Aehr Receives Initial Order for FOX-XP DiePak® Carriers for Mobile Device Sensors with new Optical Output Monitoring and Power Regulation per DUT
Aehr Test Systems (NASDAQ: AEHR) announced a design win and initial order for multiple DiePak Carriers to test and burn-in 3D sensor modules for a major customer. This order marks an expansion of their test solutions and reflects increasing interest in Aehr's FOX systems. The FOX-XP system offers advanced testing capabilities, including precise temperature management and comprehensive device monitoring. The growing demand for reliable testing solutions in the semiconductor market positions Aehr to capitalize on new opportunities as the industry evolves.
- Received initial order for multiple DiePak Carriers for testing 3D sensor modules.
- Expanding deployment of test solutions with a major multinational customer.
- Increasing interest in FOX systems for complex sensor applications.
- None.
FREMONT, Calif., Nov. 05, 2020 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced a design win and an initial order for multiple DiePak® Carriers for test and burn-in of its lead customer’s next generation 3D sensor modules for mobile devices. The customer will use these Aehr proprietary DiePaks for production qualification, test, and burn-in of these devices prior to volume production orders for additional DiePaks forecasted for later in Aehr’s current fiscal year.
Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We are excited to receive this order for a new design that expands deployment of our test solutions to additional devices with this large multinational customer and to engage with them earlier in the design cycle of their next generation 3D sensor modules. We continue to work closely with them and have resources on site for both engineering and production deployment of our tools during COVID-19. Aehr is seeing an uptick in interest of our FOX systems and DiePaks for production test and burn-in of complex 2D and 3D sensors in multiple mobile applications and we continue to be optimistic about this market space.
“Our FOX-XP solution has many advanced technical capabilities needed for testing and burning-in these devices to meet the critical quality, reliability, and traceability requirements of this customer for their latest sensor modules. This high-power configuration of our FOX-XP system is available with up to nine individual Blades that can each test up to 1,024 devices per DiePak Carrier. In addition, the system is capable of heating or cooling devices using a proprietary design using thermal conductivity, which is much more accurate than thermal convection. It can manage up to 2 kW of thermal power and over 1000 amps per DiePak to ensure that each device’s desired junction temperature is maintained very accurately.”
Aehr’s FOX systems and full wafer and singulated die and module solutions are significantly differentiated from other solutions on the market and focused on providing
- Reading and writing individual digital identification IDs through I2C and SPI protocols across 1000s of devices
- Reading and logging both digital and analog temperatures per device throughout the test and burn-in process
- Automatic monitoring of current and voltage supplied against programmable limits (both high and low) and the ability to disable them in real time per DUT
- Controlling temperature of the device via a new feature that allows modulating the power delivered to the device via voltage, current, and pulse width modulation of voltages and currents on a per DUT basis
- Monitoring output power of VCSEL arrays, individual VCSELs, lasers, and LEDs via internal photo diodes as well as using per device external photo detection sensors in the DiePaks
- Controlling the device test and burn-in temperatures via conduction (direct contact with each device) up to 150ºC
The FOX-XP system, available with multiple WaferPak™ Contactors (full wafer test) or multiple DiePak Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, optical modules, Silicon Carbide (SiC) and other leading-edge ICs in either wafer formfactor, before they are assembled into single or multi-die stacked packages, or in singulated die or module formfactor.
About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has installed over 2,500 systems worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test. Aehr Test has developed and introduced several innovative products, including the ABTS™ and FOX-P™ families of test and burn-in systems and FOX WaferPak™ Aligner, FOX-XP WaferPak Contactor, FOX DiePak® Carrier and FOX DiePak Loader. The ABTS system is used in production and qualification testing of packaged parts for both lower power and higher power logic devices as well as all common types of memory devices. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems used for burn-in and functional test of complex devices, such as leading-edge memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices. The FOX-CP system is a new low-cost single-wafer compact test and reliability verification solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The WaferPak contactor contains a unique full wafer probe card capable of testing wafers up to 300mm that enables IC manufacturers to perform test and burn-in of full wafers on Aehr Test FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective final test and burn-in of both bare die and modules. For more information, please visit Aehr Test Systems’ website at www.aehr.com.
Safe Harbor Statement
This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr’s future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “could,” “intends,” “target,” “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” or “continue,” or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. These statements are based on information available to Aehr as of the date hereof, are based on current expectations, forecasts and assumptions, and actual results could differ materially from those stated or implied due to risks and uncertainties. Forward-looking statements in this press release include, but are not limited to, statements regarding Aehr’s expectations, beliefs, intentions or strategies regarding its products and its business, including statements regarding future market opportunities and conditions; Aehr’s product capabilities; expected product shipment dates; customer orders, commitments or product uses; and Aehr’s collaboration with its customers. These forward-looking statements include risks and uncertainties such as, without limitation, customer demand and acceptance of Aehr’s products, the ability of new products to meet customer needs or perform as described, as well as general market conditions and Aehr’s ability to execute on its business strategy. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s recent 10-K, 10-Q and other reports from time to time filed with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.
Contacts:
| Aehr Test Systems | MKR Investor Relations Inc. |
| Vernon Rogers | Todd Kehrli or Jim Byers |
| EVP Sales and Marketing | Analyst/Investor Contact |
| (510) 623-9400 x215 | (323) 468-2300 |
| vrogers@aehr.com | aehr@mkr-group.com |
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