forward-looking statements that are based on current expectations, estimates, forecasts, and projections of future performance based on ’management’s judgment, beliefs, current trends, and anticipated product performance. These forward-looking statements include without limitation, references to the efficiency and capability of new products and the potential to expand into new markets. Forward-looking statements involve risks and uncertainties that may cause actual results to differ materially from those contained in the forward-looking statements. These factors include but are not limited to, the actual product performance in volume production, the quality and reliability of the product, our ability to achieve design wins, the general business and economic conditions, the state of the semiconductor industry, and other risks as described in the Company’s annual report and other filings with the
View source version on businesswire.com: https://www.businesswire.com/news/home/20240606518303/en/
Mina Galvan
Tel: 408.789.3233
Email: mina.galvan@aosmd.com
Source: Alpha and Omega Semiconductor Limited
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