TSMC Collaborates with Ansys and Microsoft to Accelerate Photonic Simulations
Ansys (NASDAQ: ANSS), TSMC, and Microsoft have collaborated to achieve a 10X speed-up in the simulation and analysis of silicon photonic components. This breakthrough was accomplished using Ansys Lumerical FDTD 3D electromagnetic simulation software on Microsoft Azure NC A100v4-series virtual machines powered by NVIDIA GPUs.
The collaboration aims to accelerate the development of Photonic Integrated Circuits (PICs) for applications in data communications, biomedical tools, automotive LiDAR systems, and artificial intelligence. By leveraging Azure's cloud infrastructure, the partnership enables seamless deployment, graphical interface access, scaling of distributed simulations, and post-processing for large datasets.
This advancement is important for addressing challenges in combining photonic and electronic circuits, potentially reducing costs and timeline setbacks in chip design. The collaboration demonstrates Ansys's ability to harness cloud infrastructure to deliver powerful, predictively accurate solutions for complex multiphysics silicon designs.
Ansys (NASDAQ: ANSS), TSMC e Microsoft hanno collaborato per ottenere un accelerazione di 10 volte nella simulazione e analisi dei componenti fotonici in silicio. Questo risultato è stato raggiunto utilizzando il software di simulazione elettromagnetica 3D Ansys Lumerical FDTD su macchine virtuali Microsoft Azure della serie NC A100v4, alimentate da GPU NVIDIA.
La collaborazione mira ad accelerare lo sviluppo dei Circuiti Integrati Fotonici (PIC) per applicazioni nelle comunicazioni dati, strumenti biomedici, sistemi LiDAR automobilistici e intelligenza artificiale. Sfruttando l'infrastruttura cloud di Azure, il partenariato consente un'implementazione senza soluzione di continuità, accesso a interfacce grafiche, scalabilità delle simulazioni distribuite e post-elaborazione per grandi set di dati.
Questo progresso è fondamentale per affrontare le sfide nella combinazione di circuiti fotonici ed elettronici, riducendo potenzialmente i costi e i ritardi nella progettazione dei chip. La collaborazione dimostra la capacità di Ansys di sfruttare l'infrastruttura cloud per fornire soluzioni potenti e predittivamente accurate per complessi progetti in silicio multiphysici.
Ansys (NASDAQ: ANSS), TSMC y Microsoft han colaborado para lograr una aceleración de 10 veces en la simulación y análisis de componentes fotónicos de silicio. Este avance se logró utilizando el software de simulación electromagnética 3D Ansys Lumerical FDTD en máquinas virtuales de Microsoft Azure de la serie NC A100v4, impulsadas por GPUs de NVIDIA.
La colaboración tiene como objetivo acelerar el desarrollo de Circuitos Integrados Fotónicos (PIC) para aplicaciones en comunicaciones de datos, herramientas biomédicas, sistemas LiDAR automotrices e inteligencia artificial. Aprovechando la infraestructura en la nube de Azure, la asociación permite un despliegue sin interrupciones, acceso a interfaces gráficas, escalabilidad de simulaciones distribuidas y post-procesamiento para grandes conjuntos de datos.
Este avance es importante para abordar los desafíos de combinar circuitos fotónicos y electrónicos, lo que potencialmente reduce costos y retrasos en el diseño de chips. La colaboración demuestra la capacidad de Ansys para aprovechar la infraestructura en la nube y ofrecer soluciones potentes y predictivamente precisas para diseños complejos de silicio multiphísicos.
안시스( NASDAQ: ANSS), TSMC 및 마이크로소프트가 실리콘 포토닉 부품의 시뮬레이션 및 분석에서 10배 속도 향상을 달성하기 위해 협력했습니다. 이 혁신은 NVIDIA GPU가 탑재된 마이크로소프트 애저 NC A100v4 시리즈 가상 머신에서 Ansys Lumerical FDTD 3D 전자기 시뮬레이션 소프트웨어를 사용하여 이루어졌습니다.
이 협력의 목표는 데이터 통신, 생물 의학 도구, 자동차 LiDAR 시스템 및 인공지능 응용 프로그램을 위한 포토닉 집적 회로(PIC) 개발을 가속화하는 것입니다. Azure의 클라우드 인프라를 활용하여, 이 파트너십은 원활한 배포, 그래픽 인터페이스 접근, 분산 시뮬레이션의 확장성 및 대규모 데이터 세트의 후처리를 가능하게 합니다.
이 발전은 포토닉 및 전자 회로를 결합하는 과정에서의 도전 과제를 해결하는 데 중요하며, 잠재적으로 칩 디자인의 비용과 일정 지연을 줄일 수 있습니다. 이 협업은 복잡한 다물리학적 실리콘 설계를 위한 강력하고 예측적으로 정확한 솔루션을 제공하기 위해 클라우드 인프라를 활용하는 Ansys의 능력을 보여줍니다.
Ansys (NASDAQ: ANSS), TSMC et Microsoft ont collaboré pour obtenir une accélération de 10 fois dans la simulation et l'analyse des composants photoniques en silicium. Cette avancée a été réalisée en utilisant le logiciel de simulation électromagnétique 3D Ansys Lumerical FDTD sur des machines virtuelles Microsoft Azure de la série NC A100v4, propulsées par des GPUs NVIDIA.
La collaboration vise à accélérer le développement des Circuits Intégrés Photoniques (PIC) pour des applications dans les communications de données, les outils biomédicaux, les systèmes LiDAR automobiles et l'intelligence artificielle. En tirant parti de l'infrastructure cloud d'Azure, le partenariat permet un déploiement fluide, un accès à des interfaces graphiques, une montée en charge des simulations distribuées et un post-traitement de grands ensembles de données.
Cette avancée est importante pour relever les défis de la combinaison des circuits photoniques et électroniques, réduisant potentiellement les coûts et les retards dans la conception des puces. La collaboration démontre la capacité d'Ansys à exploiter l'infrastructure cloud pour fournir des solutions puissantes et prévisiblement précises pour des conceptions siliciumnes complexes multiphysiques.
Ansys (NASDAQ: ANSS), TSMC und Microsoft haben zusammengearbeitet, um eine 10-fache Beschleunigung bei der Simulation und Analyse von siliziumphotonischen Komponenten zu erreichen. Dieser Durchbruch wurde erreicht, indem die Ansys Lumerical FDTD 3D-Elektromagnetismus-Simulationssoftware auf virtuellen Maschinen der Microsoft Azure NC A100v4-Serie, die von NVIDIA-GPUs unterstützt werden, eingesetzt wurde.
Die Zusammenarbeit zielt darauf ab, die Entwicklung von Photonischen Integrierten Schaltungen (PICs) für Anwendungen in der Datenkommunikation, biomedizinischen Werkzeugen, automobilen LiDAR-Systemen und künstlicher Intelligenz zu beschleunigen. Durch die Nutzung der Cloud-Infrastruktur von Azure ermöglicht die Partnerschaft eine nahtlose Bereitstellung, den Zugriff auf grafische Schnittstellen, die Skalierung verteilter Simulationen und die Nachbearbeitung großer Datensätze.
Dieser Fortschritt ist wichtig, um Herausforderungen bei der Kombination von photonischen und elektronischen Schaltungen zu bewältigen, und könnte die Kosten sowie zeitliche Verzögerungen im Chip-Design reduzieren. Die Zusammenarbeit zeigt die Fähigkeit von Ansys, die Cloud-Infrastruktur zu nutzen, um leistungsstarke, voraussichtlich genaue Lösungen für komplexe multiphysikalische Silizium-Designs bereitzustellen.
- 10X speed-up in simulation and analysis of silicon photonic components
- Collaboration with industry leaders TSMC and Microsoft
- Potential for cost reduction and timeline improvements in chip design
- Enhanced capabilities for complex multiphysics silicon designs
- Expansion into high-growth markets (data communications, biomedical tools, automotive LiDAR, AI)
- None.
Insights
Ansys, TSMC, and Microsoft collaborate to speed-up simulation and analysis of silicon photonic components over 10X
/ Key Highlights
- Ansys Lumerical™ FDTD 3D electromagnetic simulation software for photonic components demonstrates 10X faster simulation with Microsoft Azure Virtual Machines using NVIDIA graphics processing units (GPUs)
- With the scalability of Azure cloud, Ansys software delivers a comprehensive platform ideal for ushering in the next wave of silicon Photonic Integrated Circuit (PIC) technology for applications in data communications, biomedical tools, automotive LiDAR systems, and artificial intelligence (AI)
Silicon PIC, a type of optical communications that enables data to travel farther and faster, is integral to hyperscale data centers and Internet-of-Things applications. Combining photonic and electronic circuits is a painstaking task requiring precise multiphysics design and fabrication. A minor misstep can create continuity challenges within chips, which can result in added cost and timeline setbacks up to several months.
To alleviate challenges and unlock the ultra-bandwidth capabilities of silicon PIC, TSMC collaborated with Ansys to speed-up Lumerical FDTD simulations using highly efficient Azure virtual machines that use NVIDIA GPUs. Azure NC A100v4 VMs executed the simulations and identified optimal resources that balance cost with performance. The overall result is seamless deployment, graphical interface access, scaling of distributed simulations, and post processing for large datasets in cloud environments. For a consistent end-to-end digital engineering workflow, Azure Virtual Desktop provided a seamless transition to the cloud by delivering the same user experience as on a desktop.
"The size and complexity of our multiphysics silicon solutions makes the process of simulating all possible parameter combinations challenging," said Stefan Rusu, head of silicon photonics system design at TSMC. "This latest collaboration again highlights that Ansys effectively harnesses the latest cloud infrastructure and techniques to deliver powerful, predictively accurate solutions that produce results in a fraction of the time."
Deploying Lumerical FDTD on the cloud enables designers to swiftly identify optimal chip designs that account for the multiphysics challenges related to combining photonic circuits with electronic circuits.
"Ansys has developed unique capabilities that can be closely coupled with our leading multiphysics simulation engines for photonics," said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. "Collaborating with TSMC and Microsoft has accelerated technologies that address high-speed optical data transfer, which is one of the most important chip design challenges today."
Shelly Blackburn, CVP of Azure Infrastructure, Digital and App Innovation at Microsoft, highlighted the benefits of the ongoing collaboration with Ansys and TSMC. "Our collaboration is a significant advantage for users seeking the combined power of HPC and AI, using the flexibility of cloud solutions while maintaining the familiar on-premises experience," she said. "By working together, we aim to address the complexities of large-scale designs essential for high-quality semiconductor products. Utilizing the power and scalability of Microsoft Azure's cloud computing is a key strategy in overcoming these challenges."
/ About Ansys
Our Mission: Powering Innovation that Drives Human Advancement™.
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in
ANSS–T
/ Contacts
Media | Mary Kate Joyce |
724.820.4368 | |
marykate.joyce@ansys.com | |
Investors | Kelsey DeBriyn |
724.820.3927 | |
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SOURCE Ansys
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