Aehr Test Systems Secures Initial $10 Million in Orders for Production Wafer-Level Burn-In of Advanced AI Processors
Aehr Test Systems (NASDAQ:AEHR) has secured initial orders worth over $10 million for multiple FOX-XP™ wafer level test and burn-in systems and WaferPak™ Contactors from its first AI customer. The first system will ship immediately, with all shipments completing within 90 days by February 28, 2025.
The breakthrough order marks Aehr's expansion into AI processor testing, offering wafer-level burn-in solutions that can deliver thousands of watts of power per wafer at temperatures up to 150 degrees Celsius. The technology enables cost-effective testing before device integration, improving yields and efficiency in semiconductor manufacturing.
Aehr becomes the only company globally offering both wafer-level and package-level turnkey test and burn-in solutions for AI processors.
Aehr Test Systems (NASDAQ:AEHR) ha ricevuto ordini iniziali per oltre 10 milioni di dollari per diversi sistemi di test e burn-in wafer level FOX-XP™ e contattori WaferPak™ dal suo primo cliente nel settore dell'IA. Il primo sistema sarà spedito immediatamente, con tutte le spedizioni completate entro 90 giorni, entro il 28 febbraio 2025.
L'ordine innovativo segna l'espansione di Aehr nel testing dei processori IA, offrendo soluzioni di burn-in a livello wafer in grado di fornire migliaia di watt di potenza per wafer a temperature fino a 150 gradi Celsius. Questa tecnologia consente test economici prima dell'integrazione dei dispositivi, migliorando le rese e l'efficienza nella produzione di semiconduttori.
Aehr diventa l'unica azienda a livello globale a offrire soluzioni di test e burn-in chiavi in mano sia a livello wafer che a livello pacchetto per i processori IA.
Aehr Test Systems (NASDAQ:AEHR) ha asegurado pedidos iniciales por un valor superior a 10 millones de dólares para múltiples sistemas de prueba y burn-in a nivel de wafer FOX-XP™ y Contactores WaferPak™ de su primer cliente de IA. El primer sistema se enviará de inmediato, y todos los envíos se completarán dentro de 90 días, hasta el 28 de febrero de 2025.
Este pedido innovador marca la expansión de Aehr en las pruebas de procesadores de IA, ofreciendo soluciones de burn-in a nivel de wafer que pueden entregar miles de vatios de potencia por wafer a temperaturas de hasta 150 grados Celsius. La tecnología permite pruebas rentables antes de la integración de dispositivos, mejorando los rendimientos y la eficiencia en la fabricación de semiconductores.
Aehr se convierte en la única empresa en el mundo que ofrece soluciones de prueba y burn-in llave en mano tanto a nivel de wafer como a nivel de paquete para procesadores de IA.
Aehr Test Systems (NASDAQ:AEHR)는 첫 번째 AI 고객으로부터 여러 대의 FOX-XP™ 웨이퍼 수준 테스트 및 번인 시스템과 WaferPak™ 컨택터에 대해 1천만 달러 이상의 초기 주문을 확보했습니다. 첫 번째 시스템은 즉시 배송되며, 모든 배송은 2025년 2월 28일까지 90일 이내에 완료됩니다.
이번 혁신적인 주문은 Aehr이 AI 프로세서 테스트로 확장하는 것을 의미하며, 150도 섭씨까지의 온도에서 웨이퍼당 수천 와트의 전력을 제공할 수 있는 웨이퍼 수준의 번인 솔루션을 제공합니다. 이 기술은 장치 통합 전의 비용 효율적인 테스트를 가능하게 하여 반도체 제조의 수율 및 효율성을 개선합니다.
Aehr은 AI 프로세서에 대해 웨이퍼 수준과 패키지 수준의 키오스크 테스트 및 번인 솔루션을 모두 제공하는 전 세계 유일의 회사가 됩니다.
Aehr Test Systems (NASDAQ:AEHR) a sécurisé des commandes initiales d'une valeur supérieure à 10 millions de dollars pour plusieurs systèmes de test et de burn-in au niveau wafer FOX-XP™ et des contacteurs WaferPak™ de son premier client AI. Le premier système sera expédié immédiatement, avec toutes les expéditions finalisées dans les 90 jours, d'ici le 28 février 2025.
Cette commande novatrice marque l'expansion d'Aehr dans les tests de processeurs IA, offrant des solutions de burn-in à niveau wafer capables de fournir des milliers de watts de puissance par wafer à des températures allant jusqu'à 150 degrés Celsius. La technologie permet des tests économiques avant l'intégration des dispositifs, améliorant les rendements et l'efficacité de la fabrication de semi-conducteurs.
Aehr devient la seule entreprise au monde à proposer des solutions de test et de burn-in clé en main à la fois à niveau wafer et à niveau paquet pour les processeurs IA.
Aehr Test Systems (NASDAQ:AEHR) hat erste Bestellungen im Wert von über 10 Millionen Dollar für mehrere FOX-XP™ Wafer-Level-Test- und Burn-in-Systeme sowie WaferPak™ Kontaktoren von seinem ersten KI-Kunden erhalten. Das erste System wird sofort versandt, alle Lieferungen werden innerhalb von 90 Tagen bis zum 28. Februar 2025 abgeschlossen sein.
Die bahnbrechende Bestellung markiert die Expansion von Aehr in den Test von KI-Prozessoren und bietet Wafer-Level-Burn-in-Lösungen, die Tausende von Watt Leistung pro Wafer bei Temperaturen von bis zu 150 Grad Celsius liefern können. Die Technologie ermöglicht kosteneffiziente Tests vor der Geräteintegration, was die Ausbeute und Effizienz in der Halbleiterproduktion verbessert.
Aehr wird das einzige Unternehmen weltweit, das sowohl Wafer-Level- als auch Package-Level-Schlüsselfertige Test- und Burn-in-Lösungen für KI-Prozessoren anbietet.
- Secured first AI customer order worth over $10 million
- All systems to be delivered within current fiscal quarter (by Feb 28, 2025)
- Unique market position as only provider of both wafer-level and package-level testing solutions
- Technology enables significant cost savings and yield improvements in AI processor manufacturing
- Delayed order receipt missed previous fiscal quarter ending November 30, 2024
Insights
This
The cost-efficiency advantage of wafer-level testing before final assembly presents a compelling value proposition that could accelerate market adoption. With AI chip manufacturers facing increasing pressure to improve yields and reduce costs, Aehr's solution addresses critical industry pain points. This could drive significant market expansion beyond their traditional power semiconductor focus.
The technical breakthrough here is substantial - Aehr's FOX-XP system's ability to deliver thousands of watts of power per wafer while maintaining precise temperature control up to 150 degrees Celsius is unprecedented for wafer-level testing. This capability is important for AI processors, which require extensive burn-in testing due to their high-power consumption and thermal characteristics. The system's ability to perform early life failure detection at the wafer level, rather than after expensive packaging and assembly, represents a significant advancement in semiconductor manufacturing efficiency.
The proprietary WaferPak technology's capacity to handle thousands of amps while maintaining signal integrity for functional testing sets a new industry standard. This technological edge in both wafer-level and package-level testing positions Aehr uniquely in the rapidly growing AI chip testing market.
FREMONT, CA / ACCESSWIRE / December 16, 2024 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced a significant milestone with the receipt of its first artificial intelligence (AI) customer order for multiple high-power FOX-XP™ wafer level test and burn-in systems and multiple sets of Aehr Test proprietary WaferPakTM Contactors. These initial volume production orders are valued at over
Gayn Erickson, President and CEO of Aehr Test Systems, commented, "We are excited that after successfully proving the wafer level test performance and throughput on our systems at our headquarters in Silicon Valley California, this cutting-edge AI customer has chosen our new high-power FOX-XP solution for production wafer level test and burn-in of their AI processors. We were able to successfully demonstrate the FOX-XP production system to the customer and anticipated this order and first system shipment before the end of our fiscal quarter ended November 30, 2024. Instead, with the order received just now, the systems will all ship within this fiscal quarter ending February 28, 2025.
"This marks a technology and commercial breakthrough for Aehr as it significantly expands the market opportunities for our FOX-XP wafer level test and burn-in systems. This new AI customer recognizes the substantial advantages of conducting production test and burn-in at wafer level, before integration into the final product. This approach offers greater cost efficiency, improved yields, and scales significantly better in the semiconductor manufacturing process compared to the required burn-in testing later in the product manufacturing cycle.
"This latest turnkey solution from Aehr using our FOX-XP multi-wafer test and burn-in system with our proprietary WaferPak full wafer Contactors provides thousands of watts of power delivery and thermal control per wafer. It enables a first ever ability to do a cost-effective production test and burn-in of high-power devices such as AI accelerators at the wafer level with temperatures reaching up to 150 degrees Celsius. This process enables a significant cost saving and yield improvement with the detection and elimination of early life failures during the production process while the devices are still in wafer form, before they are assembled into modules or systems. Our proprietary WaferPaks are designed for high-power applications, providing precise voltage and currents to each device under test. They can deliver thousands of amps of current and cool thousands of watts per wafer while also transmitting the digital signals needed to assess the functionality of both good and bad devices.
"With this solution, we are now able to offer our customers the ability to do production wafer level burn-in of their AI processors and accelerators in addition to our offering of both reliability qualification and production burn-in at package part with our Sonoma ultra-high-power test and burn-in system that we are now shipping in volume to many manufacturers around the world. Aehr Test Systems is the only company in the world that can now offer both wafer level and package level turnkey test and burn-in solutions for these AI processors."
The FOX-XP and FOX-NP systems, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as artificial intelligence processors and accelerators, silicon carbide and gallium nitride power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge artificial intelligence processors and accelerators, silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for Artificial Intelligence (AI) semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turn-key provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at www.aehr.com.
Safe Harbor Statement
This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; the timing and extent to which the acquisition is accretive; the closing of the acquisition; and the growth of the markets referred to herein. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.
Contacts:
Aehr Test Systems
Vernon Rogers
EVP of Sales & Marketing
(510) 623-9400 x215
vrogers@aehr.com
MKR Investor Relations Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
aehr@mkr-group.com
SOURCE: Aehr Test Systems
View the original press release on accesswire.com
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