ACM Research Enters 3D TSV Copper Plating Market with Ultra ECP 3d Platform

Rhea-AI Summary

ACM Research (NASDAQ: ACMR) unveiled its Ultra ECP 3d platform, designed for high-performance copper electroplating in 3D through-silicon via (TSV) applications. This new tool, featuring a 10-chamber design, promises void-free filling and enhanced throughput, contributing to lower costs and space efficiency in semiconductor manufacturing. The TSV market is projected to grow from $2.8 billion in 2019 to $4.0 billion by 2025, driven by trends like AI and device miniaturization. ACM has delivered its first unit to a client in China for qualification.

Positive

• Introduction of the Ultra ECP 3d platform enhances ACM's portfolio in the growing 3D TSV market.
• The new platform is expected to reduce costs and increase efficiency in semiconductor manufacturing.
• Projected growth of the TSV market indicates strong future demand for ACM's products.

Negative

• None.

Novel Pre-Wet Process and Pulse Partial Plating Achieve Conformally Filled, Void-Free, High Aspect Ratio Through-Silicon Vias

FREMONT, Calif., Nov. 19, 2020 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its Ultra ECP 3d platform for conformally filled 3D through-silicon via (TSV) applications. Leveraging ACM's Ultra ECP ap and map platforms, the Ultra ECP 3d platform delivers high-performance copper (Cu) electroplating for high aspect ratio (HAR) Cu applications, with no voids or seams.

According to industry research firm Mordor Intelligence, “The 3D TSV Devices Market was valued at USD $2.8 billion in 2019 and is expected to reach USD $4.0 billion by 2025, at a CAGR of 6.2% over the forecast period 2020 - 2025.”¹ Key markets for devices using TSVs include imaging, memory, MEMS and optoelectronics, among others.

“Many factors are driving the growth of the 3D TSV market, from device miniaturization to AI and edge computing,” said David Wang, CEO of ACM. “These applications demand more processing power in ever higher density packages and are leading to rapid industry adoption of TSV technologies.”

“In working with customers, we’ve successfully demonstrated our ability to fill HAR vias using the Ultra ECP 3d platform. In addition to delivering higher throughput with a stacked chamber design, the platform is designed to use fewer consumables, have a lower total cost of ownership, and save valuable fab floor space,” he added.

During bottom-up filling for HAR TSVs, the Cu electrolyte must be able to completely fill the vias without any trapped air bubbles when immersed in the plating solution. To accelerate this process, an integrated pre-wet step is used.

This advanced technology solution can deliver better yields, greater plating efficiency and higher throughput during the fabrication process. The Ultra ECP 3d platform for 3D TSV is a 10-chamber, 300mm tool with integrated pre-wet, Cu plating and post-clean modules in a footprint of only 2.20m × 3.60m × 2.90m (W/L/H).

ACM recently delivered its first Ultra ECP 3d tool to a key customer in China to begin formal qualification for its 3D TSV and 2.5D interposer Cu plating applications. For more information, please call the ACM regional company contact listed below.

About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes that are critical to advanced semiconductor device manufacturing as well as wafer-level packaging. The company is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield.

The ACM Research logo is a trademark of ACM Research, Inc. For convenience, this trademark appears in this press release without a ™ symbol, but that practice does not mean that ACM will not assert, to the fullest extent under applicable law, its rights to the trademark.

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1} https://www.mordorintelligence.com/industry-reports/3d-tsv-devices-market

Media Contact: Eric Lawson Kiterocket +1 480.276.9572 elawson@kiterocket.com	Company Contacts: U.S. Robert Metter ACM Research, Inc. +1-503-367-9753
	Europe Sally-Ann Henry ACM Research, Inc. +43 660 7769721
	China Xi Wang ACM Research (Shanghai), Inc. +86 21 50808868
	Korea YY Kim ACM Research (Korea), Inc. +821041415171
	Singapore Adrian Ong ACM Research (Singapore), Inc. +65 8813-1107
	Taiwan David Chang ACM Research (Taiwan), Inc. +866 921-999-884

FAQ

What is ACMR's Ultra ECP 3d platform?

The Ultra ECP 3d platform is a new tool for high-performance copper electroplating specifically designed for 3D through-silicon via applications.

How will the Ultra ECP 3d platform impact ACMR's business?

This platform aims to enhance efficiency and reduce costs in semiconductor manufacturing, potentially increasing ACMR's market share.

What is the market outlook for 3D TSV devices?

The 3D TSV devices market is expected to grow from $2.8 billion in 2019 to $4.0 billion by 2025, with a CAGR of 6.2%.

Where was the first Ultra ECP 3d tool delivered?

The first Ultra ECP 3d tool was delivered to a key customer in China for formal qualification in their 3D TSV and 2.5D interposer applications.