TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design
Ansys (NASDAQ: ANSS) and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next-generation multiphysics solutions for advanced semiconductor technologies. The partnership aims to enhance productivity in designing 3D integrated circuits through AI-driven solutions and automation. Key developments include:
1. Integration of Ansys optiSLang and RaptorX for optimized channel design, reducing EM simulations.
2. Collaboration with Synopsys on an AI-assisted RF migration flow.
3. Expansion of RedHawk-SC Electrothermal platform for 3D-IC thermal and stress analysis.
4. Joint support for the latest version of 3Dblox.
5. Development of a comprehensive workflow for TSMC's COUPE (Compact Universal Photonics Engine).
6. Enablement of RedHawk-SC Electrothermal for TSMC's new A16 silicon process.
These advancements aim to improve design productivity, reduce costs, and accelerate time-to-market for semiconductor products in AI, HPC, and high-speed data communication.
Ansys (NASDAQ: ANSS) e TSMC hanno ampliato la loro collaborazione per sfruttare l'intelligenza artificiale per il progresso del design dei circuiti integrati 3D e sviluppare soluzioni multiphysics di prossima generazione per tecnologie avanzate di semiconduttori. L'obiettivo della partnership è migliorare la produttività nel progettare circuiti integrati 3D attraverso soluzioni e automazione guidate dall'IA. Tra i principali sviluppi ci sono:
1. Integrazione di Ansys optiSLang e RaptorX per un design ottimizzato dei canali, riducendo le simulazioni EM.
2. Collaborazione con Synopsys su un flusso di migrazione RF assistito dall'IA.
3. Espansione della piattaforma Elettrotermica RedHawk-SC per l'analisi termica e di stress dei 3D-IC.
4. Supporto congiunto per l'ultima versione di 3Dblox.
5. Sviluppo di un flusso di lavoro completo per il COUPE di TSMC (Compact Universal Photonics Engine).
6. Abilitazione di RedHawk-SC Elettrotermico per il nuovo processo di silicio A16 di TSMC.
Questi avanzamenti mirano a migliorare la produttività del design, ridurre i costi e accelerare il time-to-market per i prodotti di semiconduttori nell'IA, HPC e comunicazione dati ad alta velocità.
Ansys (NASDAQ: ANSS) y TSMC han ampliado su colaboración para aprovechar la IA para avanzar en el diseño de circuitos integrados 3D y desarrollar soluciones multifísicas de próxima generación para tecnologías avanzadas de semiconductores. La asociación tiene como objetivo mejorar la productividad en el diseño de circuitos integrados 3D a través de soluciones y automatización impulsadas por IA. Los desarrollos clave incluyen:
1. Integración de Ansys optiSLang y RaptorX para un diseño de canales optimizado, reduciendo las simulaciones EM.
2. Colaboración con Synopsys en un flujo de migración RF asistido por IA.
3. Expansión de la plataforma electrotérmica RedHawk-SC para análisis térmico y de estrés de 3D-IC.
4. Soporte conjunto para la última versión de 3Dblox.
5. Desarrollo de un flujo de trabajo integral para el COUPE de TSMC (Compact Universal Photonics Engine).
6. Habilitación de RedHawk-SC Electrothermal para el nuevo proceso de silicio A16 de TSMC.
Estos avances tienen como objetivo mejorar la productividad del diseño, reducir costos y acelerar el tiempo de comercialización de los productos de semiconductores en IA, HPC y comunicación de datos de alta velocidad.
Ansys (NASDAQ: ANSS)와 TSMC는 AI를 활용한 3D-IC 설계 발전을 위해 협력을 확대하고, 첨단 반도체 기술을 위한 차세대 다물리기술 솔루션을 개발하고 있습니다. 이 파트너십의 목표는 AI 기반 솔루션과 자동화를 통해 3D 집적 회로 설계의 생산성을 향상시키는 것입니다. 주요 발전 사항은 다음과 같습니다:
1. EM 시뮬레이션을 줄여주는 최적화된 채널 설계를 위한 Ansys optiSLang과 RaptorX의 통합.
2. AI 지원 RF 마이그레이션 흐름에 대한 Synopsys와의 협업.
3. 3D-IC의 열 및 스트레스 분석을 위한 RedHawk-SC 전자열 플랫폼의 확장.
4. 3Dblox의 최신 버전에 대한 공동 지원.
5. TSMC의 COUPE(Compact Universal Photonics Engine)에 대한 종합적인 작업 흐름 개발.
6. TSMC의 새로운 A16 실리콘 프로세스를 위한 RedHawk-SC 전자열 기능 활성화.
이러한 발전은 디자인 생산성을 개선하고 비용을 줄이며 AI, HPC, 고속 데이터 통신을 위한 반도체 제품의 시장 출시 시간을 가속화하는 것을 목표로 하고 있습니다.
Ansys (NASDAQ: ANSS) et TSMC ont élargi leur collaboration pour tirer parti de l'IA pour faire progresser la conception des circuits intégrés 3D et développer des solutions multiphysiques de nouvelle génération pour des technologies avancées en matière de semi-conducteurs. Le partenariat vise à améliorer la productivité dans la conception de circuits intégrés 3D grâce à des solutions et à une automatisation basées sur l'IA. Les principales évolutions incluent:
1. Intégration d'Ansys optiSLang et RaptorX pour un design de canaux optimisé, réduisant les simulations EM.
2. Collaboration avec Synopsys sur un flux de migration RF assisté par IA.
3. Expansion de la plateforme électrothermique RedHawk-SC pour l'analyse thermique et de contrainte des 3D-IC.
4. Support conjoint pour la dernière version de 3Dblox.
5. Développement d'un flux de travail complet pour le COUPE de TSMC (Compact Universal Photonics Engine).
6. Activation de RedHawk-SC électrothermique pour le nouveau processus de silicium A16 de TSMC.
Ces avancées visent à améliorer la productivité du design, réduire les coûts et accélérer le time-to-market pour les produits de semi-conducteurs dans l'IA, le HPC et la communication de données à haute vitesse.
Ansys (NASDAQ: ANSS) und TSMC haben ihre Zusammenarbeit ausgeweitet, um KI zur Verbesserung des 3D-IC-Designs zu nutzen und Lösungen für Multiphysik der nächsten Generation für fortschrittliche Halbleitertechnologien zu entwickeln. Ziel der Partnerschaft ist es, die Produktivität beim Design von 3D-Integrationsschaltungen durch KI-gesteuerte Lösungen und Automatisierung zu steigern. Zu den wichtigsten Entwicklungen gehören:
1. Integration von Ansys optiSLang und RaptorX für optimiertes Kanaldesign, um EM-Simulationen zu reduzieren.
2. Zusammenarbeit mit Synopsys an einem KI-unterstützten RF-Migrationsfluss.
3. Erweiterung der RedHawk-SC Elektrothermischen Plattform für die thermische und Spannungsanalyse von 3D-ICs.
4. Gemeinsame Unterstützung für die neueste Version von 3Dblox.
5. Entwicklung eines umfassenden Workflows für TSMCs COUPE (Compact Universal Photonics Engine).
6. Aktivierung von RedHawk-SC Elektrothermisch für den neuen A16 Siliziumprozess von TSMC.
Diese Fortschritte zielen darauf ab, die Produktivität im Design zu verbessern, Kosten zu senken und die Markteinführungszeit für Halbleiterprodukte in den Bereichen KI, HPC und Hochgeschwindigkeitsdatenkommunikation zu beschleunigen.
- Expanded collaboration between Ansys and TSMC to leverage AI for 3D-IC design advancement
- Integration of Ansys optiSLang and RaptorX reduces EM simulations, potentially lowering design costs and accelerating time-to-market
- Development of AI-assisted RF migration flow in collaboration with Synopsys
- Expansion of RedHawk-SC Electrothermal platform to support 3D-IC thermal and stress analysis
- Joint development of comprehensive workflow for TSMC's COUPE, enabling advanced optical data communication solutions
- None.
Insights
This expanded collaboration between Ansys and TSMC represents a significant leap in 3D-IC design capabilities. The integration of AI-driven solutions, particularly Ansys optiSLang and RaptorX, into the design process is a game-changer. It substantially reduces the number of EM simulations required, potentially slashing design time and costs.
The development of an AI-assisted RF migration flow is particularly noteworthy. This innovation could dramatically streamline the process of transitioning analog circuits between different silicon processes, a traditionally time-consuming and complex task.
The expansion into mechanical stress analysis for 3D-IC packaging is important as chip stacking becomes more prevalent. This multiphysics approach, combining thermal and stress analysis, is essential for ensuring reliability in these complex structures.
TSMC's COUPE initiative, integrating optics directly with electronics, is a forward-thinking move that could revolutionize data communication in high-performance computing. Ansys's comprehensive simulation suite is pivotal in making this complex integration feasible.
Overall, these advancements position Ansys and TSMC at the forefront of next-generation semiconductor design, particularly for AI and HPC applications. This collaboration could accelerate the development of more powerful, energy-efficient chips, potentially leading to significant advancements in computing capabilities.
This expanded collaboration with TSMC, a leading semiconductor foundry, is a strong positive for Ansys. It reinforces Ansys's position as a critical player in the semiconductor design ecosystem, particularly for cutting-edge technologies like 3D-IC and AI chips.
The integration of AI into Ansys's tools could lead to increased demand for their software, as it promises to significantly reduce design time and costs for chip manufacturers. This efficiency gain could be a key selling point, potentially driving higher software sales and licensing revenues.
Ansys's involvement in TSMC's advanced A16 process and COUPE initiative puts them at the forefront of next-generation chip design. This strategic positioning could lead to long-term growth opportunities as these technologies mature and become more widely adopted in the industry.
The collaboration spans multiple Ansys products (optiSLang, RaptorX, RedHawk-SC, Zemax OpticStudio, Lumerical FDTD, Totem), which could drive cross-selling opportunities and deeper integration into customers' workflows.
While specific financial figures aren't provided, this partnership likely strengthens Ansys's competitive moat in the semiconductor industry, potentially leading to increased market share and revenue growth in the medium to long term.
Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors
/ Key Highlights
- Ansys artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasks
- Ansys multiphysics platform supports TSMC customers' reliability analysis needs for evolving 3D-IC design
- Ansys and TSMC developed a comprehensive multiphysics analysis workflow for TSMC's compact universal photonics engine (COUPE) for optical data communication
Productivity enhancement with AI
Creating the right 3D-IC design that optimizes thermal and electrical effects — such as channel profile — requires extensive, time-consuming design flows. To minimize this constraint, designers use Ansys optiSLang® process integration and optimization software to quickly identify optimal design configurations through automation. By integrating optiSLang and Ansys RaptorX™ silicon-optimized EM solver for design analysis and modeling into the design process earlier, the solution reduced the number of EM simulations and demonstrated co-optimized channel design. This time savings delivers lower design costs and faster time-to-market.
Additionally, TSMC, Ansys, and Synopsys continue their long-standing collaboration to ensure the best technical solutions for their customers. Together, the companies developed an innovative AI-assisted RF migration flow by combining the RaptorX EM modeling engine with optiSLang that enables customers to automatically migrate analog circuits from one silicon process to another.
Multiphysics analysis for reliability
As TSMC advances 3D-IC packaging technologies, thermal and stress multiphysics analysis has become essential for ensuring the reliability of advanced multi-chip manufacturing. To address this need, TSMC is expanding its collaboration with Ansys RedHawk-SC Electrothermal™ thermal and multiphysics signoff platform for 3D-IC, incorporating mechanical stress analysis solutions to better support mutual customers' requirements.
TSMC, Ansys, and Synopsys have developed an efficient flow to address multiphysics coupling challenges among timing, thermal, and power integrity. The flow, including Synopsys' 3DIC Compiler™ exploration-to-signoff platform combined with Ansys solutions RedHawk-SC Electrothermal and Ansys RedHawk-SC™, helps customers reduce design challenges, enhance power, performance, and area (PPA), and ensure the reliability of their designs.
Ansys and TSMC also continue to jointly support the latest version of 3Dblox, with a focus on implementing hierarchical support to address the continuous rise of 3D-IC complexity. The new features of 3Dblox provide modularity and flexibility to help 3D-IC designers shorten the design implementation and analysis cycle.
COUPE solution enablement
TSMC's COUPE is a 3D-IC assembly that stacks electronic chips on top of photonic chips, connecting fiber optics directly to electronic systems. Ansys, Synopsys, and TSMC are working to jointly enable a COUPE design solution that links a broad range of physics capabilities. The innovative optics simulation flow integrates:
- Ansys Zemax OpticStudio® and Ansys Lumerical™ FDTD to simulate photonic devices on sub-wavelength scale and microlens at millimeter scale
- Ansys RedHawk-SC and Ansys Totem™ for simulating power delivery network and signal net tracing to ensure voltage drop remains within acceptable design margins and signals can tolerate design current between electrical control IC and photonic IC
- RaptorX for modeling high-speed inter-chip connections in a multi-die package to accurately capture high-frequency signal behavior, and
- RedHawk-SC Electrothermal for simulating critical photonic heat and device components and overall 3D stacking thermal integrity
A16 Enablement
TSMC recently announced an advanced, new silicon process A16 that includes innovative backside power contact technology and backside power delivery. While this makes it suitable for AI and HPC applications, thermal management becomes an important reliability consideration. To address this, TSMC and Ansys are collaborating to enable RedHawk-SC Electrothermal to provide accurate thermal analysis. Moreover, TSMC collaborates with Ansys to enable power integrity and reliability technology with Redhawk-SC and Totem. Overall, the solutions will help designers improve performance, enhance power efficiency, and ensure an optimal and reliable design.
"Our advanced process and 3DFabric technologies have made huge strides in enabling more powerful and energy-efficient chips to tackle the ever-increasing computational demands of AI applications, but this also requires design tools that have a deep understanding of complex multi-physics interactions," said Dan Kochpatcharin, head of Ecosystem and Alliance Management Division at TSMC. "The collaboration with our Open Innovation Platform (OIP) ecosystem partners like Ansys gives our mutual customers reliable access to a very broad range of proven analysis capabilities to deliver reliable solutions for their business needs."
"Just as semiconductors have a wide range of applications, the Ansys multiphysics platform offers an equally broad range of reliable technical solutions," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "Whether this be thermal, mechanical, electromagnetic, or a combination of different physics, we strive to ensure that our customers are well equipped with the strongest analysis tools to stay ahead of the curve. The continued collaborations with TSMC and Synopsys are a testament to our understanding of customer needs and how precise, predictively accurate simulation can help them deliver the most powerful products."
/ About Ansys
Our Mission: Powering Innovation that Drives Human Advancement™
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
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