Ansys Joins Intel Foundry's United States Military, Aerospace, and Government (USMAG) Alliance
Ansys (NASDAQ: ANSS) has joined the Intel Foundry Accelerator United States Military, Aerospace, and Government (USMAG) Alliance to develop secure design methodologies and workflows for national security applications.
This collaboration enhances Ansys' Redhawk-SC platform with advanced thermal management capabilities for Intel's 18A silicon process, featuring PowerVia technology. Ansys' thermal solver technology aims to improve performance and reliability, catering to high-performance computing, AI, and graphics processor chips. Additionally, both companies are working on signoff verification for thermal and power integrity and mechanical reliability of Intel's embedded multi-die interconnect bridge (EMIB).
John Lee, VP at Ansys, emphasized that this collaboration addresses multiphysics challenges and stringent thermal, power, and reliability requirements for military and aerospace applications. Intel Foundry's Suk Lee welcomed Ansys as a valuable partner for providing robust design and simulation capabilities to the USMAG community.
- Ansys joins Intel Foundry USMAG Alliance, strengthening its position in the national security sector.
- Enhanced thermal management capabilities of Ansys Redhawk-SC for Intel 18A process.
- Collaboration aims to improve performance and reliability for HPC, AI, and graphics chips.
- Ansys' proven thermal solver technology offers predictive accuracy and full-system analysis.
- None.
Insights
Ansys' collaboration with Intel Foundry through the United States Military, Aerospace and Government (USMAG) Alliance is a significant development for the company, particularly from a financial perspective. This partnership could potentially increase Ansys' revenue streams by positioning it as a preferred simulation tool for U.S. national security applications. Investors should note the strategic importance of the defense and aerospace sectors, often yielding long-term, stable contracts compared to commercial markets.
The development of thermal management technology for the Intel 18A silicon process is noteworthy. This could lead to improved chip performance, meeting the high demands of HPC, AI and graphics processing, which are critical in security applications. The enhancement of Ansys Redhawk-SC™ to support Intel's advanced technology signals a commitment to cutting-edge R&D, which might drive market share growth against competitors.
However, investors should also consider potential risks such as the dependency on Intel Foundry's success in the market and the uncertainties of defense contracts.
The technical collaboration between Ansys and Intel Foundry is a critical step forward in addressing thermal management challenges associated with high-performance computing and AI applications. The Intel 18A process, featuring PowerVia technology, presents new opportunities and challenges for effective cooling and power delivery. Ansys' role in optimizing simulation tools for these advanced processes could significantly enhance chip reliability and performance.
From a technology standpoint, the integration of Ansys' Redhawk-SC™ platform with Intel's design methodologies introduces a robust solution for managing thermal and power integrity, especially in high-stakes environments like military and aerospace. For retail investors, understanding the importance of thermal management in semiconductor performance can provide insights into why this collaboration is strategically valuable.
Additionally, the focus on signoff verification for Intel's multi-die interconnect bridge (EMIB) technology underscores the importance of ensuring mechanical reliability in advanced packaging solutions. This partnership leverages Ansys' expertise in multiphysics simulation, which is important for developing reliable, high-performance semiconductor solutions.
Ansys is developing thermal management technology for the Intel 18A silicon process to enable HPC, graphics, and AI products supporting
/ Key Highlights
- Ansys joins the Intel Foundry Accelerator United States Military, Aerospace, and Government (USMAG) Alliance to deliver secure design methodologies and flows for
U.S. security applications - Ansys deepens its technical collaboration with Intel Foundry – enhancing Ansys Redhawk-SC™ to deliver a comprehensive thermal management flow for the Intel 18A advanced process technology to enable reliable, high-performance chip design
Ansys is deepening its technical collaboration with Intel Foundry by developing an enhanced thermal management flow with the RedHawk-SC platform, supporting the Intel 18A silicon manufacturing process. Intel 18A features revolutionary backside power delivery technology, PowerVia, that comes with new challenges for effectively cooling circuits, especially for high-performance computing, artificial intelligence (AI), and graphics processor chips. Ansys' mature and well-proven thermal solver technology provides predictive accuracy and the capacity for full-system analysis, resulting in better performance and greater design flexibility.
In addition, Intel Foundry and Ansys are collaborating to deliver signoff verification of thermal and power integrity and mechanical reliability of Intel's embedded multi-die interconnect bridge (EMIB) assembly technology. These capabilities span use-cases ranging from advanced silicon process nodes to various heterogenous packaging platforms.
"Ansys has worked with Intel Foundry to address complex multiphysics challenges and meet stringent thermal, power, mechanical, and reliability requirements," said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. "Ansys' deep background in physics simulation addresses the very advanced requirements of military and aerospace products. Thanks to the collaboration between our companies, we can deliver greater value to our mutual customers."
"Intel Foundry welcomes Ansys as a valuable addition to our USMAG Alliance," said Suk Lee, vice president & general manager, ecosystem technology office, Intel Foundry. "With Ansys, we now have an ecosystem of partners that can provide robust design and simulation capabilities to the MAG community for securely developing semiconductor solutions with Intel's leading-edge process capabilities."
/ About Ansys
Our Mission: Powering Innovation that Drives Human Advancement™
When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.
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/ Contacts
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Investors | Kelsey DeBriyn |
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